BD9G500EFJ-LAE2

Datasheet 7 V to 76 V Input, 5 A Integrated High –Side MOSFET, Single Buck DC/DC Converter BD9G500EFJ-LA General Description Key Specifications This is the product guarantees long time support in industrial market. BD9G500EFJ-LA is buck DC/DC converter with built-in low on-resistance High-Side power MOSFET. It is capable of providing current of up to 5 A. Current mode architecture provides fast transient response and simple phase compensation setup. The operating frequency is adjustable from 100 kHz to 650 kHz.  Input Voltage Range: 7 V to 76 V  Input Absolute Maximum Rating: 80 V 85 V (1 ms pulse , 50 % duty or less)  Reference Voltage Accuracy: 1.0 V±1.0 %  Output Current: 5 A (Max)  High-Side MOSFET ON-Resistance: 100 mΩ (Typ)  Shutdown Current: 0 μA (Typ)  Operating Temperature Range: -40 °C to +125 °C Features            Package Long Time Support Product for Industrial Applications. Wide Input Voltage Range Integrated High-Side MOSFET Current Mode Control Adjustable Frequency Soft Start Function Over Current Protection (OCP) Under Voltage Lockout (UVLO) Thermal Shutdown Protection (TSD) Over Voltage Protection (OVP) HTSOP-J8 package W (Typ) x D (Typ) x H (Max) 4.9 mm x 6.0 mm x 1.0 mm HTSOP-J8 Applications  Industrial Equipment  Power Supply for FA’s Industrial Device  Communications Power Systems Typical Application Circuits VIN CIN 8 VIN BOOT 7 CBOOT BD9G500EFJ-LA R1 L SW 6 EN D1 COMP R2 3 RT GND FB 5 2 4 RCOMP COUT R3 CCOMP 〇Product structure : Silicon integrated circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 VOUT 1 RRT R4 〇This product has no designed protection against radioactive rays. 1/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Pin Configuration (TOP VIEW) SW 1 GND 2 EXP-PAD 8 VIN 7 BOOT COMP 3 6 EN FB 4 5 RT Pin Descriptions Pin No. Pin Name Function 1 SW 2 GND 3 COMP 4 FB Output voltage feedback pin. See Selection of Components Externally Connected Output Voltage Set Point for how to calculate the resistance of the output voltage setting. 5 RT The internal oscillator frequency set pin. The internal oscillator is set with a single resistor connected between this pin and the GND pin. Frequency range is 100 kHz to 650 kHz. 6 EN Turning this pin signal low (0.4 V or lower) forces the device to enter the shutdown mode. Turning this pin signal high (2.5 V or higher) enables the device. This pin must be terminated. 7 BOOT Bootstrap pin. Connect a bootstrap capacitor of 1 µF between this pin and the SW pin.The voltage of this capacitor is the gate drive voltage of the High Side MOSFET. 8 VIN - EXP-PAD Switch pin. This pin is connected to the source of the High-Side MOSFET. Connect a schottky barrier diode between this pin and the GND pin. Ground pin. Output pin for the gm error amplifier and input to the PWM comparator. Connect phase compensation components to this pin. Power supply pin. This pin for the switching regulator and control circuit. Connecting 15 µF and 1 µF ceramic capacitors are recommended. A backside heat dissipation pad. Connecting to the internal PCB Ground plane by using via provides excellent heat dissipation characteristics. