BD7763EFV-E2

System LSIs for Blu-ray Drive System Motor Driver IC for Half Height Drive(Sensor less) BD7763EFV General Description BD7763EFV are 9ch system motor driver ICs, developed for the spindle motor, actuator coil, stepping motor, SA stepping motor and the loading motor drive of the Blu-ray drive. Since spindle driver adopts sensor less drive system and the hall sensor (3 pieces) of the motor position detection is not needed, it is suitable for making of flexible cable conserve wiring and the reductions of external parts. The actuator, loading driver, the spindle, stepping, and SA stepping use power MOSFET to reduce power consumption. Package(s) HTSSOP-B54 Applications  For Blu-ray drive Features  The hall sensor is not needed by 3-phase sensor less drive system.  The spindle motor driver achieves stability high speed start by ROHM's own energizing method.  Spindle, stepping and SA stepping achieve high efficiency drive by PWM control driver. The actuator is able to reduce power consumption by using PWM drive system.  The loading adopts forward/reverse-rotation drive system.  ON/OFF of loading and other channels, brake mode of spindle driver, and stand-by mode are selectable by the two control terminals.  Built-in thermal-shut down circuit.  Improved heat radiation efficiency utilizing lm-type HTSSOP package with good thermal conductivity. 18.5mm x 9.5mm x 1.0mm R2 R1 DVCC 28 SPLIM 29 MTR_R 30 GND 31 SPVM 32 COM RDET 33 W 34 V 35 U 36 SPGND 10k 37 SADETOUT 38 SLVM 39 SLO2- SLO2+ 40 41 42 SLO1- 12V SLO1+ 43 SL/SAGND 44 SAO2- SAO2+ 12V 45 46 SAO1- 47 SAO1+ 10k 48 49 SLDET 50 SAVM 51 SLIN1 52 SLIN2 53 SAIN1 54 SAIN2 5V SLDETOUT STM STM Typical Application Circuit(s) SW BEMF DETECTER CURR. LIMIT OSC CURR. FEED FF OSC FF Logic OSC PRE Logic CURR.FEED CURR.FEED AMP OSC OSC PRE Logic LEVEL SHIFT LEVEL SHIFT PR E Logic AMP PR E Logic SW DETECTER CUR R. LIM IT FC1 CTL FC2 CTL 27 C_OUT C_COM 25 10k FG 26 24 CTL1 23 CTL2 PULL_CTL STBY BRAKE CONTROL 22 21 20 SPIN 19 PULL_BIAS 12V or 5V LDIN 18 LDVM 17 LDO+ LDO- 16 AGND 14 5V 15 TKO+ 13 TKO- 12 PULL FCO2+ 11 FCO2- FCO1- 10 9 FCO1+ 8 FC1IN FC2IN 7 6 TKIN 5 AVM VC 4 3 12V VCC 2 SADET 1 DVCC PR E Logic M 5V PROTECT T.S.D PRE Logic LEVEL SHIFT PRE Logic DETECTER PRE Logic OSC NF AMP OSC NF AMP OSC NF AMP LEVEL SHIFT 1000pF 3.3V ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays. 1/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV Pin Description(s) No. Symbol 1 DVcc 2 SADET 3 Description No. Symbol Description Adjustable resistor connection for spindle driver current limit PWM block control power supply 28 SPLIM SA motor detection signal control input 29 MTR_R Vcc Pre block power supply 30 GND 4 VC Reference voltage input 31 SPVM Spindle driver power supply 5 AVM Actuator driver block power supply 32 COM Motor coil center point input 6 TKIN Tracking driver input 33 W Spindle driver output W 7 FC2IN Focus 2 driver input 34 V Spindle driver output V 8 FC1IN Focus 1 driver input 35 U Spindle driver output U 9 FCO1+ Focus 1 driver positive output 36 SPGND 10 FCO1- Focus 1 driver negative output 37 11 FCO2- Focus 2 driver negative output 38 SLVM Sled motor driver power supply 12 FCO2+ Focus 2 driver positive output 39 SLO2- Sled driver 2 negative output 13 TKO- Tracking driver negative output 40 SLO2+ Sled driver 2 positive output 14 TKO+ Tracking driver positive output 41 SLO1- Sled driver 1 negative output 15 AGND Actuator/Loading driver power ground 42 SLO1+ Sled driver 1 positive output 16 LDO- Loading driver negative output 43 SL/SAGND 17 LDO+ Loading driver positive output 44 SAO2- SA driver 2 negative output 18 LDVM Loading driver block power supply 45 SAO2+ SA driver 2 positive output 19 LDIN Loading driver input 46 SAO1- SA driver 1 negative output 20 SPIN Spindle driver input 47 SAO1+ SA driver 1 positive output motor start pattern adjustment terminal Pre block ground Spindle driver power ground SADETOUT SA motor detection signal output