BD6326NUX-E2

DC Brushless Fan Motor Drivers Three-Phase Full-Wave Fan Motor Driver BD6326NUX General description Package BD6326NUX is a three-phase sensorless fan motor driver used to cool off notebook PCs. It is controlled by a variable speed provided through the PWM input signal. Its feature is sensorless drive which doesn’t require a hall device as a location detection sensor and motor downsizing can be achieved by limiting the number of external components as much as possible. Furthermore, introducing a direct PWM soft switched driving mechanism achieves silent operations and low vibrations. W(Typ) x D(Typ) x H(Max) VSON010X3030 3.00mm x 3.00mm x 0.60mm Features „ „ „ „ „ Speed controllable by PWM input signal 180° Sinusoidal drive Power save function Internal RNF resistance Motor rotation direction select function(FR) VSON010X3030 Application „ Small fan motor notebook PCs etc. Absolute maximum ratings Parameter Limit Unit VCC 7 V Pd 0.58 W Operating temperature Topr –25 to +95 °C Storage temperature Tstg –55 to +150 °C Vomax 7 V Iomax 700 mA FG signal output voltage VFG 7 V FG signal output current IFG 6 mA Tjmax 150 °C Supply voltage Power dissipation (NOTE 1) Output voltage Output current (NOTE 2) Junction temperature Symbol (NOTE 1) Reduce by 4.64mW/°C over Ta=25°C. (On 74.2mm×74.2mm×1.6mm glass epoxy board) (NOTE 2) This value is not to exceed Pd. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended operating condition Parameter Symbol Limit Unit Operating supply voltage range VCC 2.2 to 5.5 V Input voltage range(PWM, FR terminals) VINx 0 to VCC V ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Pin Configuration Pin Description (TOP VIEW) FG PWM COM TOSC VCC GND U V FR W P/No. 1 2 3 4 5 6 7 8 9 10 T/name FG COM VCC U FR W V GND TOSC PWM Function FG output terminal Coil midpoint terminal Power supply terminal U phase output terminal Motor rotation direction select terminal W phase output terminal V phase output terminal GND terminal Start-up oscillation terminal PWM signal input terminal Figure 1. Pin configuration Block Diagram TSD FG 1 UVLO OSC SIGNAL OUTPUT DUTY CONTROL BEMF COMP. 2 CONTROL LOGIC COM TOSC VCC 4 5 PWM 10 TOSC CS COMP. 3 VREG 9 VCS GND PREDRIVER U V FR W 8 7 6 Figure 2. Block diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Electrical characteristics (Unless otherwise specified Ta=25°C, VCC=5V) Parameter Symbol Limit Min Typ Max Unit Conditions Circuit current STB ICST - 20 50 µA Circuit current ICC 2.4 5.5 8.6 mA PWM input H level VPH 2.5 - VCC V PWM input L level VPL 0 - 0.7 V PWM input current H IPH - 0 1 µA PWM=VCC PWM input current L IPL -50 -20 - µA PWM=GND Input frequency fP 20 - 50 kHz FR input H level VOH 2.5 - VCC V FR=H : Normal rotation FR input L level VOL 0 - 0.5 V FR=L; Reverse rotation TOSC frequency fOSF 28 40 52 kHz TOSC-GND 2200pF TOSC charge current IOCC -137.5 -110 -82.5 µA TOSC=0.5V TOSC discharge current IODC 75 100 125 µA TOSC=1.0V VFGL - - 0.4 V IFG＝5mA Output voltage VO - 0.25 0.325 V Io＝250mA (H.L. total) PWM off time tPO 0.3 1 2 ms Lock protection det. time tLDT 0.6 0.9 1.5 s Lock protection rel. time tLRT 3.3 5.0 8.3 s FG low voltage About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Typical Performance Curves 1 (Reference data) 60 8 Operating range Operating range 40 Circuit current: ICC [mA] Circuit current STB: ICST [µA] 50 25°C 30 –25°C 20 10 25°C 6 –25°C 5 4 3 2 1 0 0 0 1 2 3 4 5 6 0 7 1 2 3 4 5 6 7 Supply voltage: VCC [V] Supply voltage: VCC [V] Figure 3. Circuit current STB Figure 4. Circuit current 10 60 Operating range Operating range -10 –25°C 25°C 95°C -20 –25°C 50 TOSC frequency: fOSF [kHz] 0 PWM input current: Ipx [µA] 95°C 7 95°C 25°C -30 95°C -40 –25°C 40 25°C 95°C 30 20 10 -50 -60 0 0 1 2 3 4 5 6 7 Supply voltage: VCC [V] 1 2 3 4 5 6 Supply voltage: VCC [V] Figure 5. PWM input current www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 6. TOSC frequency 4/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 7 Datasheet BD6326NUX Typical Performance Curves 2 (Reference data) 150 0 -25 TOSC discharge current: I ODC [µA] TOSC charge current: IOCC [µA] Operating range Operating range -50 -75 95°C 25°C –25°C -100 -125 -150 125 –25°C 25°C 100 