BD9535MUV-E2

High Performance Regulators for PCs Switching Regulator for DDR-SDRAM Cores BD9535MUV No.10030EBT34 ●Description BD9535MUV is a 2ch switching regulator controller with high output current which can achieve low output voltage (0.7V～ 2.0V) from a wide input voltage range (4.5V～25V). High efficiency for the switching regulator can be realized by utilizing an 3 TM external N-MOSFET power transistor. A new technology called H Reg is a Rohm proprietary control method to realize TM ultra high transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide load range. For the soft start/stop function, variable frequency function, short circuit protection function with timer latch, and tracking function are all built in. This 2ch switching regulator is specially designed for Chipset and Front Side Bus. ●Features 3 TM 1) 2ch H REG Switching Regulator Controller 2) Light Load Mode and Continuous Mode Changeable 3) Thermal Shut Down (TSD), Under Voltage LockOut (UVLO), Over Current (detect the peak current) Protection (OCP), Over Voltage Protection (OVP), Short circuit protection with built-in timer-latch 4) Soft start function to minimize rush current during startup 5) Switching Frequency Variable (f=200KHz～600kHz) 6) VQFN032V5050 package 7) Built-in Power good circuit 8) Adjustable to chip set spec by tracking function ●Applications Laptop PC, Desktop PC, LCD-TV, Digital Components www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/21 2010.07 - Rev.B Technical Note BD9535MUV ●Maximum Absolute Ratings (Ta=25℃) Parameter Symbol Ratings Unit Input Voltage 1 VCC 7 *1 V Input Voltage 2 VDD 7 *1 V Input Voltage 3 VIN BOOT Voltage BOOT-SW Voltage HG-SW Voltage VBOOT1/2 VBOOT1-VSW1, VBOOT2-VSW2 VHG1-VSW1, VHG2-VSW2 30 *1 V 35 *1 V 7 *1 V 7 *1 V LG Voltage VLG1/2 VDD V Setting for Output Voltage VREF1/2 VCC V VIs+1/2, VIs-1/2 VCC V SS Voltage VSS1/2 VCC V FS Voltage VFS VCC V VREG VCC V VILIM1/2 VCC V VEN1/2 *1 V 7 *1 V *1 V Output voltage VREG voltage Current Limit setting Voltage Logic Input Voltage PGOOD Voltage 7 VPGOOD1/2 CE Voltage VCE1/2 Power dissipation 7 Pd T.B.D W Operating Temperature Range Topr -10～+100 ℃ Storage Temperature Range Tstg -55～+150 ℃ Tjmax +150 ℃ Junction Temperature *1 Not to exceed Pd. ●Operating Conditions (Ta=25℃) Parameter Symbol Ratings Min. Max. Unit Input Voltage 1 VCC 4.5 5.5 V Input Voltage 2 VDD 4.5 5.5 V Input Voltage 3 VIN 3.0 28 V BOOT Voltage VBOOT1/2 4.5 30 V VSW1/2 -2 33 V BOOT-SW Voltage VHG1-VSW1, VHG2-VSW2 4.5 5.5 V Logic Input Voltage VEN1/2 0 5.5 V Setting Voltage for Output Voltage VREF1/2 0.7 2.0 V VIs+1/2, VIs-1/2 0.7 2.0 V tonmin - 100 nsec SW Voltage Is Input Voltage MIN ON time ★ This product should not be used in a radioactive environment. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/21 2010.07 - Rev.B Technical Note BD9535MUV ●Electrical Characteristics (unless otherwise noted, Ta=25℃ VCC=5V,VDD=5V,VEN=3V,VIN=12V,VREF=1.8V,RFS=68kΩ) Limits Parameter Symbol Unit Conditions MIN. TYP. MAX. [Whole Device] VCC bias current Icc - 1.4 2.0 mA VIN bias current IIN - 200 400 µA VCC standby current Istb - - 20 µA VEN1=VEN2=0V VIN standby current IIN_Stb - 20 40 µA VEN1=VEN2=0V EN Low voltage 1,2 VEN_low1,2 GND - 0.8 V VENth_con1,2 2.3 - 3.8 V VENth_sllm1,2 4.2 - 5.5 V IEN1,2 - 7 10 µA VREG1,2 2.475 2.500 2.525 V IREG=500µA Ta=-10～100℃*2 VCC threshold voltage VCC_UVLO 4.1 4.3 4.5 V VCC:Sweep up VCC hysteresis voltage dVCC_UVLO 100 160 220 mV VIN threshold voltage VIN_UVLO 2.4 2.6 2.8 V VIN hysteresis voltage dVIN_UVLO 100 160 220 mV VIN:Sweep down VREG threshold voltage VREG_UVLO 2.0 2.2 2.4 V VREG:Sweep up VREG hysteresis voltage dVREG_UVLO 100 160 220 mV VOUT_OVP1,2 VREF ×1.15 VREF ×1.20 