2:1 1.8V PCIe Gen1-2-3 Clock Mux with
Zo=100ohms
9DMV0141
DATASHEET
Description
Features
The 9DMV0141 is a member of IDT's SOC-Friendly 1.8V
Very-Low-Power (VLP) PCIe Gen1-2-3 family. It has
integrated output terminations providing Zo=100 for direct
connection to 100 transmission lines. The output has an
OE# pin for optimal system control and power management.
The part provides asynchronous or glitch-free switching
modes.
• LP-HCSL output w/integrated terminations; saves 4
•
•
•
•
•
Typical Application
2:1 PCIe Gen1-2-3 Clock Multiplexer
•
•
Output Features
• 1 -Low-Power (LP) HCSL DIF pair w/ZO=100
•
Key Specifications
resistors compared to standard HCSL output
1.8V operation; 12mW typical power consumption
Selectable asynchronous or glitch-free switching; allows
the mux to be selected at power up even if both inputs are
not running, then transition to glitch-free switching mode
Spread Spectrum Compatible; supports EMI reduction
OE# pins; support DIF power management
HCSL differential inputs; can be driven by common clock
sources
1MHz to 200MHz operating frequency
Configuration can be accomplished with strapping pins;
SMBus interface not required for device control
Space saving 16-pin 3x3mm VFQFPN; minimal board
space
• DIF additive cycle-to-cycle jitter 200 mV
DIF_IN input
4
2:1 1.8V PCIE GEN1-2-3 CLOCK MUX WITH ZO=100OHMS
4
AUGUST 15, 2017
9DMV0141 DATASHEET
Electrical Characteristics–Clock Input Parameters
TA = TAMB, Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
Input High Voltage - DIF_IN
VIHDIF
Input Low Voltage - DIF_IN
VILDIF
Input Common Mode
Voltage - DIF_IN
Input Amplitude - DIF_IN
Input Slew Rate - DIF_IN
Input Leakage Current
Input Duty Cycle
Input Jitter - Cycle to Cycle
1
CONDITIONS
Differential inputs
(single-ended measurement)
Differential inputs
(single-ended measurement)
MIN
TYP
MAX
UNITS NOTES
300
750
1150
mV
1
VSS - 300
0
300
mV
1
VCOM
Common Mode Input Voltage
200
725
mV
1
VSWING
dv/dt
IIN
dtin
J DIFIn
Peak to Peak value (VIHDIF - VILDIF)
Measured differentially
VIN = VDD , VIN = GND
Measurement from differential waveform
Differential Measurement
300
0.35
-5
45
0
1450
8
5
55
150
mV
V/ns
uA
%
ps
1
1,2
50
1
1
Guaranteed by design and characterization, not 100% tested in production.
Slew rate measured through +/-75mV window centered around differential zero
2
Electrical Characteristics–DIF Low-Power HCSL Outputs
TA = TAMB, Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS NOTES
Slew rate
Slew rate matching
Trf
ΔTrf
Scope averaging on
Slew rate matching, Scope averaging on
1.8
3.0
3
4.2
20
Voltage High
VHIGH
660
783
850
Voltage Low
VLOW
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope
averaging on)
-150
26
150
Max Voltage
Min Voltage
Vswing
Crossing Voltage (abs)
Crossing Voltage (var)
Vmax
Vmin
Vswing
Vcross_abs
Δ-Vcross
Measurement on single ended signal using
absolute value. (Scope averaging off)
Scope averaging off
Scope averaging off
Scope averaging off
790
9
1514
393
12
1150
-300
300
250
V/ns
%
1,2,3
1,2,4
mV
550
140
mV
mV
mV
mV
1,2
1,5
1,6
1
Guaranteed by design and characterization, not 100% tested in production.
Measured from differential waveform
2
3
Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around
differential 0V.
4
Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on
the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the
oscilloscope is to use for the edge rate calculations.
5
Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising
edge (i.e. Clock rising and Clock# falling).
6
The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross
absolute) allowed. The intent is to limit Vcross induced modulation by setting ∆-Vcross to be smaller than Vcross absolute.
Electrical Characteristics–Current Consumption
TA = TAMB, Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Supply Current
IDDOP
VDD rails, All outputs active @100MHz
7.9
12
mA
Disable Current
IDDDIS
VDD rails, All outputs disabled Low/Low
1.5
2.5
mA
NOTES
2
1
Guaranteed by design and characterization, not 100% tested in production.
2
Input clock stopped after outputs have parked Low/Low.
AUGUST 15, 2017
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2:1 1.8V PCIE GEN1-2-3 CLOCK MUX WITH ZO=100OHMS
9DMV0141 DATASHEET
Electrical Characteristics–Output Duty Cycle, Jitter, Skew and PLL Characteristics
TA = TAMB, Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
Duty Cycle Distortion
Skew, Input to Output
Jitter, Cycle to cycle
tDCD
Measured differentially, @100MHz
VT = 50%
Additive Jitter
-1
1853
-0.12
2409
0.1
1
3132
5
%
ps
ps
1,3
1
1,2
tpdBYP
tjcyc-cyc
1
Guaranteed by design and characterization, not 100% tested in production.