95°C 75 50 25 0 0 1 2 3 4 5 6 7 0 1 Supply voltage: VCC [V] 4 5 6 7 Figure 8. TOSC discharge current 0.5 0.5 0.4 0.4 FG low voltage: VFGL [V] FG low voltage: VFGL [V] 3 Supply voltage: VCC [V] Figure 7. TOSC charge current 0.3 95°C 0.2 2 25°C –25°C 0.1 0.3 2.2V 5V 5.5V 0.2 0.1 0 0 1 2 3 4 5 6 0 7 0 Output sink current: IO [mA] 2 3 4 5 6 Output sink current: IO [mA] Figure 9. FG low voltage (VCC=5V) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 Figure 10. FG low voltage (Temp=25℃) 5/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 7 Datasheet BD6326NUX Typical Performance Curves 3 (Reference data) 0 Output high side voltage: VOH [V] Output high side voltage: VOH [V] 0 -0.2 –25°C 25°C -0.4 95°C -0.6 -0.8 -1 -0.2 5.5V -0.4 5V 2.2V -0.6 -0.8 -1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 0.1 Output source current: IO [A] 0.3 0.4 0.5 0.6 0.7 Output source current: IO [A] Figure 12. Output high side voltage (Temp=25℃) Figure 11. Output high side voltage (VCC=5V) 1 Output low side voltage: VOL [V] 1 Output low side voltage: VOL [V] 0.2 0.8 0.6 95°C 0.4 25°C –25°C 0.2 0.8 0.6 2.2V 0.4 5V 5.5V 0.2 0 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Output sink current: IO [mA] Output sink current: IO [mA] Figure 14. Output low side voltage (Temp=25℃) Figure 13. Output low side voltage (VCC=5V) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 6/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Typical Performance Curves 4 (Reference data) 2 2 Operating range Lock protection det.time: t LDT [s] Operating range PWM off time: tPO [ms] 1.5 1 95°C 25°C –25°C 0.5 0 0 1 2 3 4 5 6 7 Supply voltage: VCC [V] 1.5 1 –25°C 25°C 95°C 0.5 0 0 1 2 3 4 5 6 Supply voltage: VCC [V] Figure 16. Lock protection det.time Figure 15. PWM off time 10 Lock protection rel.time: t LRT [s] Operating range 8 6 –25°C 25°C 95°C 4 2 0 0 1 2 3 4 5 6 7 Supply voltage: VCC [V] Figure 17. Lock protection rel.time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 7 Datasheet BD6326NUX Timing chart 1) Sensorless Drive BD6326NUX is a motor driver IC for driving a three-phase brushless DC motor without a hall sensor. Detecting a rotor location firstly at startup, an appropriate logic for the rotation direction is obtained using this information and given to each phase to rotate the motor. Then, the rotation of the motor induces electromotive voltage in each phase wiring and the logic based on the induced electromotive voltage is applied to the each phase to continue rotating. 1.1 BEMF detection driving mechanism (synchronized start-up mechanism) BD6326NUX’s start mechanism is synchronized start-up mechanism. BD6326NUX as BEMF detection driving starts by set output logic and monitors BEMF voltage of motor. Driving mechanism changes to BEMF detection driving after detect BEMF signal. When BEMF signal isn’t detected for constant time at start-up, synchronized start-up mechanism outputs output logic forcibly by using standard synchronized signal (sync signal) and makes motor forward drive. This assistance of motor start-up as constant cycle is synchronized driving mechanism. Synchronized frequency is standard synchronized signal. Figure 18, the timing chart (outline) is shown. “Motor start-up frequency setting” generation of synchronized period is shown. Start Start sine-wave driving Output voltage U Output voltage V Output voltage W BEMF detection signal (internal signal) Synchronized driving Rotational direction monitor section Until BEMF detection 15times Until BEMF detection 3times of output U Sine driving BEMF detection of output U Figure 18. Timing chart at startup Table 1. Setting of electrify angle and output duty while start-up Number of BEMF detection (from start-up) Start-up Until　BEMF (output U,V,W) detection 15times successively Synchronized time 8000 × TOSC PWM duty PWM = fixed 100% Electrify angle 150° drive Until BEMF detection 3times of output U After BEMF detection 3times of output U (after BEMF moniter section) Output off mode (BEMF moniter section) PWM control Sine-wave * Disagree with above timing chart www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX 1.2 Motor start-up frequency setting (TOSC capacitor) The TOSC terminal starts a self-oscillation by connecting a capacitor between the TOSC terminal and GND. It becomes a start-up frequency, and synchronized time. Synchronized time can be adjusted by changing external capacitor. When the capacitor value is small, synchronized time becomes short. It is necessary to choose the best capacitor value for optimum start-up operation. For example external capacitor is 2200pF, synchronized time is 200ms (Typ). 