Sled/SA driver block pre and power ground 21 PULL_BIAS Pick-up pull current control terminal 48 SLDETOUT Sled motor detection signal output 22 PULL_CTL Pick-up pull control terminal 49 SLDET Sled motor detection signal control input 23 CTL2 Driver logic control 2 input 50 SAVM SA driver power block power supply 24 CTL1 Driver logic control 1 input 51 SLIN1 Sled driver 1 input 25 FG Frequency generator output 52 SLIN2 Sled driver 2 input 26 C_COM 53 SAIN1 SA driver 1 input 27 C_OUT 54 SAIN2 SA driver 2 input Smooth capacitor connection terminal (com side) Smooth capacitor connection terminal (output side) *Positive/negative of the output terminals is determined in reference to those of the input terminals. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV Block Diagram(s) 1 SADET 2 DETECTER VCC 3 LEVEL SHIFT VC 4 LEVEL SHIFT AVM 5 TKIN 6 FC2IN 7 FC1IN 8 DETECTER SW O SC PRE Logic 9 FC1 CTL FCO 1- NF AMP AMP 10 O SC PRE Logic FCO 2+ 11 FC2 CTL FCO 2- 12 54 SAIN2 53 SAIN1 52 SLIN2 51 SLIN1 50 SAVM 49 SLDET 48 SLDETO UT 47 SAO1+ 46 SAO1- 45 SAO2+ 44 SAO2- 43 SL/SAGND 42 SLO 1+ 41 SLO 1- 40 SLO 2+ 39 SLO 2- 38 SLVM 37 SADETO UT 36 SPG ND 35 U 34 V 33 W 32 CO M 31 SPVM O SC AMP NF AMP PRE Logic FCO 1+ PRE Logic DVCC O SC LDO - 16 FF O SC 17 CURR.FEED SW 18 SPIN 20 PULL_BIAS 21 PULL_CTL 22 LEVEL SHIFT CURR. FEED T.S.D Logic 19 BEMF DETECTER LDIN O SC LEVEL SHIFT LDVM O SC CURR. LIMIT PRE Logic 15 O SC FF AG ND LDO + PRE Logic 14 NF AMP PRE Logic TKO + 13 PULL TKO - PRE Logic CURR.FEED PROTECT 23 CTL1 24 FG 25 30 G ND C_COM 26 29 M TR _R C_O UT 27 28 SPLIM www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 CURR. LIMIT STBY BRAKE CONTROL CTL2 3/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV Absolute Maximum Ratings Parameter POWER MOS power supply voltage 1 POWER MOS power supply voltage 2 Pre block power supply voltage PWM control block power supply voltage Power dissipation Operating temperature range Storage temperature Junction temperature Symbol SPVM、SLVM、LDVM SAVM、AVM Vcc DVcc Pd Topr Tstg Tjmax Limits 15 7 15 7 2.00 -20～75 -55～150 150 ♯1 ♯2 ♯3 Unit V V V V W ℃ ℃ ℃ ♯1 POWER MOS output terminals (16~17pin, 39~42pin, 33~35pin) are contained. ♯2 POWER MOS output terminals (9~14pin,44~47pin) are contained. ♯3 PCB mounting (70mmX70mmX1.6mm, occupied copper foil is less than 3%, glass epoxy standard board). Reduce by 16mW/ over 25 Recommended Operating Rating(s) Parameter Symbol SPVM、SLVM Vcc LDVM SAVM、AVM DVcc Iosp Ioo Spindle / Sled motor driver power block power supply voltage Pre block power supply voltage Loading driver Pre block / power block supply voltage SA, Actuator driver power block power supply voltage PWM control block power supply voltage Spindle driver output current Actuator, SA, sled, loading motor driver output current Min. － 10.8 4.3 4.3 4.3 － － Typ. Vcc♯4 12 5.0 5.0 5.0 1.0 0.5 Max. － 13.2 Vcc 5.5 5.5 2.5♯5 0.8 Unit V V V V V A A ♯4 Set the same supply voltage to SPVM, SLVM and Vcc. ♯5 The current is guaranteed 3.5A in case of the Short-circuit braking mode and the current which is turned on/off in a duty-ratio of less than 1/10 with a maximum on-time of 5msec. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV Electrical Characteristic(s) （Unless otherwise noted, Ta=25℃、Vcc=SPVM=SLVM=12V、DVcc=AVM=SAVM= LDVM=5V、Vc=1.65V、RL=8Ω、RLSP=2Ω、RDET=0.33Ω） Parameter Symbol MIN. TYP. MAX. Unit Condition IQ1 IQ2 IQ3 IST1 IST2 － － － － － 4.3 4.4 14 2.2 1.5 13 13 42 5 4 mA mA mA mA mA Vcc（at loading OFF） Vcc（at loading ON） DVcc Vcc DVcc VDZSL gmSL RONSL ILIMSL foscSL 0 0.86 － 0.8 － 30 1.15 2.2 1.1 100 80 1.44 3.3 1.4 － mV A/V Ω A kHz IL=500mA 55 1.15 90 1.44 mV A/V Circuit current Quiescent current 1 Quiescent current 2 Quiescent current 3 Standby-on current 1 Standby-on current 2 Sled driver block Input dead zone (one side) Input output gain Output On resistor (top and bottom) Output limit current PWM frequency Spindle driver block＜Torque instruction input / output＞ Input output