P6P82PS01AG-08CR

P6P82PS01A Peak EMI Reduction Device for Power Systems Functional Description P6P82PS01A is a versatile, 3.3 V Peak EMI reduction device. P6P82PS01A can be interfaced/connected to the PWM frequency controlling node (either RT−CT or RT) to modulate the switching frequency of the PWM controller which in turn reduces the Peak EMI of the power system. P6P82PS01A has an SSEXTR pin to select different frequency deviations depending upon the value of an external resistor connected between SSEXTR and GND. MRSEL selects an external or an internal analog Modulation Rate clock. When MRSEL is pulled LOW, different moulation rates can be selected depending upon the value of an external resistor connected between MREXTR and GND. When MRSEL pin is pulled HIGH, an external Modulation clock can be fed through MREXTR pin. Refer Modulation Rate Selection table. P6P82PS01A operates from a 3.3 V $ 0.3 V supply, and is available in an 8 pin WDFN(2 mm x 2 mm) package. http://onsemi.com MARKING DIAGRAM WDFN8 CASE 511AQ GN MG G GN = Specific Device Code M = Date Code G = Pb−Free Device PIN CONFIGURATION General Features • • • • • • • • • • 1 1 Provides Peak EMI Reduction Companion IC for RT−CT or a RT based PWM Controllers Supports PWM Switching Frequency up to 5 MHz Analog Deviation Selection External or Internal Analog ModRate Selection Option Supply Voltage: 3.3 V $ 0.3 V Dynamic Supply Current less than 5 mA @ 1 MHz Operating Temperature Range: 0°C to +70°C 8 pin , WDFN(2 mm x 2 mm) Package These Devices are Pb−Free and are RoHS Compliant RT−CT/RT 1 MREXTR 2 NC 3 GND 4 8 VDD 7 MRSEL 6 NC 5 SSEXTR ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Application • P6P82PS01A is targeted for AC−DC, and DC−DC power systems. VDD RT−CT/RT Frequency Modulator MREXTR Modulation Rate and Profile Generator GND Modulation Depth Control SSEXTR MRSEL Figure 1. Block Diagram © Semiconductor Components Industries, LLC, 2011 August, 2011 − Rev. 1 1 Publication Order Number: P6P82PS01A/D P6P82PS01A Table 1. PIN DESCRIPTION Pin # Pin Name Type 1 RT−CT/RT Input/Output 2 MREXTR Input 3 NC − 4 GND Power 5 SSEXTR Input 6 NC − 7 MRSEL Input 8 VDD Power Description Input/Output pin connected to RT−CT / RT pin of PWM controller Selects Analog Modulation Rate through external resistor to GND when MRSEL pin pulled LOW. When MRSEL pin pulled HIGH, an external Modulation clock can be fed in to this pin. Has NO default state. Not Connect Ground Analog Deviation Selection through external resistor to GND. Not Connect Modulation Rate Select. Selects Analog modulation clock when pulled LOW. Selects an External Modulation Clock fed through MREXTR pin, When pulled HIGH. Has an internal pull−down resistor. 3.3V supply Voltage. Table 2. MODULATION RATE SELECTION TABLE MRSEL MREXTR Modulation Rate 1 External MR Clock External MR Clock / 96 0 Connect a Resistor from MREXTR to GND* Analog *Refer to Figure 2. MREXTR vs. MR graph for different Analog Modulation Rate(MR). Table 3. ABSOLUTE MAXIMUM RATING Symbol Parameter Rating Unit VDD Voltage on any input pin with respect to Ground −0.5 to +4.6 V TSTG Storage temperature −65 to +125 °C °C Ts Max. Soldering Temperature (10 sec) 260 TJ Junction Temperature 150 °C 2 KV TDV Static Discharge Voltage (As per JEDEC STD22− A114−B) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 4. OPERATING CONDITIONS Symbol VDD Parameter Min Max Unit Supply Voltage 3 3.6 V 0 TA Operating Temperature 70 °C FS PWM Switching Frequency 5 MHz CIN Input Capacitance 7 pF Table 5. DC AND AC ELECTRICAL CHARACTERISTICS Symbol Parameter VDD Supply Voltage VIH Input HIGH Voltage VIL Input LOW Voltage IIH Input HIGH Current IIL Input LOW Current IDD Dynamic Supply Current FIN Switching Frequency Test Conditions Min Typ Max Unit 3.0 3.3 3.6 V 0.65*VDD V VIN = VDD VIN = 0 V @1 MHz switching frequency 0.35*VDD V 50 mA 50 5 5 http://onsemi.com 2 mA mA MHz P6P82PS01A CHARTS 60 25 50 DEVIATION ($%) 20 MR (kHz) 40 30 20 100 200 300 400 500 600 700 0 300 800 900 1000 600 700 800 900 Figure 2. MREXTR vs. MR Figure 3. Deviation vs. SSEXTR (@ Switching Frequency = 280 kHz, MR = 25 kHz) 25 20 20 15 10 5 NOTE: 500 RESISTOR (kW) 25 0 50 400 RESISTOR (kW) DEVIATION ($%) DEVIATION ($%) 10 5 10 0 0 15 1000 15 10 5 100 150 200 250 300 350 400 450 0 500 0 50 100 150 200 250 300 RESISTOR (kW) RESISTOR (kW) Figure 4. Deviation vs. SSEXTR (@ Switching Frequency = 1 MHz, MR = 25 kHz) Figure 5. Deviation vs. SSEXTR (@ Switching Frequency = 1.6 MHz, MR = 25 kHz) Device−to−Device variation of Deviation is $ 10% http://onsemi.com 3 350 P6P82PS01A PWM Controller P6P82PS01A VDD VREF C External MR Clock Analog Modulation Rate Control 0.1mF 8 RT VDD 2 MREXTR VDD RT−CT/RT VDD R2 External/Internal MR Selection 1 RT/CT P6P82PS01A CT SSEXTR 7 MRSEL PWM Controller 5 GND 4 VDDP Analog Deviation Control R1 Note: MRSEL (Pin#7): Connect to VDD or GND Refer to Pin Description table for Functionality details Figure 6. Typical Application Schematic ORDERING INFORMATION Ordering Code Marking Temperature Package Type Shipping† P6P82PS01AG−08CR GN 0°C to +70°C 8−pin (2 mm x 2 mm) WDFN (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb−Free. http://onsemi.com 4 P6P82PS01A PACKAGE DIMENSIONS WDFN8 2x2, 0.5P CASE 511AQ−01 ISSUE A D PIN ONE REFERENCE 2X A B L1 ÍÍÍ ÍÍÍ ÍÍÍ DETAIL A E OPTIONAL CONSTRUCTIONS 0.10 C 2X 0.10 C ÉÉ ÉÉ TOP VIEW EXPOSED Cu A3 DETAIL B 0.05 C 0.05 C MOLD CMPD OPTIONAL CONSTRUCTION C MILLIMETERS MIN MAX 0.80 0.70 0.05 0.00 0.20 REF 0.20 0.30 2.00 BSC 2.00 BSC 0.50 BSC 0.50 0.60 --0.15 RECOMMENDED SOLDERING FOOTPRINT* A1 SIDE VIEW DIM A A1 A3 b D E e L L1 DETAIL B A 8X SEATING PLANE 7X 0.78 PACKAGE OUTLINE DETAIL A 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL. L L 8X 4 L 2.30 0.88 8 5 e/2 e 8X b 0.10 C A 0.05 C 8X 1 0.35 B 0.50 PITCH DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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