1000pF is recommended for setting value at first. Relationship between external capacitor and synchronized time is shown in below. < Diagram of Relationship between TOSC terminal and synchronized time > TOSC TOSC signal oscillator Divider Sync signal (X8000) CTOSC Synchronized time = 8000 x TOSC period Charge current : 100µA discharge current : 100µA Figure 19. TOSC terminal and synchronized time Equation Tosc = 2 x CTOSC VTSOC I CTOSC : TOSC terminal capacitor value VTOSC : TOSC terminal Hi voltage – Lo voltage= 0.57V (Typ) I: TOSC terminal charge and discharge current Table 2. Capacitor values and synchronized time Example CTOSC = 2200pF TOSC frequency = 40kHz (Typ) TOSC period = 25µs Synchronized time = 200ms External capacitor Synchronized time 2200pF 200ms 1000pF (Recommendation) 90ms 670pF 60ms ※Setting of Appropriate capacitor value Appropriate value of synchronized time is differing with characteristic and parameter of motor. Appropriate value decided by start-up confirmation with various capacitor values. At first confirm start-up with 1000pF, next is 1200,1500,2200pF･･･,and 820,680pF･･･etc. Appropriate capacitor value is decided after confirm maximum start-up NG value and minimum start-up NG value. For example, small BEMF voltage motor tends to small capacitor value. Set capacitor value after confirm sufficiently. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX 1.3 U, V, W phase and FG output signals The timing charts of the output signals from the U, V and W phases as well as the FG terminal (at FR = Hi or no connected) is shown (Figure 20). The detection of the BEMF voltage does with output U and detects the position of the motor rotation. The three phases are driving in the order of U, V and W phases. About FG signal output, assuming that a three-slot tetrode motor is used, two pulse outputs of FG are produced for one motor cycle. STAGE Position[deg] 0 60 120 180 240 300 360 60 120 180 240 300 360 Output Voltage U Output Voltage V Output Voltage W FG signal Position U V U W V U WV U W V U W V U WV U W V U U W V W V U W V U W V U WV U W V U W V U WV U W V U U W V WV W Figure 20. Timing chart of U, V, W, FG output signal (FR= Hi or no connect) Table 3. Truth table of normal operation Output pattern Motor output Motor output U Motor output V Motor output W PWM L PWM 2 PWM L→PWM PWM→L 3 PWM→Hi-Z（ BEMF detect) PWM L 4 PWM→L PWM L→PWM 1 5 L PWM PWM 6 L→PWM PWM→L PWM * About the output pattern, It changes in the flow of “1→2→3 ～ 6→1”. H; High, L; Low, Hi-Z; High impedance FG signal is masked between synchronized driving section (FG = Hi level). The FG signal is output from Rotation speed monitor section. start PWM Output voltage U Output voltage V Output voltage W FG FG mask mode driving (The synchronized driving) FG normal output Figure 21. About FG mask section www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX 2) UVLO (Under voltage lock out circuit) In the operation area under the guaranteed operating power supply voltage of 2.2 V (Typ), the transistor on the output can be turned OFF at a power supply voltage of 1.73V (Typ). A hysteresis width of 270mV is provided and a normal operation can be performed at 2.0V. This function is installed to prevent unpredictable operations, such as a large amount of current passing through the output, by means of intentionally turning OFF the output during an operation at a very low power supply voltage which may cause an abnormal function in the internal circuit. 