SZPACDN042Y3R

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Other names and brands may be claimed as the property of others. PACDN042 ESD Protection Diode Low Clamping Voltage Product Description The PACDN042/43/44/45/46 family of surge protection arrays provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The PACDN042/43/44/45/46 devices safely dissipate ESD strikes, exceeding the IEC 61000−4−2 International Standard, Level 4 (±8 kV contact discharge). All pins are rated to withstand ±20 kV ESD pulses using the IEC 61000−4−2 contact discharge method. Using the MIL−STD−883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected from contact discharges of greater than ±30 kV. Features • Two, Three, Four, Five, or Six surge protection • Compact SMT Package Saves Board Space and Facilitates Layout in www.onsemi.com SOT−23−3 CASE 318 SOT−23−5 CASE 527AH SOT−23−6 CASE 527AJ SOT−143 CASE 527AF SC70−3 CASE 419AB CS70−5 CASE 419AC SC70−6 CASE 419AD TSSOP8 CASE 948AL MSOP8 CASE 846AB Space−Critical Applications • In−System ESD Protection to ±20 kV Contact Discharge, per the • IEC 61000−4−2 International Standard These Devices are Pb−Free and are RoHS Compliant Applications • ESD Protection of PC Ports, Including USB Ports, Serial Ports, • MARKING DIAGRAM Parallel Ports, IEEE1394 Ports, Docking Ports, Proprietary Ports, etc. Protection of Interface Ports or IC Pins which are Exposed to High ESD Levels XXX MG G 1 XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION (see the last page of this document) © Semiconductor Components Industries, LLC, 2011 November, 2017 − Rev. 8 1 Publication Order Number: PACDN042/D PACDN042 ELECTRICAL SCHEMATIC PACDN042 GND 3 1 PACDN043 2 4 3 8 1 GND 2 1 GND SOT23−3 SC70−3 SOT−143 PACDN044Y PACDN045 5 1 2 GND SOT23−5 SC70−5 PACDN044T GND GND 6 5 7 3 GND TSSOP−8 4 2 PACDN046 4 6 5 4 3 1 2 GND SOT23−6 SC70−6 3 GND 8 1 GND 7 6 5 2 3 4 MSOP−8 PACKAGE / PINOUT DIAGRAMS Top View Cathode 1 Cathode 2 Cathode 3 1 Cathode 2 GND 2 4 Cathode 3 Cathode 3−Pin SOT23 3−Pin SC70 4−Pin SOT−143 Top View Top View Top View 1 Cathode 3 Cathode 4 Cathode Cathode 1 GND 2 Cathode 3 5 Cathode GND Cathode D54 2 5 D054 GND GND 4 Cathode Cathode 1 8 GND 4 GND 5 5−Pin SC70 8−Pin TSSOP Top View Top View Top View 3 Cathode Cathode 1 5 Cathode GND 2 Cathode Cathode 4 6−Pin SOT23 3 6 Cathode 5 Cathode 4 Cathode 6−Pin SC70 1 8 GND Cathode 2 7 Cathode Cathode 3 6 Cathode Cathode 4 5 Cathode 8−Pin MSOP Note: SOT23, SC70, SOT−143, TSSOP, and MSOP Packages may differ in size. These drawings are not to scale. www.onsemi.com 2 Cathode GND D056 2 6 D55/D56 GND D055 1 Cathode 2 PAC 7 DN054T 3 6 5−Pin SOT23 Cathode Cathode GND GND D053 Cathode 3 Top View 1 D52 052 Cathode Top View PACDN042 Table 1. PIN DESCRIPTIONS Pins Name (Refer to Package Outline Drawings) Cathode (Refer to Package Outline Drawings) GND Description The cathode of the respective surge protection diode, which should be connected to the node requiring transient voltage protection. The anode of the surge protection diodes. SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range Package Power