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Block Diagram VIN VIN VIN 3V EN 6 5V VREF VREG BOOTREG 7 BOOT 8 VIN 1 SW OCP UVLO OSC OVDIS TSD OVP VIN FB 4 ＋ ＋ － ERR DRIVER LOGIC SLOPE ＋ PWM SW COMP － 3 SOFT START www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5 2 RT GND 3/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Description of Blocks VREF Block creating internal reference voltage 3 V (Typ). VREG Block creating internal reference voltage 5 V (Typ). BOOTREG Block creating gate drive voltage. TSD The TSD block is for thermal protection. It shuts down the device when the internal temperature of IC rises to 175 °C (Typ) or more. Thermal protection circuit resets when the temperature falls. The circuit has a hysteresis of 25 °C (Typ). UVLO This is under voltage lockout block. It shuts down the device when the VIN pin voltage falls to 6.4 V (Typ) or less. The UVLO threshold voltage has a hysteresis of 200 mV (Typ). ERR The ERR amplifier is the circuit which compares the feedback voltage of the output voltage with the reference voltage. The ERR amplifier output (the COMP pin voltage) determine the switching duty. OSC Block generating oscillation frequency. SLOPE Creates delta wave from clock, generated by OSC, and voltage composed by current sense signal of High-Side MOSFET. PWM Settles the switching duty by comparing the output COMP pin voltage of ERR amplifier and signal of SLOPE block. DRIVER LOGIC This is DC / DC driver control block. Input signal from PWM and drives MOSFET. SOFT START The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the prevention of output voltage overshoot and inrush current. OCP Current flowing in High-Side MOSFET is controlled one cycle when over current occurs. If OCP function 4 times sequentially, the device stops the operation for 20 ms (Typ) and subsequently initiates a restart. OVP When the FB pin voltage is 1.2 V (Typ) or more, it turns High-Side MOSFET OFF. After FB pin voltage drops, it returns to normal operation with hysteresis. This IC has Discharge MOS. This MOS turns on 100 ns (Typ) at each duty cycle. When the FB pin voltage is 2.0 V (Typ) or more, it turns Discharge MOS off also. OVDIS When the FB pin voltage is 1.0 V (Typ) or more and 2.0 V (Typ) or less and remains in that state for 16 cycle, the Discharge MOS On-time is set to 400 ns (Typ) and discharge output voltage. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit VIN -0.3 to +80.0 V VINPULSE -0.3 to +85.0 V VEN -0.3 to +80.0 V VBOOT -0.3 to +85.0 V ΔVBOOT-SW -0.3 to +7.0 V VFB -0.3 to + 7.0 V Input Voltage Input Voltage (1 ms pulse , 50 % duty or less) EN Pin Voltage Voltage from GND to BOOT Voltage from SW to BOOT(Note 1) FB Pin Voltage VCOMP -0.3 to + 7.0 V RT Pin Voltage VRT -0.3 to + 7.0 V SW Pin Voltage VSW -0.5 to VIN + 0.3 V Tjmax 150 °C Tstg -55 to +150 °C COMP Pin Voltage Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) Because this IC Voltage from SW to BOOT absolute maximum rating is 7.0 V, Do not short VIN Pin to BOOT Pin after power ON. Thermal Resistance(Note 2) Parameter Symbol Thermal Resistance (Typ) 1s(Note 4) 2s2p(Note 5) Unit HTSOP-J8 Junction to Ambient θJA 112.8 24.3 °C/W Junction to Top Characterization Parameter(Note 3) ΨJT 6.0 2.0 °C/W (Note 2) Based on JESD51-2A (Still-Air). (Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 4) Using a PCB board based on JESD51-3. (Note 5) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Recommended Operating Conditions Parameter Symbol Min Typ Max Unit VIN 7 - 76 V Operating Temperature Topr -40 - +125(Note 1) °C Output Current IOUT 0 - 5 A VRANGE 1.0(Note 2) - 0.97 × VIN(Note 3) V Input Voltage Output Voltage Range (Note 1) Tj must be lower than 150 °C under actual operating environment. (Note 2) Use it in output voltage setting of which output pulse width does not become 350 ns (Typ) or less. (Note 3) When fosc = 200 kHz setting, the maximum Output Voltage is close to 0.97 (Typ) × (VIN - RONH × IOUT). Electrical Characteristics ( Unless otherwise specified Tj = -40 °C to +125 °C, VIN = 48 V, VEN = 3 V ) Parameter Symbol Min Typ Max Unit Operating Supply Current IOPR - 0.75 1.50 mA VFB = 3.0 V Tj = 25 °C Shutdown Current ISD - 0 10 µA VEN = 0 V Tj = 25 °C FB Threshold Voltage (Note 4) VFB 0.99 1.00 1.01 V FB Input Current IFB -0.1 0 +0.1 µA VFB = 1.1V fRTOSC 100 - 650 kHz Tj = 25 °C Switching Frequency fOSC 180 200 220 kHz Tj = 25 °C RT = 47 kΩ High-Side MOSFET ON-Resistance RONH - 100 140 mΩ ISW = -50 mA Tj = 25 °C Over Current limit(Note5) ILIMIT 6.4 8.0 - A Without switching Open Loop UVLO Threshold Voltage VUVLO 6.1 6.4 6.7 V VIN falling UVLO Hysteresis Voltage VUVLOHYS 100 200 300 mV EN High-Level Input Voltage VENH 2.5 - - V EN Low-Level Input Voltage VENL 0 - 0.4 V EN Input Current IEN 1.15 2.30 4.60 µA Soft Start Time tSS 15 20 25 ms Switching Frequency Range Using RT Pin Conditions VEN = 3 V Tj = 25 °C (Note 4) Only tested Tj = 25 °C on outgoing inspection. (Note 5) No tested on outgoing inspection. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Typical Performance Curves 10.0 VIN = 76 V 1.4 1.2 Shutdown Current : ISD [µA] Operating Supply Current : IOPR [mA] 1.5 VIN = 48 V 1.1 0.9 0.8 0.6 VIN = 7 V 0.5 VIN = 48 V 9.0 8.0 7.0 6.0 5.0 4.0 3.0 0.3 2.0 0.2 1.0 0.0 0.0 -50 -25 0 25 50 75 100 -50 125 -25 Temperature : Tj [℃] 0 25 50 75 100 125 Temperature : Tj [℃] Figure 1. Operating Supply Current vs Temperature Figure 2. Shutdown Current vs Temperature 0.5 1.010 FB Input Current : IFB [µA] FB Threshold Voltage : VFB [V] VFB = 1.1 V 1.005 1.000 0.4 0.3 0.2 0.995 0.1 0.0 0.990 -50 -25 0 25 50 75 100 -50 125 0 25 50 75 100 125 Temperature : Tj [℃] Temperature : Tj [℃] Figure 3. FB Threshold Voltage vs Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -25 Figure 4. FB Input Current vs Temperature 7/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Typical Performance Curves - continued 300 High-Side MOSFET ON-Resistance : RONH [mΩ] Switching Frequency : fOSC [kHz] 220 210 200 250 200 150 100 190 50 180 0 -50 -25 0 25 50 75 100 125 -50 -25 25 50 75 100 125 Temperature : Tj [℃] Temperature : Tj [℃] Figure 5. Switching Frequency vs Temperature Figure 6. High Side MOSFET ON-Resistance vs Temperature 7 UVLO Threshold Voltage : VUVLO [V] 15.0 Over Current Limit : ILIMIT [A] 0 13.0 11.0 9.0 7.0 -50 -25 0 25 50 75 100 125 6.4 VIN Sweep down 6.2 -25 0 25 50 75 100 125 Temperature : Tj [℃] Temperature : Tj [℃] Figure 7. Over Current Limit vs Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6.6 6 -50 5.0 VIN Sweep up 6.8 Figure 8. UVLO Threshold Voltage vs Temperature 8/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Typical Performance Curves - continued 10.0 EN Input Current : IEN [µA] EN Threshold Voltage : VEN [V] 2.5 EN Sweep up 2.0 1.5 1.0 EN Sweep down 0.5 8.0 6.0 4.0 2.0 0.0 0.0 -50 -25 0 25 50 75 100 125 -50 -25 25 50 75 100 125 Temperature : Tj [℃] Temperature : Tj [℃] Figure 10. EN Input Current vs Temperature Figure 9. EN Threshold Voltage vs Temperature 30 650 Switching Frequency : fOSC [kHz] Soft Start Time : tSS [ms] 0 25 20 15 575 500 425 350 275 200 125 10 50 -50 -25 0 25 50 75 100 125 10 30 40 50 60 70 80 90 100 RT-Resistance : RRT [kΩ] Temperature : Tj [℃] Figure 11. Soft Start Time vs Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20 Figure 12. Switching Frequency vs RT-Resistance 9/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Typical Performance Curves (Application) VIN = 12 V VIN = 7 V VIN = 12 V VIN = 24 V VIN = 36 V VIN = 24 V VIN = 36 V VIN = 48 V VIN = 60 V VIN = 48 V VIN = 60 V VIN = 7 V Figure 13. Efficiency vs Output Current （VOUT = 5.0 V, fOSC = 100 kHz） Figure 14. Efficiency vs Output Current （VOUT = 5.0 V, fOSC = 200 kHz） VIN = 7 V VIN = 12 V VIN = 7 V VIN = 12 V VIN = 24 V VIN = 36 V VIN = 24 V VIN = 36 V VIN = 48 V VIN = 60 V VIN = 48 V VIN = 60 V Figure 15. Output Voltage Deviation vs Output Current (Load Regulation, VOUT = 5 V, fOSC = 100 kHz) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 16. Output Voltage Deviation vs Output Current (Load Regulation VOUT = 5 V, fOSC = 200 kHz) 10/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Typical Performance Curves (Application) - continued VIN : 30 V/div VIN : 30 V/div VOUT : 2 V/div VOUT : 2 V/div VSW : 30 V/div VSW : 30 V/div Time : 10 ms/div Time : 10 ms/div Figure 17. Start-up Waveform (VIN = VEN, VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 0 A) VIN : 30 V/div Figure 18. Shutdown Waveform (VIN = VEN, VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 0 A) VIN : 30 V/div VOUT : 2 V/div VOUT : 2 V/div VSW : 30 V/div VSW : 30 V/div Time : 10 ms/div Time : 10 ms/div Figure 19. Start-up Waveform (VIN = VEN, VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 5 A) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/36 Figure 20. Shutdown Waveform (VIN = VEN, VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 5 A) TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Typical Performance Curves (Application) - continued VOUT : 50 mV/div VIN : 500 mV/div Time : 0.2 ms/div Time : 0.2 ms/div VSW : 30 V/div VSW : 30 V/div Figure 22. VOUT Ripple (VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 0 A) Figure 21. VIN Ripple (VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 0 A) VOUT : 50 mV/div VIN : 500 mV/div Time : 10 µs/div Time : 10 µs/div VSW : 30 V/div VSW : 30 V/div Figure 24. VOUT Ripple (VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 0.3 A) Figure 23. VIN Ripple (VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 0.3 A) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Typical Performance Curves (Application) - continued VIN : 500 mV/div VOUT : 50 mV/div Time : 5 µs/div Time : 5 µs/div VSW : 30 V/div VSW : 30 V/div Figure 25. VIN Ripple (VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 5 A) Figure 26. VOUT Ripple (VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, IOUT = 5 A) VSW : 5 V/div VSW : 20 V/div Time : 10 ms/div Time : 10 ms/div IL : 5 A/div IL : 5 A/div Figure 27. Switching Waveform (VIN = 12 V, VOUT = 5 V, fOSC = 200 kHz, VOUT short to GND) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/36 Figure 28. Switching Waveform (VIN = 48 V, VOUT = 5 V, fOSC = 200 kHz, VOUT short to GND) TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Typical Performance Curves (Application) - continued Operating Range: Tj < 150 °C Operating Range: Tj < 150 °C Figure 29. Temperature vs Output Current (VIN = 48 V, VOUT = 5 V, ROHM Board ) Figure 30. Temperature vs Output Current (VIN = 48 V, VOUT = 12 V, ROHM Board ) IOUT = 1 A IOUT = 3 A IOUT = 5 A Figure 31. Maximum Duty Ratio vs Switching Frequency （VIN = 12 V） www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Function Description Enable Control The IC shutdown can be controlled by the voltage applied to the EN pin. When the EN pin voltage reaches 2.5 V (Min), the internal circuit is activated and the IC starts up. When EN pin voltage becomes 0.4 V (Max) , the device is shutdown. To enable shutdown control with the EN Pin, set the shutdown interval (Low level interval of EN) must be set to 100 µs or more. VEN EN Pin VENH VENL t 0 VOUT Output Voltage VOUT×0.95 t 0 tSS Figure 32. Timing Chart with Enable Control Protective Functions The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them for continuous protective operation. 