VREF ×1.25 V VPGOOD_high1,2 VREF ×0.87 VREF ×1.07 VREF ×0.90 VREF ×1.10 VREF ×0.93 VREF ×1.13 V Ron_PGOOD1,2 - 1.0 2.0 kΩ TPGOOD1,2 150 250 350 µsec EN High voltage 1,2 (forced continuous mode) EN High voltage 1,2 (SLLMTM mode) EN bias current 1,2 VREG voltage [Under voltage lock out block] VCC:Sweep down VIN:Sweep up VREG:Sweep down [Over Voltage Protection block] VOUT threshold voltage 1,2 [Power Good block] VOUT Power Good Low voltage 1,2 VOUT Power Good High voltage 1,2 Discharge ON resistance 1,2 Delay time 1,2 *2 VPGOOD_low1,2 V Designed guarantee www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/21 2010.07 - Rev.B Technical Note BD9535MUV ●Electrical Characteristics (unless otherwise noted, Ta=25℃ VCC=5V,VDD=5V,VEN=3V,VIN=12V,VREF=1.8V,RFS=68kΩ) Limits Parameter Symbol Unit Conditions MIN. TYP. MAX. [H3REGTM Control block] ON Time1 ton1 400 500 600 nsec RFS=68kΩ MAX ON Time 1 Tonmax1 2.5 3.0 3.5 µsec MIN OFF Time 1 Toffmin1 500 600 700 nsec ton2 250 350 450 nsec RFS=68kΩ MAX ON Time 2 Tonmax2 2.5 3.0 3.5 µsec MIN OFF Time 2 Toffmin2 500 600 700 nsec RHGhon1,2 - 3.0 6.0 Ω RHGlon1,2 - 2.0 4.0 Ω RLGhon1,2 - 2.0 4.0 Ω RLGlon1,2 - 0.5 1.0 Ω ISS_char1,2 1.5 2 2.5 µA ISS_dis1,2 1.5 2 2.5 µA Discharge threshold voltage VSS_disth1,2 - 0.1 0.2 V Standby voltage VSS_STB1,2 - - 50 mV VIlim11,2 40 50 60 mV VILIM=0.5V VIlim21,2 170 200 230 mV VILIM =2.0V VReIlim11,2 -60 -50 -40 mV VILIM =0.5V VReIlim21,2 -230 -200 -170 mV VILIM =2.0V VIs offset voltage1,2 VIS_off1,2 VREF -3m VREF VREF +3m V REF bias current1,2 IREF1,2 -100 0 100 nA Is+ input current1,2 IIs+1,2 -100 0 100 nA VIs+=1.8V Is- input current1,2 IIs-1,2 -100 0 100 nA VIs-=1.8V Vthscp1,2 - VREF×0.7 - V tscp1,2 0.7 1 1.3 msec ON Time 2 [FET Driver block] HG upper side ON resistance 1,2 HG lower side ON resistance 1,2 LG upper side ON resistance 1,2 LG lower side ON resistance 1,2 [Soft Start block] Charge current Discharge current [Current Limit block] Current limit threshold voltage 1_1,2 Current limit threshold voltage 2_1,2 Reflux current limit threshold voltage1_1,2 Reflux current limit threshold voltage2_1,2 [Output Voltage Sense block] Ta=-10～100℃*2 [SCP block] Threshold voltage 1,2 Delay time 1,2 *2 Designed guarantee www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/21 2010.07 - Rev.B Technical Note BD9535MUV ●Block Diagram VCC VIN EN1 VREF VIN Reference Block VREG SS1 UVLO SS 2.5V BOOT1 2.5VReg SLLM1 BEN Soft Start/Stop Block HG1 EN1 EN2 REF × 0.7 SS× 0.7 Is-1 Delay H3 Reg Controller Block FS REF1 + + - SS IS-1 SW1 Driver Circuit SCP Thermal TSD Protection R Q V DD S LG1 SLLM1 Current Limit PGND1 OVP1 + - ILIM UVLO ILIM SCP TSD SLLM CE1 Is Is+1 ILIM1 PGOOD1 VCC Is-1 Is-2 EN2 VREF VIN Reference Block UVLO Delay REF2 H3Reg Controller Block R Q SLLM S SLLM2 Current Limit ILIM UVLO ILIM SCP TSD www.rohm.com BOOT2 HG2 SCP + + - © 2010 ROHM Co., Ltd. All rights reserved. SS2 Soft Start/StopBlock BEN GND PGOOD2 SS VIN SS IS-2 OVP1 OVP2 SLLM2 REF × 0.7 SS × 0.7 Is-2 POWER GOOD SW2 Driver Circuit VDD LG2 + - PGND2 OVP2 CE2 FS ILIM2 5/21 IS+2 IS-2 2010.07 - Rev.B Technical Note BD9535MUV 24 HG1 REF2 ILIM2 SS2 EN2 PGOOD2 CE2 25 16 26 15 27 14 28 13 29 12 30 11 31 10 32 9 BOOT1 1 ●Pin Function Table PIN No. PIN name 1 BOOT1 2 CE1 3 PGOOD1 4 EN1 5 SS1 6 ILIM1 7 REF1 8 VREG 9 FS 10 Is-1 11 Is+1 12 GND 13 VCC 14 Is+2 15 Is-2 16 VIN 17 REF2 18 ILIM2 19 SS2 20 EN2 21 PGOOD2 22 CE2 23 BOOT2 24 HG2 25 SW2 26 PGND2 27 LG2 28 VDD 29 LG1 30 PGND1 31 SW1 32 HG1 reverse FIN 17 2 3 4 5 6 7 VIN Is-2 Is+2 VCC GND Is+1 Is-1 FS 8 VREG SW1 18 REF1 PGND1 19 ILIM1 LG1 20 SS1 VDD 21 EN1 LG2 22 PGOOD1 PGND2 23 CE1 SW2 BOOT2 HG2 ●Pin Configuration PIN function HG driver power supply pin 1 Reactive pin 1 