gain VDZSP gmSP Output On resistor (top and bottom) RONSP － 1.0 1.7 Ω Output limit current ILIMSP foscSP 0.88 － 1.04 167 1.20 － A kHz 2.3 － 3.2 0.15 － 0.3 V V Voltage gain VOFACT RONACT GVACT -50 － 15.7 0 1.5 17.5 50 2.5 19.3 mV Ω dB Relative gain difference (FC1,FC2) △GVFC -1.0 0 1.0 dB PWM frequency foscACT 200 280 360 KHz VDZSA GVSA RONSA foscSA 10 15.5 － 200 40 17.5 1.3 300 80 19.5 2.5 400 mV dB Ω kHz VOFLD+ Input threshold voltage（INVc） IL=500mA CTL1、CTL2 Input high voltage Input middle voltage Input low voltage PULL_CTL Input high voltage Input low voltage Others VC input current VC drop-muting VC over voltage muting Vcc drop-muting IVC VMLVC VMUVC VMVcc www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 0.4 2.0 3.45 5/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV Functional description 1-1. Driver logic control terminal 1and 2 (CTL1,2) All drivers and spindle-drive braking modes can be switched on/off by inputting combinations of H-level signal (higher than 2.7V and lower than 3.7V), L-level(open) signal (lower than 0.5V) and M-level signal (higher than 1.4V and lower than 2.0V). Driver ON/OFF logic table mode ① ② ③ ④ ⑤ ⑥ ⑦ CTL1 CTL2 SP SL(2ch) ACT(3ch) SA(2ch) LOADIN G L H M L、H M L、H M L L L H H M M × × × ○ ○ ○ ○ × × Inner detection ○ ○ ○ Inner detection × × × ○ ○ ○ ○ × × Inner detection ○ Inner detection × × × ○ ○ × × × × ○:ON ×:OFF ① Stand-by mode The IC is brought into stand-by mode, and its power dissipation can be limited. ② Drivers muting All output channels, except the loading, are muted and their outputs are turned off. ③ SL/SA inner detection mode ④ Loading OFF mode ⑤ SA inner detection mode ⑥ SA mute mode ⑦ SL inner detection mode Spindle braking mode table mode CTL1 CTL2 ⑧ ⑨ ⑩ M L H M、H M、H M、H SPIN ＞ VC SPIN Forward-rotation mode ＜ VC Reverse-rotation braking mode Short-circuit braking mode Reverse-rotation braking mode ⑧⑩Reverse-rotation braking mode (spindle) When SPIN < VC, all outputs are shorted to SPVM in 4500rpm (Typ.) or more. In less than 4500rpm (Typ.), the outputs become reverse-rotation braking mode. Rotation speed is less than 140rpm when SPIN < VC, all outputs are shorted to SPVM. (However, the above-mentioned rotational speed is expressed in the case of 12pole motor.) ⑨ Short-circuit braking mode (spindle) All spindle driver outputs are shorted to SPVM when SPIN < VC. 1-2．Spindle output mode The spindle output changes as follows by the setting of SPIN. Rotation speed 0rpm SPIN＞VC 120°energizing SPIN＜VC 120°energizing www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 400rpm 4500rpm 150°energizing 150°energizing 6/15 Short brake TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV 2．Output limit for spindle (SPLIM) A=3844 ILIMSP = A (RSPLIM[Ω ] + 5600)×(RDET)[Ω ] [A] 3．Torque command (SPIN) (SLIN1,2) Torque command inputs vs. peak current value Iop of Iosp or Ioo is expressed in the figure below: The gain is defined by the inclination between two points. (Please exclude the dead zone from the input voltage when calculating Iop. ) Iop Forward rotation Input dead zone + Input dead zone - Gain SPIN SLIN1,2 VC 4．FG output (FG)） 3FG output begins after 900°degrees in electric angle, after the start mode ends and the BEMF detection starts. When the rotational speed becomes 24rpm (Max.) or less in case of brake, the FG output is fixed to high. The above-mentioned rotation speed applies to the 12 pole motor. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV 5．Input/Output timing chart BEMFU 》 》 BEMFV 》 》 BEMFW 》 》 》 》 》 》 》 》 》 》 SPIN VC SOURCE U MID SINK SOURCE V MID SINK SOURCE W MID SINK Ⅰ) Forward-rotation Ⅱ) Reverse-rotation braking mode mode Ⅱ) Short-circuit braking mode 6．