DATASHEET
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
Description
Features/Benefits
The 9FGV0241 is a 2-output very low power frequency
generator for PCIe Gen 1, 2, 3 and 4 applications with
integrated output terminations providing Zo = 100. The
device has 2 output enables for clock management and
supports 2 different spread spectrum levels in addition to
spread off.
• Integrated terminations provide 100 differential Zo;
Recommended Application
•
PCIe Gen1-4 clock generation for Riser Cards, Storage,
Networking, JBOD, Communications, Access Points
•
Output Features
•
•
•
•
• 2 – 0.7V low-power HCSL-compatible (LP-HCSL) DIF
•
•
pairs with Zo = 100
1 – 1.8V LVCMOS REF output w/Wake-On-LAN (WOL)
support
•
Key Specifications
•
•
•
•
•
DIF cycle-to-cycle jitter = 0.65VDDSMB.
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
6
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
Electrical Characteristics–DIF 0.7V Low Power HCSL Outputs
TA = TCOM or TIND; Supply Voltage per VDD of normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
Slew rate
Trf
Slew rate matching
ΔTrf
Voltage High
V HIGH
Voltage Low
VLOW
CONDITIONS
MIN
TYP
Scope averaging on 3.0V/ns setting
Scope averaging on 2.0V/ns setting
Slew rate matching, Scope averaging on
2
1.5
3.1
2.3
3
4.3
3.5
20
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope
averaging on)
660
794
850
-150
21
150
816
-15
1551
397
15
1150
-300
300
300
Max Voltage
Min Voltage
Vswing
Crossing Voltage (abs)
Crossing Voltage (var)
Vmax
Measurement on single ended signal using
Vmin
absolute value. (Scope averaging off)
Vswing
Scope averaging off
Vcross_abs
Scope averaging off
Scope averaging off
Δ-Vcross
1
Guaranteed by design and characterization, not 100% tested in production.
2
Measured from differential waveform
MAX UNITS NOTES
550
140
V/ns
V/ns
%
1, 2, 3
1, 2, 3
1,2,4
1,7
mV
1
1
1
1,2
1,5
1,6
mV
mV
mV
mV
3
Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around
differential 0V.
4
Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on
the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the
oscilloscope is to use for the edge rate calculations.
5
Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising
edge (i.e. Clock rising and Clock# falling).
6
The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross
absolute) allowed. The intent is to limit Vcross induced modulation by setting Δ-Vcross to be smaller than Vcross absolute.
7
At default SMBus settings.
Electrical Characteristics–Filtered Phase Jitter Parameters - PCIe Common
Clocked (CC) Architectures
TAMB = over the specified operating range. Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
SYMBOL
PARAMETER
CONDITIONS
t jphPCIeG1-CC
PCIe Gen 1
PCIe Gen 2 Low Band
10kHz < f < 1.5MHz
(PLL BW of 5-16MHz, 8-16MHz, CDR = 5MHz)
t jphPCIeG2-CC
PCIe Gen 2 High Band
Phase Jitter,
1.5MHz
< f < Nyquist (50MHz)
PLL Mode
(PLL BW of 5-16MHz, 8-16MHz, CDR = 5MHz)
PCIe Gen 3
t jphPCIeG3-CC
(PLL BW of 2-4MHz, 2-5MHz, CDR = 10MHz)
PCIe Gen 4
t jphPCIeG4-CC
(PLL BW of 2-4MHz, 2-5MHz, CDR = 10MHz)
Notes on PCIe Filtered Phase Jitter Tables
1
Applies to all differential outputs, guaranteed by design and characterization.
2
Calculated from Intel-supplied Clock Jitter Tool, with spread on and off.
3
Specification
UNITS NOTES
Limit
86
ps (p-p) 1, 2, 3
MIN
TYP
MAX
21
25
35
0.9
0.9
1.1
3
ps
(rms)
1, 2
1.5
1.6
1.9
3.1
ps
(rms)
1, 2
0.3
0.37
0.44
1
0.3
0.37
0.44
0.5
ps
(rms)
ps
(rms)
1, 2
1, 2
Sample size of at least 100K cycles. This figure extrapolates to 108ps pk-pk at 1M cycles for a BER of 1-12.
