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9FGU0241AKLFT

9FGU0241AKLFT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    VFQFN-24

  • 描述:

    VFQFPN 4.00X4.00X0.90 MM, 0.50MM

  • 数据手册
  • 价格&库存
9FGU0241AKLFT 数据手册
2 O/P 1.5V PCIe Gen1-2-3 Clock Generator w/Zo=100ohms 9FGU0241 DATASHEET Description Features/Benefits The 9FGU0241 is a member of IDT's 1.5V Ultra-Low-Power PCIe clock family with integrated output terminations providing Zo=100Ω. The device has 2 output enables for clock management, 2 different spread spectrum levels in addition to spread off and 2 selectable SMBus addresses. • Direct connection to 100ohm transmission lines; saves 16 • • • Recommended Application 1.5V PCIe Gen1-2-3 clock generator • Output Features • • 2 - 100MHz Low-Power (LP) HCSL DIF pairs w/Zo=100 • 1 - 1.5V LVCMOS REF output w/Wake-On-LAN (WOL) • support • Key Specifications • • • • • DIF cycle-to-cycle jitter = 0.8xVDDSMB 2 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 6 OCTOBER 18, 2016 9FGU0241 DATASHEET Electrical Characteristics–DIF Low-Power HCSL Outputs TA = TAMB; Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions PARAMETER SYMBOL Slew rate Trf Slew rate matching ΔTrf Voltage High VHIGH CONDITIONS MIN TYP Scope averaging on fast setting Scope averaging on slow setting Slew rate matching, Scope averaging on 1.2 0.8 2.4 1.7 9 3.6 2.5 20 600 750 850 Voltage Low VLOW Statistical measurement on single-ended signal using oscilloscope math function. (Scope averaging on) Max Voltage Min Voltage Vswing Crossing Voltage (abs) Crossing Voltage (var) Vmax Vmin Vswing Vcross_abs Δ-Vcross Measurement on single ended signal using absolute value. (Scope averaging off) Scope averaging off Scope averaging off Scope averaging off MAX UNITS NOTES V/ns V/ns % 1,2,3 1,2,3 1,2,4 7 mV -150 26 150 763 22 1448 390 11 1150 -300 300 250 550 140 7 mV mV mV mV 7 7 1,2,7 1,5,7 1,6,7 1 Guaranteed by design and characterization, not 100% tested in production. Measured from differential waveform 2 3 Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around differential 0V. 4 Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. 5 Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising edge (i.e. Clock rising and Clock# falling). 6 The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross absolute) allowed. The intent is to limit Vcross induced modulation by setting Δ-Vcross to be smaller than Vcross absolute. 7 At default SMBus amplitude settings. Electrical Characteristics–DIF Output Phase Jitter Parameter TA = TAMB; Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions PARAMETER SYMBOL CONDITIONS tjphPCIeG1 PCIe Gen 1 PCIe Gen 2 Lo Band 10kHz < f < 1.5MHz PCIe Gen 2 High Band 1.5MHz < f < Nyquist (50MHz) PCIe Gen 3 Common Clock Architecture (PLL BW of 2-4 or 2-5MHz, CDR = 10MHz) tjphPCIeG2 Phase Jitter, PLL Mode tjphPCIeG3 MIN tjphPCIeG3SRn PCIe Gen 3 Separate Reference No Spread (SRnS) S (PLL BW of 2-4 or 2-5MHz, CDR = 10MHz) TYP MAX 27.7 40 IND. LIMIT 86 1.0 1.3 3 1.9 2.2 3.1 0.4 0.6 1 0.4 0.6 0.7 UNITS Notes ps (p-p) ps (rms) ps (rms) ps (rms) 1,2,3,5 ps (rms) 1,2,3,5 1,2,3,5 1,2,3,5 1,2,3,5 1 Guaranteed by design and characterization, not 100% tested in production. See http://www.pcisig.com for complete specs 3 Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12. 