3) Lock Protection Feature (motor stop at start-up), Automatic Recovery Circuit To prevent passing a coil current on any phase when a motor is locked, it is provided with a function which can turn OFF the output for a certain period of time and then automatically restore itself to the normal operation. During the motor rotation, an appropriate logic based on the induced electromotive voltage can be continuously given to each phase; on the other hand, when the motor is locked at, no induced electromotive voltage is obtained. Utilizing this phenomenon to take a protective against locking, when the induced electromotive voltage is not detected for a predetermined period of time (TON: 0.9sec(Typ)), it is judged that the motor is locked and the output is turned OFF for a predetermined period of time (TOFF: 5.0sec(Typ)). Moreover, if Synchronized driving doesn't change into Rotational speed monitor section between TON (0.9sec(Typ)) at start-up, it is judged that the motor is locked. The timing chart is shown (Figure 22). Motor-restart Motor-restart BD6326NUX: Motor Lock detect at Start-up Induced electromotive voltage detection Not detecting TOFF Output Motor-Lock OFF Not detecting TON TOFF TON ON OFF ON FG = Hi FG ・Lock on detect time TON = 0.9sec (Typ) ・motor lock time TOFF = 5.0sec (Typ) Condition) a) motor stops b) Failure of BEMF detection 15times successively until 0.9sec FG fixed Hi during motor lock Figure 22. Lock protection operation www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX 4) Power saving function / Speed control by PWM input The power saving function is controlled by an input logic of the PWM terminal. (a) Perate mode when the PWM terminal is High. (b) Standby mode when the PWM terminal is Low for a time period of 1ms (Typ). When the PWM terminal is open, High logic is set. Input logic of the PWM terminal is set at Low and then the Standby mode becomes effective 1ms (Typ) (Figure 23). In the Standby mode, the lock protection function is deactivated and the lock protection is not effective. Therefore, this device can start up instantly even from the stop state when the input logic of the PWM terminal is set at High. PWM 1ms Power saving function normal mode standby　mode Output ON OFF ON Lock protection function active inactive active normal mode Figure 23. The power saving function ・Speed Control by PWM input Depending on the Duty value of the input signal on the PWM terminal, the output is controlled by switching between ON and OFF. The higher Duty value results in the higher motor rotation speed, while the lower Duty values the lower speed. 5) Pole select (FG signal select terminal) The FR terminal selects motor rotation direction (Table 4). Table 4. FR table FR High (or open) Low www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/22 Rotation Direction Normal Rotation Reverse Rotation TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Application circuit example (Constant values are for reference) Figure 24. PWM controllable 4 wires type (FG) motor application circuit Substrate design note a) IC power, motor outputs, and IC ground lines are made as fat as possible. b) IC ground (signal ground) line arranged near to (–) land. c) The bypass capacitor is arrangement near to VCC terminal. d) When substrates of outputs are noisy, add capacitor as needed. e) When back EMF is large, add zener diode as needed. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Power dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc., and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θja [°C/W]. This heat resistance can estimate the temperature of IC inside the package. Figure 25 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja = (Tj – Ta) / P [°C/W] Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal de-rating curve indicates a reference value measured at a specified condition. Figure 26 shows a thermal de-rating curve (Value when mounting FR4 glass epoxy board 74.2 [mm] x 74.2 [mm] x 1.6 [mm] (copper foil area below 3 [%])). Thermal resistance θjc from IC chip joint part to the package surface part of mounting the above-mentioned same substrate is shown in the following as a reference value. θjc = 40 [°C/W] θja = (Tj -Ta) / P [°C/W] θjc = (Tj -Tc) / P [°C/W] Ambient temperature Ta[°C] Package surface temperature Tc[°C] Chip surface temperature Tj[°C] Power consumption P[W] Figure 25. Thermal resistance ＊1 Above Ta = 25ºC, derating by 4.64 mW/ºC (When glass epoxy board (single layer) of 74.2 mm x 74.2 