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
7
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
Electrical Characteristics–REF
TA = TCOM or TIND; Supply Voltage per VDD of normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
Long Accuracy
ppm
see Tperiod min-max values
0
Clock period
Tperiod
25 MHz output nominal
40
Rise/Fall Slew Rate
t rf1
Byte 3 = 1F, VOH = VDD-0.45V, VOL = 0.45V
0.5
1
Rise/Fall Slew Rate
t rf1
Byte 3 = 5F, VOH = VDD-0.45V, VOL = 0.45V
0.5
1.6
Byte 3 = 9F, VOH = VDD-0.45V, VOL = 0.45V
0.5
2
Rise/Fall Slew Rate
t rf1
Rise/Fall Slew Rate
t rf1
Byte 3 = DF, VOH = VDD-0.45V, VOL = 0.45V
0.5
2.1
Duty Cycle
dt1
VT = VDD/2 V
45
53.1
Duty Cycle Distortion
dtcd
VT = VDD/2 V
0
2
Jitter, cycle to cycle
tjcyc-cyc
VT = VDD/2 V
19
Noise floor
t jdBc1k
1kHz offset
-130
Noise floor
t jdBc10k
10kHz offset to Nyquist
-140
Jitter, phase
t jphREF
12kHz to 5MHz
0.63
MAX
2.5
2.5
2.5
2.5
55
4
250
-105
-120
1.5
UNITS
ppm
ns
V/ns
V/ns
V/ns
V/ns
%
%
ps
dBc
dBc
ps
(rms)
Notes
1,2
1,2
1,3
1,3
1,3
1,3
1,4
1,5
1,4
1,4
1,4
1,4
1
Guaranteed by design and characterization, not 100% tested in production.
All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is trimmed to 25.00 MHz
3
Typical value occurs when REF slew rate is set to default value
4
When driven by a crystal.
5
When driven by an external oscillator via the X1 pin. X2 should be floating in this case.
2
Clock Periods–Differential Outputs with Spread Spectrum Disabled
SSC OFF
Center
Freq.
MHz
DIF
100.00
Measurement Window
1us
0.1s
0.1s
0.1s
-SSC
- ppm
+ ppm
0 ppm
-c2c jitter
Short-Term Long-Term
Long-Term
Period
AbsPer
Average
Average
Average
Nominal
Min
Min
Min
Max
9.94900
9.99900
10.00000
10.00100
1 Clock
1us
+SSC
Short-Term
Average
Max
1 Clock
+c2c jitter Units Notes
AbsPer
Max
10.05100
ns
1,2
Clock Periods–Differential Outputs with -0.5% Spread Spectrum Enabled
SSC ON
Center
Freq.
MHz
DIF
99.75
Measurement Window
1us
0.1s
0.1s
0.1s
-SSC
- ppm
+ ppm
0 ppm
-c2c jitter
Short-Term Long-Term
Long-Term
Period
AbsPer
Average
Average
Average
Nominal
Min
Min
Min
Max
9.94906
9.99906
10.02406
10.02506
10.02607
1 Clock
1us
+SSC
Short-Term
Average
Max
10.05107
1 Clock
+c2c jitter Units Notes
AbsPer
Max
10.10107
ns
1,2
1
Guaranteed by design and characterization, not 100% tested in production.
All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is trimmed to 25.00 MHz
2
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
8
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
General SMBus Serial Interface Information
How to Write
How to Read
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Controller (host) sends a start bit
Controller (host) sends the write address
IDT clock will acknowledge
Controller (host) sends the beginning byte location = N
IDT clock will acknowledge
Controller (host) sends the byte count = X
IDT clock will acknowledge
Controller (host) starts sending Byte N through Byte
N+X-1
IDT clock will acknowledge each byte one at a time
Controller (host) sends a Stop bit
Index Block Write Operation
Controller (Host)
T
Index Block Read Operation
IDT (Slave/Receiver)
Controller (Host)
starT bit
T
Slave Address
WR
•
•
•
Controller (host) will send a start bit
Controller (host) sends the write address
IDT clock will acknowledge
Controller (host) sends the beginning byte location = N
IDT clock will acknowledge
Controller (host) will send a separate start bit
Controller (host) sends the read address
IDT clock will acknowledge
IDT clock will send the data byte count = X
IDT clock sends Byte N+X-1
IDT clock sends Byte 0 through Byte X (if X(H) was
written to Byte 8)
Controller (host) will need to acknowledge each byte
Controller (host) will send a not acknowledge bit
Controller (host) will send a stop bit
IDT (Slave/Receiver)
starT bit
Slave Address
WRite
ACK
WR
WRite
ACK
Beginning Byte = N
ACK
Beginning Byte = N
ACK
Data Byte Count = X
ACK
RT
Slave Address
Beginning Byte N
ACK
X Byte
O
O
O
Repeat starT
RD
ReaD
ACK
O
Data Byte Count=X
O
O
ACK
ACK
ACK
Beginning Byte N
Byte N + X - 1
stoP bit
O
Note: Read/Write address is determined by SADR latch.
