MBR120ESF, NRVB120ESF
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
This device uses the Schottky Barrier principle with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. Because of its small size,
it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
20 VOLTS
Features
•
•
•
•
•
•
•
•
Guardring for Stress Protection
Low Leakage
150°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Package Designed for Optimal Automated Board Assembly
ESD Rating:
♦ Human Body Model = 3B
♦ Machine Model = C
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics
•
•
•
•
•
•
Device Marking: L2E
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
SOD−123FL
CASE 498
MARKING DIAGRAM
L2EMG
G
L2E = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
MBR120ESFT1G
SOD−123FL
(Pb−Free)
3,000/
Tape & Reel **
NRVB120ESFT1G
SOD−123FL
(Pb−Free)
3,000/
Tape & Reel **
MBR120ESFT3G
SOD−123FL
(Pb−Free)
10,000 /
Tape & Reel ***
NRVB120ESFT3G
SOD−123FL
(Pb−Free)
10,000 /
Tape & Reel ***
Device
** 8 mm Tape, 7” Reel
*** 8 mm Tape, 13” Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 4
1
Publication Order Number:
MBR120ESFT1/D
MBR120ESF, NRVB120ESF
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TL = 140°C)
Symbol
Value
Unit
VRRM
VRWM
VR
20
V
IO
1.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TL = 125°C)
IFRM
Non−Repetitive Peak Surge Current
(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)
IFSM
Storage Temperature
Tstg
−65 to 150
°C
Operating Junction Temperature
TJ
−65 to 150
°C
dv/dt
10,000
V/ms
Voltage Rate of Change (Rated VR, TJ = 25°C)
2.0
40
A
A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Lead (Note 2)
Thermal Resistance − Junction−to−Ambient (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2)
Symbol
Value
Unit
Rtjl
Rtjl
Rtja
Rtja
26
21
325
82
°C/W
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm2).
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
VF
Maximum Instantaneous Forward Voltage (Note 3), See Figure 2
(IF = 0.1 A)
(IF = 1.0 A)
(IF = 2.0 A)
IR
Maximum Instantaneous Reverse Current (Note 3), See Figure 4
(VR = 20 V)
(VR = 10 V)
(VR = 5.0 V)
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
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2
Value
Unit
TJ = 25°C
TJ = 100°C
0.455
0.530
0.595
0.360
0.455
0.540
TJ = 25°C
TJ = 100°C
10
1.0
0.5
1600
500
300
V
mA
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
MBR120ESF, NRVB120ESF
10
TJ = 150°C
TJ = 25°C
TJ = 100°C
TJ = −40°C
1.0
0.1
0.4
0.2
0.6
0.8
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
TJ = 150°C
TJ = 100°C
1.0
TJ = 25°C
0.1
0.2
10E−3
1E−3
TJ = 150°C
100E−6
TJ = 100°C
1E−6
TJ = 25°C
0
5.0
10
20
15
1E−3
TJ = 100°C
10E−6
TJ = 25°C
1E−6
10E−9
0
5.0
10
15
20
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
dc
1.6
1.4
freq = 20 kHz
SQUARE
WAVE
1.2
1.0
Ipk/Io = p
0.8
Ipk/Io = 5
0.6
Ipk/Io = 10
0.4
Ipk/Io = 20
0.2
45
TJ = 150°C
100E−9
1.8
25
10E−3
100E−6
10E−6
100E−9
IO, AVERAGE FORWARD CURRENT (AMPS)
0.8
100E−3
PFO, AVERAGE DISSIPATION (WATTS)
IR, REVERSE CURRENT (AMPS)
100E−3
0
0.6
Figure 2. Maximum Forward Voltage
IR, MAXIMUM REVERSE CURRENT (AMPS)
Figure 1. Typical Forward Voltage
10E−9
0.4
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
(VOLTS)
65
85
105
125
145
165
0.7
0.6
Ipk/Io = p
0.5
dc
SQUARE
WAVE
Ipk/Io = 5
0.4
Ipk/Io = 10
0.3
Ipk/Io = 20
0.2
0.1
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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3
1.6
MBR120ESF, NRVB120ESF
155
1000
TJ, DERATED OPERATING
TEMPERATURE (°C)
C, CAPACITANCE (pF)
153
TJ = 25°C
100
151
RqJA = 25.6°C/W
149
130°C/W
147
145
235°C/W
143
141
324.9°C/W
139
400°C/W
137
10
0
2.0
4.0
6.0
8.0
10
12
14
16
18
135
20
0
2.0
4.0
6.0
8.0
10
12
14
16
18
VR, REVERSE VOLTAGE (VOLTS)
VR, DC REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
Figure 8. Typical Operating Temperature
Derating*
20
r(t), TRANSIENT THERMAL RESISTANCE
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating
TJ = TJmax − r(t)(Pf + Pr) where
TJ may be calculated from the equation:
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
1000
D = 0.5
100
0.2
0.1
0.05
10
P(pk)
0.01
t1
t2
1
DUTY CYCLE, D = t1/t2
SINGLE PULSE
0.1
0.000001 0.00001
0.0001
Test Type > Min Pad < Die Size 38x38 @ 75% mils
0.001
0.01
0.1
t1, TIME (sec)
Figure 9. Thermal Response
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4
1
qJA = 321.8 °C/W
10
100
1000
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
DATE 10 MAY 2013
SCALE 4:1
E
D
q
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
2
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
END VIEW
TOP VIEW
q
HE
SIDE VIEW
2X
b
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
(Note: Microdot may be in either location)
4.20
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
RECOMMENDED
SOLDERING FOOTPRINT*
1.22
MILLIMETERS
NOM
MAX
0.95
0.98
0.05
0.10
0.90
1.10
0.15
0.20
1.65
1.80
2.70
2.90
0.75
0.95
3.60
3.80
8°
−
XXXMG
G
L
BOTTOM VIEW
2X
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
GENERIC
MARKING DIAGRAM*
c
2X
A1
DIM
A
A1
b
c
D
E
L
HE
q
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2X
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
1.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON11184D
SOD−123FL
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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