Motor start pattern adjustment terminal (MTR_R) There are eight pattern setting of MTR_R. The voltage change can be canceled by connecting the power supply of external resistance R1 and R2 with DVCC. It is as follows of energizing time and a set voltage of MTR_R. Please decide a set pattern by the adjustment with the spindle motor. MTR_R DVCC R1 Pattern Energizing time [us] 1 2 3 4 5 6 7 8 14 17 24 34 48 68 92 126 R2 MTR_R setting voltage[V] 4.24 5 3.75 3.24 2.75 0 2.22 1.76 R1 R2 10kΩ 10kΩ 10kΩ 12kΩ 18kΩ open 15kΩ 22kΩ 56kΩ open 30kΩ 22kΩ 22kΩ 10kΩ 12kΩ 12kΩ The MTR_R setting voltage is a value in DVCC=5V. 7．Pick-up lens pull function PULL_CTL Function L H ON Normal (function:OFF) FOCUS 1 and the FOCUS2 load are driven by the charge of the electrolytic capacitor connected with VCC (3pin). The load drive current flows as follows. FCO1-(10pin)→FCO1+(9pin) FCO2-(11pin)→FCO2+(12pin) The load drive current and time can be adjusted according to the voltage of VCC(3pin) and PULL_BIAS(21pin). After 30 ms(Typ.) when PULL_CTL is made L, the FET Gate voltage is clamped to 1.67V(Typ.). The above-mentioned clamping function does not work when the DVcc drop-muting operates. Please turn off this function by PULL_CTL=H when you use the driver usually. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV 8．Inner detection function ○Sled BEMF of the motor is monitored according to timing for the sled input signal of micro step drive to pass VC, and Sled is detected reaching the inner. The judgment voltage of BEMF can be set according to the voltage input to the SLDET. If BEMF below the judgment voltage is detected twice continuously, it becomes SLDETOUT=L. When the motor starts, the SLDETOUT might become L because BEMF is unstable. Please take measures such as installing the time of the mask when it starts for the detection prevention. Judgment voltage Vbemf[V] = 0.62×(SLDET[V] – VC[V]) + 0.66 ○SA BEMF of the motor is monitored according to timing for SA input signal of two aspect excitation drive to pass VC, and SA is detected reaching the inner. The judgment voltage of BEMF can be set according to the voltage input to the SADET. If BEMF below the judgment voltage is detected once, it becomes SADETOUT=L. When the motor starts, the SADETOUT might become L because BEMF is unstable. Please take measures such as installing the time of the mask when it starts for the detection prevention. Judgment voltage Vbemf[mV] = 31.6×SADET[V] + 3.4 9．PWM oscillation frequency The PWM oscillation for driving the spindle and sled is free running. The sled oscillating frequency is 100kHz (Typ.) The spindle oscillating frequency is 167kHz (Typ.) 10．Muting functions a）VC-drop muting When the VC voltage drops to a value lower than 0.7V (Typ.) or higher than 2.5V(Typ.), the outputs of all the channels are turned off. Please set the voltage of the VC from 1.0 to 2.0V. b）Vcc-drop muting When the voltage at DVcc terminal and Vcc terminal drop to lower than 3.85V (Typ.), the outputs of all the channels are turned off. c）Over voltage protection circuit When the voltage at SPVM terminal exceed 14.1V (Typ.), only the spindle block output is turned off. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV 11．Protect system１（Load protection function） If full drive continues 130ms(Typ.) to protect focus, tracking, and tilt coil, this function protects IC by turning off actuator output. ※The protection function can be reset by CTL1,2= L(stand-by mode), when the protection function operates and the output is turned off. 12．Protect system 2 (Connecting to VCC or GND) This function is to protect output POWER TR when the driver output connects to Vcc or GND. Spindle,SLED,Actuator,SA When SINK side POWER TR has been turned on, if the output voltage (SPVM/2&SLVM/2&AVM/2&SAVM/2 or more) is detected, the channel concerned will be turned off. When SOURCE side POWER transistor has been turned on, if the output voltage (SPVM/2&SLVM/2&AVM/2&SAVM/2 or less) is detected, the channel concerned will be turned off 13. Protection system 3（Over voltage input protection function） When detecting LDIN and SLIN1 input voltage more than DVCC×0.9＜TYP＞, this function protects motor by turning off the output. ※If protection function operates and output is turned off, protection function can be reset by CTL1，2 ＝L(stand by mode) 14．