for lower ESR output capacitor Power good signal output pin 1 Enable input pin 1 (0～0.8V:OFF, 2.3～3.8V:continuous mode, 4.2～5.5V:SLLMTM) Connective pin 1 of capacitor for soft start/soft stop Current limitsetting pin 1 Output voltage setting pin 1 Reference voltage inside IC (Output : 2.5V) Resistance connective pin for setting frequency Current sense pin- 1 Current sense pin+ 1 Sense GND Power supply input pin Current sense pin+ 2 Current sense pin- 2 Battery voltage sense pin Output voltage setting pin 2 Current limit setting pin 2 Connective pin 2 of capacitor for soft start/soft stop Enable input pin 2 (0～0.8V:OFF, 2.3～3.8V:continuous mode, 4.2～5.5V:SLLMTM) Power good signal input pin 2 Reactive pin 2 for lower ESR output capacitor HG driver power supply pin 2 High side FET gate drive pin 2 High side FET source pin 2 Power GND2 Low side FET gate drive pin 2 Power supply input pin Low side FET gate drive pin 1 Power GND 1 High side FET source pin 1 High side FET gate drive pin 1 substrate www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/21 2010.07 - Rev.B Technical Note BD9535MUV ●Reference Data 100 100 90 VO 80 Efficiency[%] Efficiency[%] 80 60 40 VIN=7V VIN =12V VIN =19V 20 0 0.01 0.1 1 Load Current[A] 100[mV/div] 70 60 40 VIN=7V VIN =12V VIN =19V 30 20 IO 5[A/div] 10 0.01 10 Fig.1 Io-efficiency TM (SLLM ) HG LG 50 0.1 1 Load Current[A] 10 Fig.3 Transitional response (Io=0→5A) (Continuous mode) Fig.2 Io- efficiency (Continuous mode) VO VO VO 100[mV/div] 100[mV/div] 100[mV/div] HG LG HG LG HG LG IO 5[A/div] IO 5[A/div] IO 5[A/div] Fig.4 Transitional response (Io=5→0A) (Continuous mode) Fig.5 Transitional response (Io=0→5A) TM (SLLM ) Fig.6 VO VO VO HG SW LG HG SW LG HG SW LG Fig.7 SLLMTM : Io=0A Transitional response (Io=5→0A) TM (SLLM ) Fig.9 SLLMTM : Io=1A Fig.8 SLLMTM : Io=0.4A 500 EN Frequency [kHz 400 EN 300 200 100 Continuous mode VIN=7V VIN =12V VIN =19V 0 0.01 PGOOD PGOOD TM SLLM VIN=7V VIN =12V VIN =19V 0.1 1 Load Current[A] Fig.10 Io-Frequency www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. SS VO SS VO 10 Fig.11 starting wave 7/21 Fig.12 stopping wave 2010.07 - Rev.B Technical Note BD9535MUV ●Evaluation Board Circuit VDD VCC VCC U1 BD9535MUV VQFN032V5050 5V R1 VDD VDD C1 R2 12V 0.5V VREG VREG R3 C3 VCC R5 C6 R7 SW1 5V VREG C15 C14 C16 M1 SW1 VREG(2.5V) SW1 R32 LG1 LG1 C4 PGND1 R8 C18 D3 M1 R33 R38 C5 Is-1 ILIM1 R10 C19 C20 R39 R59 Is+1 R9 1.8V/5A R37 L1 EN1 3V 0V R6 EN1 HG1 HG1 VIN R4 C13 VIN R31 C2 VIN D1 BOOT1 VDD VREG GND PGND1 PGND2 GND PGND VCC C21 R41 R60 PGOOD1 PGOOD1 REF1 VDD 1.8V R14 R11 TRACK1 D2 C7 EN2 VREG SW2 5V 3V R19 R12 C23 VIN SS1 VCC BOOT2 C8 R16 0V SW2 C9 R17 0.5V R44 HG2 R45 SW2 HG2 EN1 R18 ILIM2 C24 M2 PGND2 C10 R21 R46 R23 R51 Is-2 REF2 R26 C11 FS SS2 C12 GND R52 VCC C31 R62 PGOOD2 TRACK2 R24 C30 D4 R61 Is+2 1.2V 1.2V/5A R50 C28 C29 M2 VREG C26 L2 LG2 LG2 R20 C25 R54 PGOOD2 FS R57 R25 R58 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/21 2010.07 - Rev.B Technical Note BD9535MUV ●Evaluation Board Parts List Part No Value Company R1 10Ω ROHM R2 0Ω R3 Part No Value Company MCR03EZPF10R0 R54 100kΩ ROHM MCR03EZPF1003 ROHM MCR03EZHJ000 R57 75kΩ ROHM MCR03EZPF7502 1kΩ ROHM MCR03EZPF1001 R58 0Ω ROHM MCR03EZHJ000 R4 200kΩ ROHM MCR03EZPF2003 R59 100Ω ROHM MCR03EZPF1000 R5 51kΩ ROHM MCR03EZPF5102 R60 100Ω ROHM MCR03EZPF1000 R6 0Ω ROHM MCR03EZHJ000 R61 100Ω ROHM MCR03EZPF1000 R7 51kΩ ROHM MCR03EZPF5102 R62 100Ω ROHM MCR03EZPF1000 R8 91kΩ ROHM MCR03EZPF9102 C1 10µF MURATA GRM21 Series R9 0Ω ROHM MCR03EZHJ000 C2 10µF MURATA GRM21 Series R10 22kΩ ROHM MCR03EZPF2202 C3 0.01µF MURATA GRM18 Series R11 56kΩ ROHM MCR03EZPF5602 C4 1µF R12 0Ω ROHM MCR03EZHJ000 C6 0.1µF MURATA GRM18 Series R14 10kΩ ROHM