O
X Byte
P
O
O
O
O
Byte N + X - 1
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
N
Not acknowledge
P
stoP bit
9
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
SMBus Table: Output Enable Register
Byte 0
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
DIF OE1
Bit 2
DIF OE0
Bit 1
Bit 0
Control Function
Reserved
Reserved
Reserved
Reserved
Reserved
Output Enable
Output Enable
Reserved
SMBus Table: SS Readback and Vhigh Control Register
Byte 1
Name
Control Function
SSENRB1
SS Enable Readback Bit1
Bit 7
SSENRB1
SS Enable Readback Bit0
Bit 6
Bit 5
SSEN_SWCNTRL
Enable SW control of SS
SSENSW1
SS Enable Software Ctl Bit1
Bit 4
SSENSW0
SS Enable Software Ctl Bit0
Bit 3
Reserved
Bit 2
AMPLITUDE 1
Bit 1
Controls Output Amplitude
AMPLITUDE 0
Bit 0
1. B1[5] must be set to a 1 for these bits to have any effect on the part.
SMBus Table: DIF Slew Rate Control Register
Byte 2
Name
Control Function
Reserved
Bit 7
Reserved
Bit 6
Reserved
Bit 5
Reserved
Bit 4
Reserved
Bit 3
SLEWRATESEL DIF1
Adjust Slew Rate of DIF1
Bit 2
SLEWRATESEL DIF0
Adjust Slew Rate of DIF0
Bit 1
Reserved
Bit 0
SMBus Table: REF Control Register
Byte 3
Name
Bit 7
REF
Bit 6
Bit 5
REF Power Down Function
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
REF OE
Control Function
Slew Rate Control
Wake-on-Lan Enable for REF
REF Output Enable
Reserved
Reserved
Reserved
Reserved
Type
0
1
RW
RW
Low/Low
Low/Low
Enabled
Enabled
Type
0
1
00' for SS_EN_tri = 0, '01' for SS_EN_tri
R
= 'M', '11 for SS_EN_tri = '1'
R
RW
SS control locked
Values in B1[4:3]
control SS amount.
RW 1
RW 1
00' = SS Off, '01' = -0.25% SS,
'10' = Reserved, '11'= -0.5% SS
RW
RW
00 = 0.6V
10= 0.8V
01 = 0.7V
11 = 0.9V
Type
0
1
RW
RW
2.0V/ns
2.0V/ns
3.0V/ns
3.0V/ns
Type
RW
RW
0
1
00 = Slowest
01 = Slow
10 = Fast
11 = Faster
REF does not run in REF runs in Power
RW
Power Down
Down
RW
Low
Enabled
Default
1
1
1
1
1
1
1
1
Default
Latch
Latch
0
0
0
1
1
0
Default
1
1
1
1
1
1
1
1
Default
0
1
0
1
1
1
1
1
Byte 4 is reserved and reads back 'hFF'.
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
10
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
SMBus Table: Revision and Vendor ID Register
Byte 5
Name
Control Function
RID3
Bit 7
RID2
Bit 6
Revision ID
RID1
Bit 5
RID0
Bit 4
VID3
Bit 3
VID2
Bit 2
VENDOR ID
VID1
Bit 1
VID0
Bit 0
Type
R
R
R
R
R
R
R
R
SMBus Table: Device Type/Device ID
Byte 6
Name
Device Type1
Bit 7
Device Type0
Bit 6
Device ID5
Bit 5
Device ID4
Bit 4
Device ID3
Bit 3
Device ID2
Bit 2
Device ID1
Bit 1
Device ID0
Bit 0
Type
R
R
R
R
R
R
R
R
SMBus Table: Byte Count Register
Byte 7
Name
Bit 7
Bit 6
Bit 5
BC4
Bit 4
BC3
Bit 3
BC2
Bit 2
BC1
Bit 1
BC0
Bit 0
Control Function
Device Type
Device ID
Control Function
Reserved
Reserved
Reserved
Byte Count Programming
0
A rev = 0000
0001 = IDT
0
1
00 = FGV, 01 = DBV,
10 = DMV, 11= Reserved
00010 binary or 02 hex
Type
RW
RW
RW
RW
RW
1
0
1
Writing to this register will configure how
many bytes will be read back, default is
= 8 bytes.