Thermal-shut down Thermal-shutdown circuit (over-temperature protection circuit) is built in to prevent the IC from thermal breakdown. Use the IC according to the thermal loss allowed in the package. In case the IC is left running over the allowed loss, the junction temperature rises, and the thermal-shutdown circuit works at a junction temperature of 175℃(Typ.) (the outputs of all the channels are turned off.). When the junction temperature drops to 150℃ (Typ.), the IC resumes operation. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV I/O equivalence circuit Three-phase motor driver output BEMF voltage detection input 3pin 31 10k 5k 27 34 33 26 35 5k 32 36 5k 10k 30pin PWM driver output ( SLED1,2) PWM driver output ( SA1,2) PWM driver output ( FC,TK,TL) 5 50 38 25k 25k 245k 39 40 41 42 44 45 46 47 245k 10k 10k 100k 9 10 12 14 11 13 15 43 43 PWM driver output ( LD) 100k PWM driver input ( FC,TK,TL) PWM driver input ( SLED1,2) 18 1pin 1pin 150k 6 16 17 150k 51 7 200 52 8 30pin 30pin 15 PWM driver input ( SA1,2) PWM driver input ( SP) PWM driver input ( LD) 1pin 53 3pin 1pin 50k 54 400k 19 20 200 30pin 50k 50k www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30pin 11/15 200 30pin TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV SADETOUT signal output FG signal output 38pin SLDETOUT signal output 3pin 30 1pin 3pin 30 37 SLED inner detection input(SLDET) 30 25 10k 48 49 10k 30pin 43pin 30pin 30pin Reference voltage input （VC) Motor start pattern adjustment terminal（MTR-R) SA inner detection input(SADET) 3pin 1pin 3pin 4 29 50k 30pin 40k 200 10k 10k 2 46k 30pin ×3 ×7 30pin 10k ×2 Spindle driver current limit (SPLIM) Driver logic control 2 input （CTL1,CTL2） 3pin 3pin 23 24 28 5.6k 30pin 50k 175k 235k 42k 100k 20k 20k 50k 30pin Pick-up pull control terminal(PULL_CTL) Pick-up pull current control terminal(PULL_BIAS) 3pin 3pin 20k 50k 22 220k 21 50k 175k 235k 50k 20k 20k 50k 30pin 30pin ×2 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV Operational Notes 1．Absolute maximum ratings We are careful enough for quality control about this IC. So, there is no problem under normal operation, excluding that it exceeds the absolute maximum ratings. However, this IC might be destroyed when the absolute maximum ratings, such as impressed voltages (Vcc, VM) or the operating temperature range(Topr), is exceeded, and whether the destruction is short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating is assumed. 2．Power supply line Due to switching and EMI noise generated by magnetic components (inductors and motors), using electrolytic and ceramic suppress filter capacitors(0.1μF) close to the IC power input terminals (Vcc and GND) is recommended. Please note: the electrolytic capacitor value decreases at lower temperatures. Current rush might flow momentarily by the order of turning on the power supply and the delay in IC with two or more power supplies. Note the capacity of the power supply coupling, width and drawing the power supply and the GND pattern wiring. Please make the power supply lines (where large current flow) wide enough to reduce the resistance of the power supply patterns, because the resistance of power supply pattern might influence the usual operation (output dynamic range etc…). 3．GND line The ground line is where the lowest potential and transient voltages are connected to the IC. 4．Thermal design Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough temperature margins. 5．Short circuit mode between terminals and wrong mounting Do not mount the IC in the wrong direction and be careful about the reverse-connection of the power connector. Moreover, this IC might be destroyed when the dust short the terminals between them or GND 6．Radiation Strong electromagnetic radiation can cause operation failures. 7．