Dissipation SC70 SOT23−3, SOT23−5, SOT23−6, SOT−143 TSSOP, MSOP Rating Units −65 to +150 °C W 0.2 0.225 0.5 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS Symbol C VRSO Parameter Conditions Min Max 30 Units Capacitance TA = 25°C, 2.5 VDC, 1 MHz Reverse Stand−off Voltage IR = 10 mA, TA = 25°C 5.5 V IR = 1 mA, TA = 25°C 6.1 V ILEAK Leakage Current VIN = 5.0 VDC, TA = 25°C VSIG Small Signal Clamp Voltage Positive Clamp Negative Clamp I = 10 mA, TA = 25°C I = −10 mA, TA = 25°C 6.2 −0.4 VESD ESD Withstand Voltage Human Body Model, MIL−STD−883, Method 3015 Contact Discharge per IEC 61000−4−2 Standard (Note 1) ±30 (Note 1) ±20 RD Typ Diode Dynamic Resistance Forward Conduction Reverse Conduction pF 1 100 6.8 −0.8 8 −1.2 nA V kV 1.0 1.4 W Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. ESD voltage applied between channel pins & ground, one pin at a time; all other channel pins open; all GND pins grounded. www.onsemi.com 3 PACDN042 PERFORMANCE INFORMATION Diode Capacitance Typical diode capacitance with respect to positive cathode voltage (reverse voltage across the diode) is given in Diode Capacitance vs. Reverse Voltage. Figure 1. Diode Capacitance vs. Reverse Voltage Typical High Current Diode Characteristics Measurements are made in pulse mode with a nominal pulse width of 0.7 mS. Figure 2. Typical Input VI Characteristics (Pulse−mode measurements, pulse width = 0.7 mS nominal) www.onsemi.com 4 PACDN042 PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AR D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 0.25 3 E 1 2 T HE DIM A A1 b c D E e L L1 HE T L 3X b L1 VIEW C e TOP VIEW A A1 SIDE VIEW c SEE VIEW C MIN 0.89 0.01 0.37 0.08 2.80 1.20 1.78 0.30 0.35 2.10 0° MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.14 0.20 2.90 3.04 1.30 1.40 1.90 2.04 0.43 0.55 0.54 0.69 2.40 2.64 −−− 10 ° END VIEW RECOMMENDED SOLDERING FOOTPRINT* 3X 2.90 3X 0.90 0.95 PITCH 0.80 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 MIN 0.035 0.000 0.015 0.003 0.110 0.047 0.070 0.012 0.014 0.083 0° INCHES NOM 0.039 0.002 0.017 0.006 0.114 0.051 0.075 0.017 0.021 0.094 −−− MAX 0.044 0.004 0.020 0.008 0.120 0.055 0.080 0.022 0.027 0.104 10° PACDN042 PACKAGE DIMENSIONS SOT−23, 5 Lead CASE 527AH ISSUE O D E1 SYMBOL MIN A 0.90 A1 0.00 A2 0.90 b 0.30 c 0.08 E NOM 1.45 0.15 1.15 0.22 D 2.90 BSC E 2.80 BSC 1.60 BSC e 0.95 BSC L 0.45 0.30 L1 PIN #1 IDENTIFICATION 1.30 0.50 E1 e MAX 0.60 0.60 REF L2 0.25 REF θ 0° 4° 8° θ1 5° 10° 15° θ2 5° 10° 15° TOP VIEW θ1 A2 A θ b θ2 L1 A1 SIDE VIEW L2 L END VIEW Notes: (1) All dimensions in millimeters. Angles in degrees. (2) Complies with JEDEC standard MO-178. www.onsemi.com 6 c PACDN042 PACKAGE DIMENSIONS SOT−23, 6 Lead CASE 527AJ ISSUE B D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DATUM C IS THE SEATING PLANE. B 6 5 4 1 2 3 E E1 GAGE PLANE 6X e TOP VIEW L2 b 0.20 SEATING PLANE L M C A S B S DETAIL A A2 c A 6X 0.10 C A1 SIDE VIEW C SEATING PLANE DETAIL A END VIEW RECOMMENDED SOLDERING FOOTPRINT* 3.30 6X 0.85 6X 0.56 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 DIM A A1 A2 b c D E E1 e L L2 MILLIMETERS MIN MAX --1.45 