MCR03EZPF1002 C7 0.1µF MURATA GRM18 Series R16 51kΩ ROHM MCR03EZPF5102 C8 0.047µF MURATA GRM18 Series R17 91kΩ ROHM MCR03EZPF9102 C10 0.1µF MURATA GRM18 Series R18 0Ω ROHM MCR03EZHJ000 C11 0.1µF MURATA GRM18 Series R19 200kΩ ROHM MCR03EZPF2003 C12 0.047µF MURATA GRM18 Series R20 51kΩ ROHM MCR03EZPF5102 C13 10µF R21 0Ω ROHM MCR03EZHJ000 C14 0.1µF R23 39kΩ ROHM MCR03EZPF3902 C15 R24 36kΩ ROHM MCR03EZPF3602 C18 200µF SANYO 2R5TPE220MF R25 0Ω ROHM MCR03EZHJ000 C21 100pF MURATA GRM18 Series R26 10kΩ ROHM MCR03EZPF1002 C23 10µF R31 0Ω ROHM MCR03EZHJ000 C24 0.1µF R32 0Ω ROHM MCR03EZHJ000 C26 R33 0Ω ROHM MCR03EZHJ000 C28 200µF SANYO 2R5TPE220MF R37 7mΩ ROHM PMR100HZPFU7L00 C31 100pF MURATA GRM18 Series R38 0Ω ROHM MCR03EZHJ000 D1 - ROHM RB521S-30 R39 0Ω ROHM MCR03EZHJ000 D2 - ROHM RB521S-30 R41 100kΩ ROHM MCR03EZPF1003 D3 - ROHM RSX501L-20 R44 0Ω ROHM MCR03EZHJ000 D4 - ROHM RSX501L-20 R45 0Ω ROHM MCR03EZHJ000 L1 2.5µH Sumida CDEP105-2R5MC-32 R46 0Ω ROHM MCR03EZHJ000 L2 2.5µH Sumida CDEP105-2R5MC-32 R50 7mΩ ROHM PMR100HZPFU7L00 M1 - ROHM SH8K4(2in1) R51 0Ω ROHM MCR03EZHJ000 M2 - ROHM SH8K4(2in1) R52 0Ω ROHM MCR03EZHJ000 U1 - ROHM BD9535MUV www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Parts Name 9/21 Parts Name KYOCERA CM105B105K06A KYOCERA CM21B106M06A MURATA GRM18 Series 10µF(25V) KYOCERA CT32X5R106K25A KYOCERA CM21B106M06A MURATA GRM18 Series 10µF(25V) KYOCERA CT32X5R106K25A 2010.07 - Rev.B Technical Note BD9535MUV ●Pin Descriptions ・VCC (13pin) This is the power supply pin for IC internal circuits, except the FET driver. The maximum circuit current is 2.0mA. The input supply voltage range is 4.5V to 5.5V. It is recommended that a 0.1µF bypass capacitor be put in this pin. ・EN1/EN2 (4pin/20pin) When EN pin voltage is at least 2.3V, the status of this switching regulator become active. Conversely, the status switches off when EN pin voltage goes lower than 0.8V and circuit current becomes 20µA or less. This pin is also switch pin of SLLMTM. The voltage is 2.3V to 3.8V : forced continuous mode, 4.2V to 5.5V : SLLMTM. These operating modes are changeable to control by power supply system 3.3V or 5V. ・VDD (28pin) This is the power supply pin to drive the LOW side FET. It is recommended that a 1µF bypass capacitor be established to compensate for rush current during the FET ON/OFF transition. ・VREG (8pin) This is the reference voltage output pin. The voltage is 2.5V, with 100µA current ability. It is recommended that a 1µF capacitor be established between VREF and GND. It is available to set VREF by the resistance division value from VREG in case VREF is not set from an external power supply. ・REF1/REF2 (7pin/17pin) This is the setting pin for output voltage of switching regulator. It is so convenient to be synchronized to outside power supply. This IC controls the voltage in the status of VREF1≒Vis-1 or VREF2≒Vis-2. ・ILIM1/ILIM2 (6pin/18pin) BD9535MUV detects the voltage between Is+ pin and Is- pin and limits the output current (OCP). Voltage equivalent to 1/10 of the ILIM voltage is the voltage drop of external current sense resistor. A very low current sense resistor or inductor DCR can also be used for this platform. ・SS1/SS2 (5pin/19pin) This is the adjustment pin to set the soft start/stop time. SS voltage is low during standby status. When EN is ON, the soft start time can be determined by the SS charge current and capacitor between SS-GND. Until SS reaches REF voltage, the output voltage is equivalent to SS voltage. ・VIN (16pin) The duty cycle is determined by input voltage and controls output voltage. In other words, the output voltage is affected by input voltage. Therefore, when VIN voltage fluctuates, the output voltage becomes also