ASO(Area of Safety Operation.) Do not exceed the maximum ASO and the absolute maximum ratings of the output driver. 8．TSD(Thermal shut-down) The TSD is activated when the junction temperature (Tj) reaches 175℃(with 25℃ hysteresis), and the output terminal is switched to Hi-z. The TSD circuit aims to intercept IC from high temperature. The guarantee and protection of IC are not purpose. Therefore, please do not use this IC after TSD circuit operates, nor use it for assumption that operates the TSD circuit. 9．Inspection by the set circuit board The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please discharge electricity in each and all process. Moreover, in the inspection process, please turn off the power before mounting the IC, and turn on after mounting the IC. In addition, please take into consideration the countermeasures for electrostatic damage, such as giving the earth in assembly process, transportation or preservation. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV 10．Earth wiring pattern + This IC is a monolithic IC, and has P isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer and N-layer of each element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure below. When the GND voltage potential is greater than the voltage potential at Terminals A or B, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding elements close to said parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than GND(P substrate). Please do not apply the voltage to the input terminal when the power-supply voltage is not impressed. Moreover, please impress each input terminal lower than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage is impressing. Simplified structure of IC 11．Earth wiring pattern Use separate ground lines for control signals and high current power driver outputs. Because these high current outputs that flows to the wire impedance changes the GND voltage for control signal. Therefore, each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of external parts, it is similar to the above-mentioned. 12．Reverse-rotation braking In the case of reverse-rotation braking from high speed rotation, pay good attention to reverse electromotive force. Furthermore, fully check the voltage to be applied to the output terminal and consider the revolutions applied to the reverse-rotation brake. 13．About the capacitor between SPVM and SPGND The capacitor between SPVM and SPGND absorbs the change in a steep voltage and the current because of the PWM drive, as a result, there is a role to suppress the disorder of the SPVM voltage. However, the effect falls by the influence of the wiring impedance etc, if the capacitor becomes far from IC. Please examine the capacitor between SPVM and SPGND to arrange it near IC. 14．About wiring between SPVM and RNF Please be careful about the wiring resistor for power supply terminal (current detect terminal) of spindle. Detect resistor should be connected by being shorted to the IC as near as possible. 12V This area is considered as detect resistor. Please make wiring thick and short. Nearest to the IC 31 + SPVM RDET 3 Vcc Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet BD7763EFV Power dissipation : Pd (W) Power Dissipation 2.0 1.0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE : Ta (℃) Ordering Information B D 7 7 6 E 3 F V E2 Package EFV: HTSSOP-B54 Part Number Packaging and forming specification E2: Embossed tape and reel Physical Dimension Tape and Reel Information HTSSOP-B54 18.5±0.1 (MAX 18.85 include BURR) Embossed carrier tape (with dry pack) Quantiy 1PIN MARK 0.8 (5.0) 0.5±0.15 28 BD7763EFV 7.5±0.1 9.5±0.2 54 1 Tape +6° 4° −4° (6.0) 1.0±0.2 Product No. Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 27 +0.05 0.17 -0.03 Lot No. 0.08±0.05 1.0MAX 0.85±0.05 S 0.08 S 0.65 +0.05 0.22 -0.04 0.08 1pin M (Unit : mm) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Direction of feed Reel 15/15 TSZ02201-0P1P0B800260-1-2 19.NOV.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001