4 Calculated from Intel-supplied Clock Jitter Tool 5 Applies to all differential outputs 2 OCTOBER 18, 2016 7 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 9FGU0241 DATASHEET Electrical Characteristics–REF TA = TAMB; Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions PARAMETER SYMBOL CONDITIONS MIN Long Accuracy ppm see Tperiod min-max values 25 MHz output Clock period Tperiod Rise/Fall Slew Rate trf1 Byte 3 = 1F, 20% to 80% of VDDREF 0.3 Byte 3 = 5F, 20% to 80% of VDDREF 0.5 Rise/Fall Slew Rate trf1 Byte 3 = 9F, 20% to 80% of VDDREF 0.77 Rise/Fall Slew Rate trf1 Byte 3 = DF, 20% to 80% of VDDREF 0.84 Rise/Fall Slew Rate trf1 Duty Cycle dt1X VT = VDD/2 V 45 0 TYP 0 40 0.7 1.0 1.3 1.4 47.1 MAX 1.1 1.6 1.9 2.0 55 UNITS ppm ns V/ns V/ns V/ns V/ns % Notes 1,2 2 1 1,3 1 1 1,4 Duty Cycle Distortion dtcd V T = VDD/2 V, when driven by XIN/CLKIN_25 pin 2.0 4 % 1,5 Jitter, cycle to cycle Noise floor Noise floor t jcyc-cyc tjdBc1k tjdBc10k VT = VDD/2 V 1kHz offset 10kHz offset to Nyquist 51.2 -126 -139 250 -105 -110 1,4 1,4 1,4 Jitter, phase tjphREF 12kHz to 5MHz 1.11 3 ps dBc dBc ps (rms) 1,4 1 Guaranteed by design and characterization, not 100% tested in production. All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is trimmed to 25.00 MHz 2 3 Default SMBus Value When driven by a crystal. 4 5 X2 should be floating. Clock Periods–Differential Outputs with Spread Spectrum Disabled SSC OFF Center Freq. MHz DIF 100.00 Measurement Window 1us 0.1s 0.1s 0.1s -SSC + ppm - ppm -c2c jitter 0 ppm Short-Term Long-Term Long-Term Period AbsPer Average Average Average Nominal Min Min Min Max 9.94900 9.99900 10.00000 10.00100 1 Clock 1us +SSC Short-Term Average Max 1 Clock +c2c jitter Units Notes AbsPer Max 10.05100 ns 1,2 Clock Periods–Differential Outputs with -0.5% Spread Spectrum Enabled SSC ON Center Freq. MHz DIF 99.75 Measurement Window 1us 0.1s 0.1s 0.1s -SSC + ppm - ppm -c2c jitter 0 ppm Short-Term Long-Term Long-Term Period AbsPer Average Average Average Nominal Min Min Min Max 9.94906 9.99906 10.02406 10.02506 10.02607 1 Clock 1us +SSC Short-Term Average Max 10.05107 1 Clock +c2c jitter Units Notes AbsPer Max 10.10107 ns 1,2 1 Guaranteed by design and characterization, not 100% tested in production. All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is trimmed to 25.00 MHz 2 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 8 OCTOBER 18, 2016 9FGU0241 DATASHEET General SMBus Serial Interface Information How to Write • • • • • • • • • • How to Read Controller (host) sends a start bit Controller (host) sends the write address IDT clock will acknowledge Controller (host) sends the beginning byte location = N IDT clock will acknowledge Controller (host) sends the byte count = X IDT clock will acknowledge Controller (host) starts sending Byte N through Byte N+X-1 IDT clock will acknowledge each byte one at a time Controller (host) sends a Stop bit • • • • • • • • • • • • • • Index Block Write Operation Controller (Host) T Index Block Read Operation IDT (Slave/Receiver) Controller (Host) starT bit T Slave Address WR Controller (host) will send a start bit Controller (host) sends the write address IDT clock will acknowledge Controller (host) sends the beginning byte location = N IDT clock will acknowledge Controller (host) will send a separate start bit Controller (host) sends the read address IDT clock will acknowledge IDT clock will send the data byte count = X IDT clock sends Byte N+X-1 IDT clock sends Byte 0 through Byte X (if X(H) was written to Byte 8) Controller (host) will need to acknowledge each byte Controller (host) will send a not acknowledge bit Controller (host) will send a stop bit IDT (Slave/Receiver) starT bit Slave Address WRite WR ACK WRite ACK Beginning Byte = N Beginning Byte = N ACK ACK Data Byte Count = X RT ACK Beginning Byte N RD ACK X Byte O O O Repeat starT Slave Address ReaD ACK O Data Byte Count=X O O ACK ACK ACK Beginning Byte N Byte N + X - 1 stoP bit X Byte P O Note: Read/Write address is determined by SADR latch. O O O O O Byte N + X - 1 OCTOBER 18, 2016 9 N Not acknowledge P stoP bit 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 9FGU0241 DATASHEET SMBus Table: Output Enable Register Byte 0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 DIF OE1 Bit 2 DIF OE0 Bit 1 Bit 0 Control Function Reserved Reserved Reserved Reserved Reserved Output Enable Output Enable Reserved SMBus Table: SS Readback and Vhigh Control Register Byte 1 Name Control Function SSENRB1 SS Enable Readback Bit1 Bit 7 SSENRB1 SS Enable Readback Bit0 Bit 6 Bit 5 SSEN_SWCNTRL Enable SW control of SS SSENSW1 SS Enable Software Ctl Bit1 Bit 4 SSENSW0 SS Enable Software Ctl Bit0 Bit 3 Reserved Bit 2 AMPLITUDE 1 Bit 1 Controls Output Amplitude AMPLITUDE 0 Bit 0 1. B1[5] must be set to a 1 for these bits to have any effect on the part. SMBus Table: DIF Slew Rate Control Register Byte 2 Name Control Function Reserved Bit 7 Reserved Bit 6 Reserved Bit 5 Reserved Bit 4 Reserved Bit 3 SLEWRATESEL DIF1 Adjust Slew Rate of DIF1 Bit 2 SLEWRATESEL DIF0 Adjust Slew Rate of DIF0 Bit 1 Reserved Bit 0 SMBus Table: REF Control Register Byte 3 Name Bit 7 REF Bit 6 Bit 5 REF Power Down Function Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 REF OE Control Function Type 0 1 RW RW Low/Low Low/Low Enabled Enabled Type 0 1 00' for SS_EN_tri = 0, '01' for SS_EN_tri R = 'M', '11 for SS_EN_tri = '1' R RW Wake-on-Lan Enable for REF REF Output Enable Reserved Reserved Reserved Reserved Values in B1[4:3] control SS amount. RW 1 RW 1 00' = SS Off, '01' = -0.25% SS, '10' = Reserved, '11'= -0.5% SS RW RW 00 = 0.55V 10= 0.7V 01 = 0.65V 11 = 0.8V Type 0 1 RW RW Slow Setting Slow Setting Fast Setting Fast Setting Type RW RW Slew Rate Control SS control locked 0 1 00 = Slowest 01 = Slow 10 = Fast 11 = Faster REF does not run in REF runs in Power RW Power Down Down RW Low Enabled Default 1 1 1 1 1 1 1 1 Default Latch Latch 0 0 0 1 1 0 Default 1 1 1 1 1 1 1 1 Default 0 1 0 1 1 1 1 1 Byte 4 is reserved and reads back 'hFF'. 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 10 OCTOBER 18, 2016 9FGU0241 DATASHEET SMBus Table: Revision and Vendor ID Register Byte 5 Name Control Function RID3 Bit 7 RID2 Bit 6 Revision ID RID1 Bit 5 RID0 Bit 4 VID3 Bit 3 VID2 Bit 2 VENDOR ID VID1 Bit 1 VID0 Bit 0 Type R R R R R R R R SMBus Table: Device Type/Device ID Byte 6 Name Device Type1 Bit 7 Device Type0 Bit 6 Device ID5 Bit 5 Device ID4 Bit 4 Device ID3 Bit 3 Device ID2 Bit 2 Device ID1 Bit 1 Device ID0 Bit 0 Type R R R R R R R R SMBus Table: Byte Count Register Byte 7 Name Bit 7 Bit 6 Bit 5 BC4 Bit 4 BC3 Bit 3 BC2 Bit 2 BC1 Bit 1 BC0 Bit 0 Control Function Device Type Device ID Control Function Reserved Reserved Reserved 0 A rev = 0000 0001 = IDT 0 1 00 = FGx, 01 = DBx ZDB/FOB, 10 = DMx, 11= DBx FOB 00010 binary or 02 hex Type Byte Count Programming RW RW RW RW RW 1 0 1 Writing to this register will configure how many bytes will be read back, default is = 8 bytes. Default 0 0 0 0 0 0 0 1 Default 0 0 0 0 0 0 1 0 Default 0 0 0 0 1 0 0 0 Recommended Crystal Characteristics (3225 package) PARAMETER VALUE UNITS NOTES Frequency Resonance Mode Frequency Tolerance @ 25°C Frequency Stability, ref @ 25°C Over Operating Temperature Range Temperature Range (commerical) Temperature Range (industrial) Equivalent Series Resistance (ESR) Shunt Capacitance (CO) Load Capacitance (CL) Drive Level Aging per year Notes: 1. FOX 603-25-150. 