Measured from differential waveform
3
Duty cycle distortion is the difference in duty cycle between the output and the input clock.
2
Electrical Characteristics–Phase Jitter Parameters
TA = TAMB, Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
CONDITIONS
tjphPCIeG1
PCIe Gen 1
tjphPCIeG2
Additive Phase Jitter,
Bypass Mode
tjphPCIeG3
tjph125M0
tjph125M1
MIN
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
PCIe Gen 3
(PLL BW of 2-4 or 2-5MHz, CDR = 10MHz)
125MHz, 1.5MHz to 10MHz, -20dB/decade
rollover < 1.5MHz, -40db/decade rolloff > 10MHz
125MHz, 12KHz to 20MHz, -20dB/decade
rollover < 12kHz, -40db/decade rolloff > 20MHz
INDUSTRY
LIMIT
UNITS
TYP
MAX
1.3
5
N/A
0.1
0.3
N/A
0.1
0.2
N/A
0.065
0.1
N/A
284
350
N/A
420
500
N/A
Notes
ps (p-p) 1,2,3,5
ps
(rms)
ps
(rms)
ps
(rms)
fs
(rms)
fs
(rms)
1,2,3,4
,5
1,2,3,4
1,2,3,4
1,6
1,6
1
Guaranteed by design and characterization, not 100% tested in production.
See http://www.pcisig.com for complete specs
2
3
Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4
For RMS figures, additive jitter is calculated by solving the following equation: Additive jitter = SQRT[(total jitter)^2 - (input jitter)^2]
Driven by 9FGV0831 or equivalent
Driven by Rohde & Schwartz SMA100
5
6
2:1 1.8V PCIE GEN1-2-3 CLOCK MUX WITH ZO=100OHMS
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AUGUST 15, 2017
9DMV0141 DATASHEET
Marking Diagram
XXX
YYWW
41AIL
Notes:
1. “XXX” is the last 3 characters of the lot number.
2. “YYWW” is the last two digits of the year and week that the part was assembled.
3. Line 3: truncated part number
4. “L” denotes RoHS compliant package.
5. “I” denotes industrial temperature grade.
Thermal Characteristics
PARAMETER
SYMBOL
Thermal Resistance
θJC
θJb
θJA0
θJA1
θJA3
θJA5
TYP
VALUE
Junction to Case
66
Junction to Base
5
Junction to Air, still air
63
NLG16
Junction to Air, 1 m/s air flow
56
Junction to Air, 3 m/s air flow
51
Junction to Air, 5 m/s air flow
49
CONDITIONS
PKG
UNITS NOTES
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1
1
1
1
1
1
1
ePad soldered to board
AUGUST 15, 2017
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2:1 1.8V PCIE GEN1-2-3 CLOCK MUX WITH ZO=100OHMS
9DMV0141 DATASHEET
Package Outline and Dimensions (NLG16P2)
2:1 1.8V PCIE GEN1-2-3 CLOCK MUX WITH ZO=100OHMS
8
AUGUST 15, 2017
9DMV0141 DATASHEET
Package Outline and Dimensions (NLG16P2), cont.
AUGUST 15, 2017
9
2:1 1.8V PCIE GEN1-2-3 CLOCK MUX WITH ZO=100OHMS
Ordering Information
Part / Order Number Shipping Packaging
9DMV0141AKILF
Trays
9DMV0141AKILFT
Tape and Reel
Package
16-pin VFQFPN
16-pin VFQFPN
Temperature
-40 to +85° C
-40 to +85° C
“LF” to the suffix denotes Pb-Free configuration, RoHS compliant.
“A” is the device revision designator (will not correlate with the datasheet revision).
Revision History
Rev.
A
B
C
D
Initiator Issue Date Description
1. Update front page text and electrical tables with char data.
RDW
9/29/2014 2. Update pinout diagram with note about package paddle.
3. Move to final.
RDW
1/26/2015 Updated package drawing to the latest NLG16 document.
RDW
5/11/2007 Updated package drawing to the latest NLG16 document.
RDW
8/15/2017 Updated package drawing to NLG16P2 document.
Page #
Various
8
8,9
8,9
Corporate Headquarters
Sales
Tech Support
6024 Silver Creek Valley Road
San Jose, CA 95138 USA
www.IDT.com
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without
notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when
installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products
for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under
intellectual property rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably
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Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of
IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc.. All rights reserved.
9DMV0141 AUGUST 15, 2017
10
©2017 Integrated Device Technology, Inc.
16-VFQFPN Package Outline Drawing
3.0 x 3.0 x 0.9 mm, 0.5mm Pitch, 1.70 x 1.70 mm Epad
NL/NLG16P2, PSC-4169-02, Rev 05, Page 1
16-VFQFPN Package Outline Drawing
3.0 x 3.0 x 0.9 mm, 0.5mm Pitch, 1.70 x 1.70 mm Epad
NL/NLG16P2, PSC-4169-02, Rev 05, Page 2
Package Revision History
Description
Date Created
Rev No.
Oct 25, 2017
Rev 04 Remove Bookmak at Pdf Format & Update Thickness Tolerance
Jan 18, 2018
Rev 05
Change QFN to VFQFPN
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