unstable. Since the VIN line is also the input voltage of the switching regulator, stability depends on the impedance of the voltage supply. It is recommended to establish a bypass capacitor or CR filters suitable for the actual application. ・FS (9pin) This is the pin to adjust the switching frequency with the resistor. The frequency range is from 200 kHz to 600 kHz. ・Is+1/Is+2,Is-1/Is-2 (11pin/14pin/10pin/15pin) These pins are connected to both sides of the current sense resistor to detect output current. The voltage drop between Is+ and Is- is compared with the voltage equivalent to 1/10 of ILIM voltage. When this voltage drop hits the specified voltage level, the output voltage is OFF. ・BOOT1/BOOT2 (1pin/23pin) This is the voltage supply to drive the high side FET. The maximum absolute ratings are 35V (from GND) and 7V (from SW). BOOT voltage swings between (VIN+Vcc) and Vcc during active operation. ・HG1/HG2 (29pin/27pin) This is the voltage supply to drive the Gate of the high side FET. This voltage swings between BOOT and SW. High-speed Gate driving for the high side FET is achieved due to the low on-resistance (3 ohm when HG is high, 2 ohm when HG is low) driver. ・SW1/SW2 (31pin/25pin) This is the source pin for the high side FET. The maximum absolute ratings are 30V (from GND). SW voltage swings between VIN and GND. ・LG1/LG2 (29pin/27pin) This is the voltage supply to drive the Gate of the low side FET. This voltage swings between VDD and PGND. High-speed Gate driving for the low side FET is achieved due to the low on-resistance (3 ohm when LG is high, 0.5 ohm when LG is low) driver. ・PGND1/PGND2 (30pin/26pin) This is the power ground pin connected to the source of the low side FET. This is the source pin for low-side FET. It is prepared for each channel to reduce the interference among channels. ・PGOOD1/PGOOD2 (3pin/21pin) This is the monitor pin for output voltage (Is-1/Is-2). When the output voltage is within 10% of setting voltage (REF1/2), High is output. It is open drain pin and connects to other power supply through the pull-up resistance. ・CE1/PCE2 (2pin/22pin) This pin is helpful for using ceramic capacitor as output capacitor. It is stable to use low ESR capacitor (small ripple voltage). ・GND (12pin) This is GND pin for Analog and Digital series. Set the reverse side of IC equivalent to the voltage of this pin. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/21 2010.07 - Rev.B Technical Note BD9535MUV ●Explanation of Operation 3 TM The BD9535MUV is a 2ch synchronous buck regulator controller incorporating ROHM’s proprietary H REG CONTROLLA control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the TON time interval. Thus, it serves to improve the regulator’s transient response. Activating the Light Load Mode will also exercise TM Simple Light Load Mode (SLLM ) control when the load is light, to further increase efficiency. H3RegTM control (Normal operation) When VOUT falls to a threshold voltage (REF), the drop is detected, activating the H3REGTM CONTROLLA system. Is-(VOUT) REF REF tON= HG VIN 1 × f [sec]・・・(1) HG output is determined by the formula above. LG (VOUT drops due to a rapid load change) When VOUT drops due to a rapid load change, and the voltage remains below REF after the programmed tON time interval has elapsed, the system quickly restores VOUT by extending the tON time, improving the transient response. Is-(VOUT) REF Io tON+α HG LG Is-(VOUT) REF In SLLM (SLLM=0V), SLLM function is operated when LG pin is OFF and the coil current is lower than 0A (the current goes from VOUT to SW). And it stops to output next HG. When VOUT goes lower than REF voltage again, the status of HG is ON. HG LG 0A VIN VIN