Default
0
0
0
0
0
0
0
1
Default
0
0
0
0
0
0
1
0
Default
0
0
0
0
1
0
0
0
Recommended Crystal Characteristics (3225 package)
PARAMETER
VALUE
UNITS
NOTES
Frequency
Resonance Mode
Frequency Tolerance @ 25°C
Frequency Stability, ref @ 25°C Over
Operating Temperature Range
Temperature Range (commercial)
Temperature Range (industrial)
Equivalent Series Resistance (ESR)
Shunt Capacitance (CO)
Load Capacitance (CL)
Drive Level
Aging per year
Notes:
1. FOX 603-25-150.
2. For I-temp, FOX 603-25-261.
25
Fundamental
±20
MHz
PPM Max
1
1
1
±20
PPM Max
1
0~70
-40~85
50
7
8
0.3
±5
°C
°C
Ω Max
pF Max
pF Max
mW Max
PPM Max
1
2
1
1
1
1
1
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
11
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
Thermal Characteristics
PARAMETER
SYMBOL
CONDITIONS
Thermal Resistance
θJC
θJb
θJA0
θJA1
θJA3
θJA5
Junction to Case
Junction to Base
Junction to Air, still air
Junction to Air, 1 m/s air flow
Junction to Air, 3 m/s air flow
Junction to Air, 5 m/s air flow
TYP
UNITS NOTES
VALUE
62
°C/W
1
C/W
5.4
°
1
50
°C/W
1
NLG20
NLG24
43
°C/W
1
39
°C/W
1
38
°C/W
1
PKG
1
ePad soldered to board
Marking Diagrams
LOT
241AL
YYWW
LOT
241AIL
YYWW
Notes:
1. ‘LOT’ is the lot number.
2. ‘YYWW’ is the last two digits of the year and week that the part was assembled.
3. ‘L’ denotes RoHS compliant package.
4. ‘I’ denotes industrial temperature grade.
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
12
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
Package Outline and Dimensions (NLG24)
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
13
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
Package Outline and Dimensions (NLG24), cont.
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
14
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
Ordering Information
Part / Order Number Shipping Packaging
9FGV0241AKLF
Tubes
9FGV0241AKLFT
Tape and Reel
9FGV0241AKILF
Tubes
9FGV0241AKILFT
Tape and Reel
Package
24-pin VFQFPN
24-pin VFQFPN
24-pin VFQFPN
24-pin VFQFPN
Temperature
0 to +70° C
0 to +70° C
-40 to +85° C
-40 to +85° C
“LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant.
“A” is the device revision designator (will not correlate with the datasheet revision).
Revision History
Issue Date
February 3, 2015
November 30, 2015
January 4, 2016
October 18, 2016
June 19, 2017
June 6, 2019
Description
Updated IDDAOP and IDDOP typ and max specs per latest characterization review.
Updated block diagram
Corrected typo in ordering information; changed rev "B" to rev "A"
Removed IDT crystal part number
Updated front page Gendes to reflect the PCIe Gen4 updates.
Updated Electrical Characteristics - Filtered Phase Jitter Parameters - PCIe Common
Clocked (CC) Architectures and added PCIe Gen4 Data
Updated Input Current minimum and maximum values from -200/200 uA to -20/20 uA.
IDT® 2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
15
9FGV0241
JUNE 6, 2019
9FGV0241
2-OUTPUT VERY LOW POWER PCIE GEN 1-2-3-4 CLOCK GENERATOR
SYNTHESIZERS
Innovate with IDT and accelerate your future networks. Contact:
www.IDT.com
For Sales
For Tech Support
800-345-7015
408-284-8200
www.idt.com/go/sales
www.idt.com/go/support
Corporate Headquarters
Integrated Device Technology, Inc.
www.idt.com
DDISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products
and/or specifications described herein at any time, without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the
described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the
suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of
others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where
the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product
in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other
countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of
common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc. All rights reserved.
IMPORTANT NOTICE AND DISCLAIMER
RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL
SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING
REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND
OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED,
INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible
for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3)
ensuring your application meets applicable standards, and any other safety, security, or other requirements. These
resources are subject to change without notice. Renesas grants you permission to use these resources only for
development of an application that uses Renesas products. Other reproduction or use of these resources is strictly
prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property.
Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims,
damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject
to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources
expands or otherwise alters any applicable warranties or warranty disclaimers for these products.
(Rev.1.0 Mar 2020)
Corporate Headquarters
Contact Information
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
For further information on a product, technology, the most
up-to-date version of a document, or your nearest sales
office, please visit:
www.renesas.com/contact/
Trademarks
Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and registered
trademarks are the property of their respective owners.
© 2020 Renesas Electronics Corporation. All rights reserved.