0.00 0.15 0.90 1.30 0.20 0.50 0.08 0.26 2.70 3.00 2.50 3.10 1.30 1.80 0.95 BSC 0.20 0.60 0.25 BSC PACDN042 PACKAGE DIMENSIONS SOT−143, 4 Lead CASE 527AF ISSUE A SYMBOL MIN NOM MAX A 0.80 1.22 D A1 0.05 0.15 e A2 0.75 4 3 E1 1 E 2 e1 TOP VIEW b 0.30 0.50 0.76 0.89 c 0.08 0.20 D 2.80 E 2.10 E1 1.20 2.90 1.30 e 1.92 BSC 0.20 BSC 0.40 0.50 L1 0.54 REF L2 0.25 0° A1 L1 SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC TO-253. www.onsemi.com 8 0.60 c L b2 1.40 8° q A 3.04 2.64 e1 θ A2 1.07 b2 L b 0.90 L2 PACDN042 PACKAGE DIMENSIONS SC−70, 3 Lead, 1.25x2 CASE 419AB ISSUE O D SYMBOL MIN A 0.80 1.10 A1 0.00 0.10 A2 0.80 b 0.15 0.30 c 0.08 0.22 D 1.80 2.00 2.20 E 1.80 2.10 2.40 E1 1.15 1.25 1.35 E1 E e e TOP VIEW 0.90 MAX 1.00 0.65 BSC L e NOM 0.26 0.36 L1 0.42 REF L2 0.15 BSC 0.46 θ 0º 8º θ1 4º 10º q1 A2 A q q1 b L L1 A1 SIDE VIEW c END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. www.onsemi.com 9 L2 PACDN042 PACKAGE DIMENSIONS SC−88A (SC−70 5 Lead), 1.25x2 CASE 419AC ISSUE A SYMBOL D e e E1 E MIN MAX A 0.80 1.10 A1 0.00 0.10 A2 0.80 1.00 b 0.15 0.30 c 0.10 0.18 D 1.80 2.00 2.20 E 1.80 2.10 2.40 E1 1.15 1.25 1.35 0.65 BSC e L TOP VIEW NOM 0.26 0.36 L1 0.42 REF L2 0.15 BSC 0.46 θ 0º 8º θ1 4º 10º q1 A2 A q q1 b L L1 A1 SIDE VIEW c END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. www.onsemi.com 10 L2 PACDN042 PACKAGE DIMENSIONS SC−88 (SC−70 6 Lead), 1.25x2 CASE 419AD ISSUE A SYMBOL D e e E1 E MIN MAX A 0.80 1.10 A1 0.00 0.10 A2 0.80 1.00 b 0.15 0.30 c 0.10 0.18 D 1.80 2.00 2.20 E 1.80 2.10 2.40 E1 1.15 1.25 1.35 0.65 BSC e L TOP VIEW NOM 0.26 0.36 L1 0.42 REF L2 0.15 BSC 0.46 θ 0º 8º θ1 4º 10º q1 A2 A q q1 b L L1 A1 SIDE VIEW c END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. www.onsemi.com 11 L2 PACDN042 PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL ISSUE O b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.15 0.90 e 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 1.05 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. www.onsemi.com 12 PACDN042 PACKAGE DIMENSIONS MSOP8 CASE 846AB ISSUE O D HE PIN 1 ID −T− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. E e b 8 PL 0.08 (0.003) M T B S A S SEATING PLANE A 0.038 (0.0015) A1 MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 DIM A A1 b c D E e L HE MIN −− 0.05 0.25 0.13 2.90 2.90 L c SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 13 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 PACDN042 ORDERING INFORMATION Device ORDERING INFORMATION (cont’d) Package Shipping PACDN042Y3R SOT23−3 (Pb−Free) 3000/Tape & Reel PACDN044Y5R SOT23−5 (Pb−Free) PACDN045Y6R Device Package Shipping PACDN044YB5R SC70−5 (Pb−Free) 3000/Tape & Reel 3000/Tape & Reel PACDN045YB6R SC70−6 (Pb−Free) 3000/Tape & Reel SOT23−6 (Pb−Free) 3000/Tape & Reel PACDN045YB6R−R SC70−6 (Pb−Free) 3000/Tape & Reel PACDN043Y4R SOT−143 (Pb−Free) 3000/Tape & Reel PACDN044TR TSSOP8 (Pb−Free) 2500/Tape & Reel PACDN042YB3R SC70−3 (Pb−Free) 3000/Tape & Reel PACDN046MR MSOP8 (Pb−Free) 4000/Tape & Reel ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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