REF H3RegTM R CONTROLLA S Q SLLM TM VOUT Driver Circuit Is-(VOUT) VCC EN 4V EN 0～2.3V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Output Operating mode OFF - 2.3～3.8V ON Forced continuous mode 4.2～5.5V ON SLLMTM 11/21 2010.07 - Rev.B Technical Note BD9535MUV ●Timing Chart ・Soft Start Function Soft start is exercised with the EN pin set high. Current control takes effect at startup, enabling a moderate output voltage “ramping start.” Soft start timing and incoming current are calculated with formulas (2) and (3) below. EN TSS(ON) SS Soft start time TSS(ON)= VOUT REF×Css [sec] ・・・(2) 2µA(typ) rush current IIN= IIN Co×VOUT Tss [A] ・・・(3) (Css: Soft start capacitor; Co: Output capacitor) ・Soft Stop Function Soft stop is exercised with the EN pin set low. Current control takes effect at startup, enabling a moderate output voltage. Soft start timing and incoming current are calculated with formulas (4) below. EN TSS(OFF) 2VBE SS Is(VOUT) Soft stop time 0.1V Spontaneous discharge (It is determined by load and output capacitor.) Tdelay TSS(OFF)= (REF+2VBE-0.1)×Css [sec] ・・・(4) 2µA(typ) VBE = 0.6[V] (typ) Tdelay = 2VBE×CSS 2µA(typ) [sec] ・・・(5) ・Synchronous operation with other power supply These power supply sequences are realized to connect SS pin to other power supply output through the resistance (10kΩ). 3.3V(other power supply) 1.8V (BD9535 output 1) 1.2V (BD9535 output 2) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/21 2010.07 - Rev.B Technical Note BD9535MUV ●Timing chart ・Over current protection circuit tON tON tMAX During the normal operation, when VOUT becomes less than REF Voltage, HG becomes High during the time TON. However, when inductor current exceeds ILIMIT threshold, HG becomes OFF. After MAX ON TIME, HG becomes ON again if the output voltage is lower than the specific voltage level and IL is lower than ILIMIT level. tON HG LG ILIMIT IL ・Timer Latch Type Short Circuit Protection Is(VOUT) When output voltage (Is-) falls to REF×0.7 or less, SCP comparator inside IC is exercised. If the status of High is continued 1ms or more (programmed time inside IC), the IC goes OFF. It can be restored either by reconnecting the EN pin or disabling UVLO. REF×0.7 Spontaneous discharge 1msec SCP EN /UVLO ・Output Over Voltage Protection REF×1.2 160mV When output rise to or above REF×1.2, output over voltage protection is exercised, and low side FET goes up maximum for reducing output. (LG=High, HG=Low). When output falls, it returns to the standard mode. Is(VOUT) HG LG Switching www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/21 2010.07 - Rev.B Technical Note BD9535MUV ●External Component Selection 1. Inductor (L) selection The inductor value is a major influence on the output ripple current. As formula (5) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. ΔIL (VIN-VOUT)×VOUT ΔIL= [A]・・・(6) L×VIN×f The proper output ripple current setting is about 30% of maximum output current. ΔIL=0.3×IOUTmax. [A]・・・(7) VIN IL VOUT (VIN-VOUT)×VOUT L L= Co L×VIN×f [H]・・・(8) (ΔIL: output ripple current; f: switch frequency) Output ripple current ※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margins to assure that peak current does not exceed the inductor rated current value. ※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2.Output Capacitor (CO) Selection When determining the proper output capacitor, be sure to factor in the equivalent series resistance required to smooth out ripple volume and maintain a stable output voltage range. Output ripple voltage is determined as in formula (9) below. VIN VOUT L ΔVOUT=ΔIL×ESR+ESL×ΔIL/TON・・・(9) ESR (ΔIL: Output ripple current; ESR: CO equivalent series resistance, ESL: CO equivalent series inductance) ESL Co ※ In selecting a capacitor, make sure the capacitor rating allows sufficient margin relative to output voltage. Note that a lower ESR can minimize output ripple voltage. Output capacitor Please give due consideration to the conditions in formula (10) below for output capacity, bear in mind that output rise time must be established within the soft start time frame. TSS×(Limit-IOUT) Co≦ VOUT ・・・(10) Tss: Soft start time Limit: Over current detection IOUT: Output current Note: Improper capacitor may cause startup malfunctions. 