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MPC942CFA

MPC942CFA

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    LQFP32

  • 描述:

    IC CLK DISTR CHIP LV 1:18 32LQFP

  • 数据手册
  • 价格&库存
MPC942CFA 数据手册
Low Voltage, 1:18 Clock Distribution Chip MPC942C DATASHEET OBSOLETE The MPC942 is a 1:18 low voltage clock distribution chip with 2.5V or 3.3V LVCMOS output capabilities. The device is offered in two versions; the MPC942C has an LVCMOS input clock while the MPC942P has a LVPECL input clock. The 18 outputs are 2.5V or 3.3V LVCMOS compatible and feature the drive strength to drive 50 series or parallel terminated transmission lines. With output-to-output skews of 200ps, the MPC942 is ideal as a clock distribution chip for the most demanding of synchronous systems. The 2.5V outputs also make the device ideal for supplying clocks for a high performance Pentium II microprocessor based design. • LVCMOS/LVTTL Clock Input • 2.5V LVCMOS Outputs for Pentium II Microprocessor Support • 150ps Maximum Targeted Output-to-Output Skew • Maximum Output Frequency of 250MHz @ 3.3 VCC • 32-Lead TQFP Packaging • Single 3.3V or 2.5V Supply • For Functional replacement use 83940DYLF MPC942C LOW VOLTAGE 1:18 CLOCK DISTRIBUTION CHIP AC SUFFIX 32-LEAD TQFP PACKAGE Pb-FREE PACKAGE CASE 873A-03 With a low output impedance (12), in both the HIGH and LOW logic states, the output buffers of the MPC942 are ideal for driving series terminated transmission lines. With an output impedance of 12 the MPC942 can drive two series terminated transmission lines from each output. This capability gives the MPC942 an effective fanout of 1:36. The MPC942 provides enough copies of low skew clocks for most high performance synchronous systems. The LVCMOS/LVTTL input of the MPC942C provides a more standard LVCMOS interface. The OE pins will place the outputs into a high impedance state. The OE pin has an internal pullup resistor. The MPC942 is a single supply device. The VCC power pins require either 2.5V or 3.3V. The 32-lead TQFP package was chosen to optimize performance, board space and cost of the device. The 32-lead TQFP has a 7x7mm body size with a conservative 0.8mm pin spacing. Pentium II is a trademark of Intel Corporation. ©2016 Integrated Device Technology, Inc. 1 Revision 3, October 4, 2016 OBSOLETE MPC942C Datasheet . LOGIC DIAGRAM MPC942C Block Diagram Q0 LVCMOS_CLK FUNCTION TABLE Q1:Q16 OE Output 0 1 HIGH IMPEDANCE OUTPUTS ENABLED Q17 OE (Int. Pullup) Q6 Q7 Q8 VCC Q9 Q10 Q11 GND Pinout: 32-Lead (Top View) 24 23 22 21 20 19 18 17 GND 25 16 VCC Q5 26 15 Q12 Q4 27 14 Q13 Q3 28 13 Q14 VCC 29 12 GND Q2 30 11 Q15 Q1 31 10 Q16 Q0 32 9 Q17 1 2 3 4 5 6 7 8 GND GND LVCMOS_CLK NC OE NC VCC VCC MPC942C Table 1. Absolute Maximum Ratings Symbol VCC Parameter Min Max Unit Supply Voltage –0.3 3.6 V VI Input Voltage –0.3 VCC + 0.3 V IIN Input Current 20 mA 125 C TStor Storage Temperature Range ©2016 Integrated Device Technology, Inc. –40 2 Revision 3, October 4, 2016 OBSOLETE MPC942C Datasheet Table 2. DC Characteristics (TA = 0 to 70C, VCCI = 2.5V ±5%, VCCO = 2.5V ±5%) Symbol Characteristic VIH Input HIGH Voltage VIL Input LOW Voltage VOH Output HIGH Voltage VOL Output LOW Voltage Min Typ 2.0 Max Unit VCCI V 0.8 V 2.0 V IOH = –16 mA 0.5 V IOL = 16 mA 200 A IIN Input Current CIN Input Capacitance 4.0 pF CPD Power Dissipation Capacitance 14 pF ZOUT Output Impedance 12  Maximum Quiescent Supply Current 0.5 mA ICC Condition Per Output Table 3. AC Characteristics (TA = 0 to 70C, VCCI = 2.5V ±5%, VCCO = 2.5V ±5%) Symbol Characteristic Fmax Maximum Frequency tPLH Propagation Delay Min Typ 1.5 Max Unit 200 MHz 2.8 ns Condition tsk(o) Output-to-Output Skew 200 ps tsk(pr) Part-to-Part Skew 1.3 ns Notes 1, 2 tsk(pr) Part-to-Part Skew 600 ps Notes 1, 3 dt tr, tf Duty Cycle 45 55 % Output Rise/Fall Time 0.2 1.0 ns Max Unit VCCI V 0.8 V Table 4. DC Characteristics (TA = 0 to 70C, VCCI = 3.3V ±5%, VCCO = 3.3V ±5%) Symbol Characteristic VIH Input HIGH Voltage VIL Input LOW Voltage VOH Output HIGH Voltage VOL Output LOW Voltage IIN Input Current Min Typ 2.4 2.4 V IOH = –20 mA 0.5 V IOL = 20 mA 200 A CIN Input Capacitance 4.0 pF CPD Power Dissipation Capacitance 14 pF ZOUT Output Impedance 12  Maximum Quiescent Supply Current 0.5 mA ICC Condition Per Output Table 5. AC Characteristics (TA = 0 to 70C, VCCI = 3.3V ±5%, VCCO = 3.3V ±5%) Symbol Characteristic Fmax Maximum Frequency Min Max Unit 250 MHz Condition tPLH Propagation Delay 2.3 ns tsk(o) Output-to-Output Skew 200 ps tsk(pr) Part-to-Part Skew 1.0 ns Notes 1, 2 tsk(pr) Part-to-Part Skew Notes 1, 3 dt tr, tf 1.3 Typ 500 ps Duty Cycle 45 55 % Output Rise/Fall Time 0.2 1.0 ns Note 1 1. Tested using standard input levels, production tested @ 133 MHz. 2. Across temperature and voltage ranges, includes output skew. 3. For a specific temperature and voltage, includes output skew. ©2016 Integrated Device Technology, Inc. 3 Revision 3, October 4, 2016 OBSOLETE MPC942C Datasheet PACKAGE DIMENSIONS 4X 0.20 H 6 A-B D D1 PIN 1 INDEX 3 e/2 D1/2 32 A, B, D 25 1 E1/2 A F B 6 E1 E 4 F DETAIL G 8 17 9 7 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUMS A, B, AND D TO BE DETERMINED AT DATUM PLANE H. 4. DIMENSIONS D AND E TO BE DETERMINED AT SEATING PLANE C. 5. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED THE MAXIMUM b DIMENSION BY MORE THAN 0.08-mm. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION: 0.07-mm. 6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25-mm PER SIDE. D1 AND E1 ARE MAXIMUM PLASTIC BODY SIZE DIMENSIONS INCLUDING MOLD MISMATCH. 7. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 8. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.1-mm AND 0.25-mm FROM THE LEAD TIP. 4 D 4X A-B D H SEATING PLANE DETAIL G D D/2 0.20 C E/2 28X e 32X C 0.1 C DETAIL AD PLATING BASE METAL b1 c c1 b 8X (θ1˚) 0.20 R R2 A2 8 C A-B D SECTION F-F R R1 A M 5 0.25 GAUGE PLANE A1 (S) L (L1) θ˚ DETAIL AD DIM A A1 A2 b b1 c c1 D D1 e E E1 L L1 q q1 R1 R2 S MILLIMETERS MIN MAX 1.40 1.60 0.05 0.15 1.35 1.45 0.30 0.45 0.30 0.40 0.09 0.20 0.09 0.16 9.00 BSC 7.00 BSC 0.80 BSC 9.00 BSC 7.00 BSC 0.50 0.70 1.00 REF 0˚ 7˚ 12 REF 0.08 0.20 0.08 --0.20 REF CASE 873A-03 CASE 873A-03 ISSUE B LQFP PLASTIC PACKAGE ©2016 Integrated Device Technology, Inc. 4 Revision 3, October 4, 2016 OBSOLETE MPC942C Datasheet Revision History Sheet Rev Table Page Description of Change Date 2 1 NRND – Not Recommend for New Designs 1/8/13 2 1 Product Discontinuation Notice - PDN CQ-15-02 5/6/15 3 1 Obsolete per Product Discontinuation Notice - PDN CQ-15-02. 10/4/16 ©2016 Integrated Device Technology, Inc. 5 Revision 3, October 4, 2016 OBSOLETE MPC942C Datasheet Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA www.IDT.com 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales www.IDT.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc.. All rights reserved. ©2016 Integrated Device Technology, Inc. 6 Revision 3, October 4, 2016 OBSOLETE IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
MPC942CFA 价格&库存

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