mm x 1.6 mm is mounted) Figure 26. Thermal de-rating curve www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Safety measure 1) Reverse connection protection diode Reverse connection of power results in IC destruction as shown in Figure 27. When reverse connection is possible, reverse connection destruction preventive diode must be added between power supply and VCC. In normal energization Reverse power connection VCC After reverse connection destruction prevention VCC VCC Circuit block Each pin Circuit block Each pin Circuit block GND Large current flows Æ Thermal destruction GND Internal circuit impedance high Æ amperage small Each pin GND No destruction Figure 27. Flow of current when power is connected reversely 2) Measure against VCC voltage rise by back electromotive force Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse connection protection diode is connected. VCC voltage rises because no route is available for regenerating to power. ON ON ON Phase switching ON Figure 28. VCC voltage rise by back electromotive force When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (A) Capacitor or (B) Zener diode between VCC and GND. In addition, also take the measure (A) and (B) as shown in (C) if required. (B) Zener diode (A) Capacitor ON ON ON ON (C) Capacitor and zener diode ON ON Figure 29. Measure against VCC voltage rise www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX 3) Problem of GND line PWM switching Do not perform PWM switching of GND line because the potential of GND terminal cannot be kept at the minimum. VCC Motor Driver M Controller GND PWM input Prohibited Figure 30. GND Line PWM switching prohibited 4) FG output FG output is an open drain and requires pull-up resistor. The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG output terminal is directly connected to power supply, could damage the IC. VCC Pull-up resistor FG Protection Resistor R1 Connector of board Figure 31. Protection of FG terminal Location of IC 1) Generally, three-phase sensorless driver is rotated motor by detecting the induced electromotive voltage. Line noise, line resistance is influenced for detecting the induced electromotive voltage. From motor to IC line should be shorted, its suggest that location of IC is on the board of Motor in below Figure 32. 2) In three-phase sensorless and variable speed driver, it is necessary to tuning motor and IC (each motor units). Motor Motor IC IC Board Board Figure 32. Location of IC www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX I/O equivalent circuits (Resistance is typical.) 1) Power supply terminal, and ground terminal 2) Output duty controllable input terminal VCC VCC VCC 3) Motor rotation direction select input terminal Vcc 190kΩ 250kΩ PWM FR 1kΩ 24kΩ GND 4) Start-up oscillation control terminal 5) Speed pulse signal output terminal 6) Motor coil midpoint input terminal VCC 1kΩ 1kΩ 10Ω FG COM 1kΩ 1kΩ 1kΩ TOSC 7) Motor output terminal Vcc U V 51kΩ 30kΩ W 30kΩ 51kΩ 51kΩ 30kΩ 0.16Ω Figure 33. I/O equivalent circuits www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Operational Notes 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 34. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown (TSD) Circuit This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature will rise which will activate the TSD circuit that will turn OFF all output pins. When the junction temperature falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Ordering Information B D 6 3 2 6 Part Number BD6326 N U X Package NUX: VSON010X3030 E2 Packaging and forming specification E2: Embossed tape and reel Marking diagram VSON010X3030 (TOP VIEW) Part Number Marking D 6 3 LOT Number 2 6 1PIN MARK www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Physical Dimension Tape and Reel Information Package Name VSON010V3030 Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 21/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet BD6326NUX Revision History Date Revision 7. May. 2013 11.Dec.2014 001 002 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes New Release Changed the latest format 22/22 TSZ02201-0H1H0B100530-1-2 11. Dec. 2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001