2.1 Over Current Protection (OCP) Current flowing in High-Side MOSFET is controlled one cycle when over current occurs. If OCP function 4 times sequentially, the device stops the operation for 20 ms (Typ) and subsequently initiates a restart. Soft Start 20 ms (Typ) VOUT VOUT × 0.95 SW LOW < 4 times 4 times sequentially IC internal OCP signal LOW OCP Threshold 8 A(Typ) Inductor Current IC internal SCP signal 20 ms (Typ) SCP reset Figure 33. Over Current Protection Timing Chart Figure 42. Over Current Protection Timing Chart www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 Figure 42. Over Current Protection Timing Chart 15/36 BD9G500EFJ-LA 2. Protective Functions - coutinued 2.2 Under Voltage Lockout Protection Function (UVLO) This is under voltage lockout block. It shuts down the device when the VIN pin voltage falls to 6.4 V (Typ) or less. The UVLO threshold voltage has a hysteresis of 200 mV (Typ). VIN UVLO ON UVLO OFF hys 0V VOUT VOUT×0.95 Soft Start Normal operation UVLO Normal operation Figure 34. UVLO Timing Chart 2.3 Over Voltage Discharge Function (OVDIS) When the FB pin voltage is 1.0 V (Typ) or more and 2.0 V (Typ) or less and remains in that state for 16 cycle, the Discharge MOS On-time is set to 400 ns (Typ) and discharge output voltage. 16/fOSC (Typ) VFB Reference Voltage 1.0 V(Typ) OVDIS IOUT (Over Voltage Discharge) Discharge MOS GATE 100 ns(Typ) 400 ns(Typ) Figure 35. OVDIS Timing Chart 2.4 Over Voltage Protection Function (OVP) When the FB pin voltage is 1.2 V (Typ) or more, it turns High-Side MOSFET OFF. After FB pin voltage drops, it returns to normal operation with hysteresis. This IC has Discharge MOS. This MOS turns on 100 ns (Typ) at each duty cycle. When the FB pin voltage is 2.0 V (Typ) or more, it turns Discharge MOS off also. 2.5 Thermal Shutdown Function (TSD) This is the thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. However, if the rating is exceeded for a continued period and the junction temperature (Tj) rises to 175 °C (Typ) or more, the TSD circuit will operate and turn OFF the output MOSFET. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Application Examples 1 VOUT = 5.0 V Table 1. Specification of Application Symbol Parameter Input Voltage Specification Value VIN 7 V ～ 48 V Output Voltage VOUT 5.0 V Switching Frequency fOSC 200 kHz (Typ) IOUTMAX 5A Maximum Output Current VOUT_S C3 L1 VOUT_F C7 D1 C1 R1 R6 1 SW 2 GND CS GND_F C2 VIN_S U1 RS C6 GND_S R5 3 VIN BOOT COMP 4 FB R2 EN RT VIN_F 8 C9 7 6 C4 C5 EN 5 GND_F GND_S BD9G500EFJ-LA R4 R3 C10 Figure 36. Application Circuit Part No. C4 (Note 2) C9(Note 3) C3 (Note 4) Table 2. Recommended Component Values(Note 1) (VOUT = 5.0 V) Value Part Name Manufacturer 15 µF / 100 V KRM55WR72A156MH01L MURATA 1 µF / 100 V GRM21BC72A105KE01L MURATA 1 µF / 10 V GRM155C71A105KE11D MURATA C2 6800 pF / 50 V GRM1555C1H682JE01D MURATA C6 47 µF / 25 V KRM55WR71E476MH01L MURATA C7 220 µF / 50 V Aluminum UBT1H221M NICHICON R1 62 kΩ MCR03 series ROHM R2 0.75 kΩ MCR03 series ROHM R3 3 kΩ MCR03 series ROHM R4 47 kΩ MCR03 series ROHM R5 0Ω MCR03 series ROHM R6 0Ω MCR03 series ROHM STPS15H100C ST D1 100 V / 10 A L1 33 µH RB088BM100TL ROHM 7443551331 WURTH (Note 1) These recommended component values for small output voltage ripple and improved transient response setting, please confirm on the actual equipment considering variations of the characteristics of the product and external components. Component not in table all for open conditions (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 4.7 μF. (Note 3) In order to reduce the influence of high frequency noise, connect a 1 μF ceramic capacitor as close as possible to the VIN pin and the GND pin. (Note 4) For the bootstrap capacitor C3, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less than 0.047 μF. