TSI572-10GCLV

Tsi572 Serial RapidIO Switch Performance • Low latency 110 ns packet cut-through • Full duplex, line rate termination, non-blocking fabric • Prevention of head-of-line blocking • Error management extensions • Multicast • Performance monitoring and statistic registers • Programmable buffer management • Additional scheduling algorithms Low Power • Programmable SerDes • Configurable on port width and speed • Configurable port power down • Low power – 120-200mW per port Cost • Integrated SerDes • Small, 399 HSBGA, 21mm package Block Diagram Multicast Engine SP0 (4x or 1x) SP6 (4x or 1x) SP1 (1x) SP7 (1x) Internal Switching Fabric SP2 (1x) SP4 (1x) SP3 (1x) SP5 (1x) Registers I2C 4x Serial RapidIO Port The Tsi572 enhances system scalability through device configuration and provides architects and designers with a solution for both throughput intensive and power sensitive applications. The Tsi572 leverages the industry’s best plug and play interoperability with Texas Instruments, Freescale, Xiliinx, and Altera’s RapidIO-enabled products. Up to 4 Serial RapidIO Ports - 1x Mode Configurable • Two 4x links or up to eight 1x links – Each 4x link can be separated into two, 1x links • Supports 1.25, 2.5 and 3.125 Gbaud rates • Hot Swap – Live insertion and extraction of field replaceable units • I2C Master/Slave • Multicast event control symbol • Lane swap The Tsi572 provides designers and architects with maximum design scalability, enabling them to design theTsi572 into a wide range of applications. As is the case with IDT’s other Tsi57x parts, flexible port configurations can be selected through multiple port width and frequency options. The Tsi572 also supports multicast, traffic management through scheduling algorithms, programmable buffer depth, and fabric performance monitoring to supervise and manage traffic flow. 4x Serial RapidIO Port Serial RapidIO Interfaces • 30 Gbits/s full-duplex Serial RapidIO switch • Standard Compliant – RapidIO Interconnect Specification (Revision 1.3) – IEEE 1149.6 AC-JTAG • Socket compatible with the Tsi576 The Tsi572TM is a fourth generation RapidIO switch which supports 30 Gbits/s aggregate bandwidth and is optimized for multiprocessor, peer-to-peer embedded networking on line cards using the RapidIO Interconnect Specification (Revision 1.3). The Tsi572 offers lower power and cost per gigabit switched than equivalent PCIe and Gigabit Ethernet solutions, making it optimal for cost sensitive, power-limited embedded systems. For cost sensitive designs, the socket compatibility between the Tsi572 and Tsi576 enables customers to cost-reduce certain Tsi576 applications. Up to 4 Serial RapidIO Ports - 1x Mode Features JTAG 80B805C_BK001_01 Master and Slave Devices IEEE1149.6 Boundary Scan Embedded applications further benefit from the ability to route packets to multiple endpoints through hierarchical lookup tables, independent unicast and multicast routing mechanisms, and error management extensions that provide proactive issue notification to the fabric controller. In addition, the Tsi572 supports both in-band RapidIO access and out-of-band access to the full fabric register set through the I2C interface. 1 of 2 July 30, 2009 2009 Integrated Device Technology, Inc. All rights reserved. NOT AN OFFER FOR SALE. This Document Type is for informational and planning purposes only and subject to a Non-Disclosure Agreement (NDA). Nothing contained in this presentation, whether verbal or written, is intended as, or shall have the effect of, a sale or an offer for sale that creates a contractual power of acceptance. Feature Sheet Typical Applications Benefits • Scalability: Tsi576 footprint compatibility allows system scaling depending on systems cost and performance requirements • Performance: Improved system and distributed processing performance • Cost; Designed for more cost-sensitive applications • Power: Lowest power product in Tsi57x portfolio Specifications • • • • Technology: 0.13um Voltage: 1.2V and 3.3V Low power consumption Package: 399 ball, 21mm x 21mm, 1mm ball pitch HSBGA • Rated for commercial and industrial temperatures • Pin compatible with the Tsi576 The Tsi572 is ideal for many embedded applications because it provides chip-to-chip interconnect between I/O devices and 4x links to backplanes. The Tsi572 supports multiple backplanes, inlcuding those compliant with PICMG AMC 4, which has a data rate of up to 10 Gbps. The Tsi572 enables high performance peer-to-peer communication through its non-blocking switch fabric for systems with multiple RapidIO-enabled processors. With the Tsi572, system OEMs can design multiple software applications on the same base hardware by leveraging the RapidIO-enabled architecture. For video applications, which have critical high frame size and rate performance requirements, the Tsi572 offers DSP aggregation with low latency Video Card DSP Application DSP DSP DSP 4x mode Tsi572 Backplane Socket compatibility with Tsi576 eases migration and increases design scalability for existing cost sensitive designs. DSP DSP DSP 80B805C_TA001_01 Target Markets Wireless Infrastructure • WiMax • 3G LTE • eWCDMA • Node B, Radio Network Controller, Media Gateway Communications Wireline Infrastructure • Multiservice WAN Switches, 1 to 10 Gbit Ethernet Switches, 1 to >10Gbit Routers, DSLAMs Video Infrastructure • Broadcast, imaging, and encoding • Video conference systems • Video head-end infrastructure • Video telepresence The Tsi572 brings many advantages to wireless applications. It provides a unified platform for WiMAX, eWCDMA, or 3G LTE, and aggregates the key hardware components with three layer hardware termination. It also frees the FPGA, ASIC, DSP and microprocessor resources for application tasks such as OFDMA PHY processing, MAC layer processing, symbol and chip rate processing tasks. Wireless Baseband Processor Application DSP FPGA MPC8560 4x mode DSP 4x mode Tsi572 Backplane Micro Processor Architecture Standards • ATCA, MicroTCA, VXS, VPX DSP 80B805C_TA001_01 DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using and IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 2 of 2 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com for Tech Support: 408-360-1533 sRIO@idt.com Document: 80B805C_FB001_03 July 30, 2009