2. For I-temp, FOX 603-25-261. 25 Fundamental ±20 MHz PPM Max 1 1 1 ±20 PPM Max 1 0~70 -40~85 50 7 8 0.3 ±5 °C °C Ω Max pF Max pF Max mW Max PPM Max 1 2 1 1 1 1 1 OCTOBER 18, 2016 11 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 9FGU0241 DATASHEET Thermal Characteristics PARAMETER SYMBOL CONDITIONS Thermal Resistance θJC θJb θJA0 θJA1 θJA3 θJA5 Junction to Case Junction to Base Junction to Air, still air Junction to Air, 1 m/s air flow Junction to Air, 3 m/s air flow Junction to Air, 5 m/s air flow TYP UNITS NOTES VALUE 62 °C/W 1 C/W 5.4 ° 1 50 °C/W 1 NLG24 C/W 43 ° 1 39 °C/W 1 38 °C/W 1 PKG 1 ePad soldered to board Marking Diagrams LOT U41AL YYWW LOT U41AIL YYWW Notes: 1. “LOT” is the lot number. 2. “YYWW” is the last two digits of the year and week that the part was assembled. 3. “L” denotes RoHS compliant package. 4. “I” denotes industrial temperature grade. 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 12 OCTOBER 18, 2016 9FGU0241 DATASHEET Package Outline and Package Dimensions (NLG24) Seating Plane A1 Index Area N (Ref) ND & NE Even (ND-1)x e (Ref) L A3 e N Anvil Singulation 1 (Typ) If ND & NE 2 are Even 2 E -- or -Top View E2 Sawn Singulation A (NE-1)x e (Ref) 2 (Ref) ND & NE Odd D 0.08 C E2 b e C Symbol Millimeters Min Max A A1 A3 b e D x E BASIC D2 MIN./MAX. E2 MIN./MAX. L MIN./MAX. N ND 0.80 1.00 0 0.05 0.25 Reference 0.18 0.30 0.50 BASIC 4.00 x 4.00 2.3 2.60 2.3 2.60 0.30 0.50 24 6 Thermal Base D2 2 D2 Ordering Information Part / Order Number Shipping Packaging 9FGU0241AKLF Tubes 9FGU0241AKLFT Tape and Reel 9FGU0241AKILF Tubes 9FGU0241AKILFT Tape and Reel Package 24-pin VFQFPN 24-pin VFQFPN 24-pin VFQFPN 24-pin VFQFPN Temperature 0 to +70° C 0 to +70° C -40 to +85° C -40 to +85° C “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant. “A” is the device revision designator (will not correlate with the datasheet revision). OCTOBER 18, 2016 13 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 9FGU0241 DATASHEET Revision History Rev. A B Issue Date Intiator Description 1. Updated electrical tables with latest versions for release 2. Updated SMBus nomenclature for consistency with the family 3. Removed references to Suspend Mode. This is replaced by Power 9/24/2014 RDW Down with Wake-on-LAN Modes in the current consumption table. 4. Updated GenDes tab for front page consistency 5. All Electrical tables updated with characterization data. 6. Move to final. 10/18/2016 RDW Removed IDT crystal part number 2 O/P 1.5V PCIE GEN1-2-3 CLOCK GENERATOR W/ZO=100OHMS 14 Page # Various OCTOBER 18, 2016 Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com email: clocks@idt.com DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Product specification subject to change without notice. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. Copyright ©2016 Integrated Device Technology, Inc.. All rights reserved. IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
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