TSI577-10GCLV

Tsi577 Serial RapidIO Switch Features Serial RapidIO Interfaces • • • • 40 Gbps aggregate bandwidth Low latency with cut-through capability Enhanced SerDes for low power solution RapidIO Interconnect Specification (Revision 1.3) compliant • High performance hardware multicast The Tsi578 enhances system scalability and performance through support for mixed port configurations and extensive fabric management features. • Error management extensions – Proactive issue notification • Port flexibility fulfills multiple I/O bandwidth requirements: – Up to four 4x mode ports or sixteen 1x mode ports – Port frequency configuration to 1.25, 2.5, and 3.125 Gbps – Support for mixed speed and width configurations • Integrated high-speed, full-duplex SerDes with 8b/10b encoding – Receiver equalization, transmit pre-emphasis, transmit voltage swing – IEEE 1149.6 support – Lane swap to ease signal layout routing • Enhanced non-blocking internal switching fabric – Traffic management through scheduling algorithms – Performance monitoring on individual ports – Programmable buffer depth – Provisions to eliminate low priority packet starvation • Supports packet routing tables for 64,000 endpoints Other Device Capabilities • I2C Interface – Master and Slave – Configuration through register initialization • Hot Swap-enabled Ports – Enables use in field replaceable blade applications The IDT Tsi577™ is IDT's fifth-generation RapidIO switch. Supporting 40 Gbps aggregate non blocking bandwidth at lower power than previous generation RapidIO switches. Using the Tsi577, flexible port configurations can be selected through multiple port width and speed options. The Tsi577 can be configured as a 16-port 1x mode switch or a 4-port 4x mode switch (or various combinations of 1x and 4x modes). Each port on the device can be a single 4x mode port or four 1x mode ports and can operate at 1.25 Gbaud, 2.5 Gbaud, or 3.125 Gbaud (or any speed in between on a quad grouping basis). The Tsi577 contains all the benefits of the previous RapidIO switch generations, including: • • • • • • • • • Industry best Multicast performance Traffic management through scheduling algorithms Programmable buffer depth Fabric performance monitoring to supervise and manage traffic flow Reduced number of clocks Smaller Package size for 16x1 solutions Low short and long reach power Industry best signal integrity 110 ns cut-through latency Block Diagram SP0 (4x or 1x) SP6 (4x or 1x) Multicast Engine SP1 (1x) SP7 (1x) SP8 (1x) SP14 (1x) SP9 (1x) SP15 (1x) SP2 (4x or 1x) Enhanced Internal Switching Fabric SP4 (4x or 1x) SP3 (1x) SP5 (1x) SP10 (1x) SP12 (1x) SP11 (1x) SP13 (1x) Registers I2C JTAG Master and Slave Devices IEEE1149.6 Boundary Scan 80F3000_BK002_01 1 of 2 August 10, 2009 2009 Integrated Device Technology, Inc. All rights reserved. NOT AN OFFER FOR SALE. This Document Type is for informational and planning purposes only and subject to a Non-Disclosure Agreement (NDA). Nothing contained in this presentation, whether verbal or written, is intended as, or shall have the effect of, a sale or an offer for sale that creates a contractual power of acceptance. Feature Sheet Typical Applications Benefits • Scalability: Single solution for mesh, fabric, and aggregated systems • Performance: Improved system and distributed processing performance • Power: SerDes implementation for low power solution • Ease of Design: Simplified board layout with one clock source Specifications • • • • Technology: 0.13u Voltage: 1.2V and 3.3V Low power consumption Package: 21mm x 21mm, 1mm ball pitch Wirebond HSBGA • Rated for commercial and industrial temperatures • Forward compatible with the Tsi576 Serial RapidIO Switch allowing easy migration for existing systems. The Tsi577 can be used in many embedded communication applications. It is designed for systems with chip-to-chip DSP and processor aggregation, and connecting to network/backplanes. The Tsi577 provides traffic aggregation through packet prioritization when it is used with RapidIO-enabled I/O devices. When it is in a system with multiple RapidIO-enabled processors it provides high performance peer-to-peer communication through its non-blocking switch fabric. In wireless baseband, the Tsi577 provides a local interconnect between DSPs used for chip rate processing assist and symbol rate processing. This provides a scalable architecture to support more subscribers per card. Wireless Baseband Card DSP DSP Micro Processor FPGA MPC8560 Tsi577 Micro Processor Target Markets DSP The Tsi577 is targeted at the following applications: • Chip-to-chip DSP and processor aggregation • Board-to-board backplane interconnect • Chassis-to-chassis interconnect over copper or optics DSP 80F3000_ TA001_01 In video infrastructure cards, equipment vendors must maximize the number of DSPs per card to manage compression and decompression algorithms. These DSPs are controlled by a local processor and all these components are linked together by a low power, small form factor, low latency, multicast enabled Tsi577. Video Infrastructure Card Design Support Tools IDT is committed to helping customers minimize their time to market. That’s why we provide one of the highest levels of design support in the industry, including: • • • • DSP Application notes Evaluation boards IC models Hardware and software development tools DSP DSP DSP Backplane Tsi577 Micro Processor MPC8560 DSP DSP DSP DSP 80F3000 TA002 01 DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using and IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 2 of 2 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com for Tech Support: 408-360-1533 sRIO@idt.com Document: 80B8070_FB001_03 August 10, 2009