3. Input Capacitor (Cin) Selection The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (11) below. VIN Cin VOUT L Co IRMS=IOUT× √VOUT (VIN-VOUT) [A]・・・(11) VIN Where VIN=2×VOUT, IRMS= IOUT 2 Input Capacitor A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/21 2010.07 - Rev.B Technical Note BD9535MUV 4. MOSFET Selection Loss on the main MOSFET Pmain=PRON+PGATE+PTRAN VIN main switch = VOUT L VOUT ×RON×IOUT2+Qg×f×VDD+ 2 VIN ×Crss×IOUT×f VIN IDRIVE ・・・(12) Co (Ron: On-resistance of FET; Qg: GATE total charge f: Switching frequency, Crss: FET inverse transfer function; IDRIVE: Gate peak current) synchronous switch Loss on the synchronous MOSFET Psyn=PRON+PGATE = VIN-VOUT VIN ×RON×IOUT2+ Qg×f×VDD ・・・(13) 5. Setting Detection Resistance VIN The over current protection function detects the output ripple current peak value. This parameter (setting value) is determined as in formula (14) below. L R VOUT ILMIT= VILIM×0.1 R IL [A]・・・(14) Co (VILIM: ILIM voltage; R: Detection resistance) Is+ Is+ Current limit VIN When the over current protection is detected by DCR of coil L, this parameter (setting value) is determined as in formula (14) below. IL L r RL C VOUT Co ILMIT=VILIM×0.1× (RL= L r×C r×C L [A]・・・(15) ) (VILIM:ILIM voltage RL: the DCR value of coil) Is+ Is+ Current limit IL detect point As soon as the voltage drop between Is+ and Is- generated by the inductor current becomes specific threshold, the gate voltage of the high side MOSFET becomes low. Since the peak voltage of the inductor ripple current is detected, this operation can sense high current ripple operation caused by inductance saturated rated current and lead to high reliable systems. ILIMIT 0 t www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/21 2010.07 - Rev.B Technical Note BD9535MUV 6. Setting frequency 【1ch】 The On Time (TON) at steady state is determined by resistance value connected to FS pin. But actually SW rising time and falling time come up due to influence of the external MOSFET gate capacity or switching speed and TON is increased. The frequency is determined by the following formula after TON, input current and the REF voltage are fixed. 700 VIN=3V 5V 7V 12V 19V Frequency [kHz] 600 500 400 300 F= REF VIN×TON 200 ・・・(15) 100 Consequently, total frequency becomes lower than the formula above. TON is also influenced by Dead Time around the output current 0A area in continuous mode. This frequency becomes lower than setting frequency. It is recommended to check the steady frequency in large current area (at the point where the coil current doesn’t back up). VREF=1.8V 0 0 50 100 150 200 RFS[kΩ] 【2ch】 900 800 VIN=3V 5V 7V 12V 19V Frequency [kHz] 700 600 500 400 300 200 100 VREF=1.8V 0 0 50 100 150 200 RFS[kΩ] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/21 2010.07 - Rev.B Technical Note BD9535MUV 7. Setting standard voltage (REF) VIN REF R H3RegTM CONTROLLA It is available to synchronize setting the reference voltage (REF) with outside supply voltage [V] by using outside power supply voltage. Q S Outside voltage VOUT VREG It is available to set the reference voltage (REF) by the resistance division value from VREG in case it is not set REF from an external power supply. VIN R1 REF H3RegTM CONTROLLA R Q R2 REF= S R2 R1+R2 ×VREG [V]・・・(17) VOUT 8. Setting output voltage This IC is operated that output voltage is REF≒Is-(VOUT). And it is operated that output voltage is feed back to FB pin in case the output voltage is 0.7V to 2.0V. Actually, the average value of ripple voltage is added to output voltage. Output voltage = REF + ×ΔIL×ESR・・・(18) 2 VIN REF 1 R H3RegTM CONTROLLA VIN SLLMTM Q S Output voltage Driver Circuit SLLM ESR Is-(VOUT) In case the output voltage range is 0.7V to 2.0V. It is operated that the resistance division value of the output voltage is feed back to Is-pin in case the output voltage is more than 2.0V. R1+R2 × R2 1 ×ΔIL×ESR・・・(19) 2 In this time, the frequency is also amplified by power of the resistance division. It is determined as in formula (20) below. output voltage = Frequency= REF + R1+R2 ×(frequency determined by REF) [Hz]・・・(20) R2 VIN REF H3RegTM CONTROLLA VIN R Q SLLM TM S SLLM Output voltage Driver Circuit Is-(VOUT) ESR R1 R2 In case the output voltage range is more than 2.0V. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 17/21 2010.07 - Rev.B Technical Note BD9535MUV ●I/O Equivalent Circuit 1pin, 23pin (BOOT1/2) 2pin, 22pin (CE1/2) 3pin, 21pin (PGOOD1/2) 300Ω HG SW 4pin, 20pin (EN1/2) 5pin, 19pin (SS1/2) 6pin, 18pin (ILIM1/2) 8pin (VREG) 9pin (FS) 430KΩ 7pin, 17pin (REF1/2) 1.2MΩ 400KΩ 10pin, 15pin (Is-1/2) 11pin, 14pin (Is+1/2) 16pin (VIN) 24pin, 32pin (HG1/2) 25pin, 31pin (SW1/2) 27pin, 29pin (LG1/2) BOOT BOOT VDD BOOT HG 300KΩ 100KΩ 300KΩ 300KΩ SW 300KΩ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 18/21 2010.07 - Rev.B Technical Note BD9535MUV ●Notes for use 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3. Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. 4. GND voltage The potential of GND pin must be minimum potential in all operating conditions. 5. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8. ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9. Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD on temperature [°C] (typ.) Hysteresis temperature [°C] (typ.) BD9535MUV 175 15 10. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11. Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Resistor Transistor (NPN) Pin B Pin A C Pin B B E Pin A B N P+ N P+ P N N P substrate Parasitic element GND P+ Parasitic element www.rohm.com P+ P C N E P substrate Parasitic element Fig. 13 Example of IC structure © 2010 ROHM Co., Ltd. All rights reserved. N 19/21 GND GND Parasitic element Other adjacent elements GND 2010.07 - Rev.B Technical Note BD9535MUV 12. Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. ●Power Dissipation 1200 980mW Power Dissipation ：Pd （mW) 1000 mounted on glass epoxy PCB 70mm×70mm×1.6mm θj-a=127.0℃/W 800 600 IC unit time θj-a=403.2℃/W 400 310mW 200 0 0 25 50 75 100 125 150 Ambient Temperature：Ta(℃) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 20/21 2010.07 - Rev.B Technical Note BD9535MUV ●Ordering part number B D 9 Part No. 5 3 5 Part No. M U V E Package MUV : VQFN032V5050 2 Packaging and forming specification E2: Embossed tape and reel VQFN032V5050 5.0 ± 0.1 5.0±0.1 1.0MAX 3.4±0.1 0.4 ± 0.1 1 8 9 32 16 25 24 0.75 0.5 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold ) (0.22) ( reel on the left hand and you pull out the tape on the right hand 3.4 ± 0.1 +0.03 0.02 -0.02 S C0.2 Embossed carrier tape Quantity Direction of feed 1PIN MARK 0.08 S Tape 17 +0.05 0.25 -0.04 1pin Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 21/21 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.07 - Rev.B Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001