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA 1 VOUT = 5.0 V – continued VIN = 7 V VIN = 12 V VIN = 24 V VIN = 36 V VIN = 48 V VIN = 60 V Figure 38. Frequency Characteristics ( IOUT = 5.0 A ) Figure 37. Efficiency vs Output Current Time: 0.2 ms/div Time: 5 µs/div VOUT: 50 mV/div VOUT: 50 mV/div VSW: 30 V/div VSW: 30 V/div Figure 40. VOUT Ripple ( IOUT = 5.0 A ) Figure 39. VOUT Ripple ( IOUT = 0 A ) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA 1 VOUT = 5.0 V – continued Time: 0.1 ms/div Time: 0.1 ms/div VOUT: 200 mV/div VOUT: 200 mV/div IOUT: 1 A/div IOUT: 1 A/div Figure 41. Load Transient Response ( IOUT = 1.25 A – 3.75 A ) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 42. Load Transient Response ( IOUT = 0 A – 3.75 A ) 19/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Application Examples - coutinued 2 VOUT = 3.3 V Table 3. Specification of Application Symbol Parameter Input Voltage Specification Value VIN 7 V ～ 36 V Output Voltage VOUT 3.3 V Switching Frequency fOSC 200 kHz (Typ) IOUTMAX 5A Maximum Output Current VOUT_S C3 L1 VOUT_F C7 D1 GND_F GND_S R1 R6 1 SW 2 GND CS C1 C2 VIN_S U1 RS C6 R5 3 4 R2 VIN BOOT COMP EN FB RT VIN_F 8 C9 7 6 C4 C5 EN 5 GND_F GND_S BD9G500EFJ-LA R4 R3 C10 Figure 43. Application Circuit Table 4. Recommended Component Values(Note 1) ( VOUT = 3.3 V ) Part No. Value Part Name Manufacturer C4 C9(Note 3) C3(Note 4) C2 C6 C7 R1 R2 R3 R4 R5 R6 15 µF / 100 V 1 µF / 100 V 1 µF / 10 V 6800 pF / 50 V 47 µF / 25 V 220 µF / 50 V Aluminum 43 kΩ 2.7 kΩ 6.2 kΩ 47 kΩ 0Ω 10 Ω D1 100 V / 10 A L1 33 µH KRM55WR72A156MH01L GRM21BC72A105KE01L GRM155C71A105KE11D GRM1555C1H682JE01D KRM55WR71E476MH01L UBT1H221M MCR03 series MCR03 series MCR03 series MCR03 series MCR03 series MCR03 series STPS15H100C RB088BM100TL 7443551331 MURATA MURATA MURATA MURATA MURATA NICHICON ROHM ROHM ROHM ROHM ROHM ROHM ST ROHM WURTH (Note 2) (Note 1) These recommended component values for small output voltage ripple and improved transient response setting, please confirm on the actual equipment considering variations of the characteristics of the product and external components. Component not in table all for open conditions (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 4.7 μF. (Note 3) In order to reduce the influence of high frequency noise, connect a 1 μF ceramic capacitor as close as possible to the VIN pin and the GND pin. (Note 4) For the bootstrap capacitor C3, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less than 0.047 μF. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA 2 VOUT = 3.3 V – continued VIN = 7 V VIN = 12 V VIN = 24 V VIN = 36 V Figure 44. Efficiency vs Output Current Figure 45. Frequency Characteristics IOUT = 5.0 A Time: 0.2 ms/div Time: 5 µs/div VOUT: 50 mV/div VOUT: 50 mV/div VSW: 30 V/div VSW: 30 V/div Figure 47. VOUT Ripple ( IOUT = 5.0 A ) Figure 46. VOUT Ripple ( IOUT = 0 A ) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA 2 VOUT = 3.3 V – continued Time: 0.1 ms/div Time: 0.1 ms/div VOUT: 200 mV/div VOUT: 200 mV/div IOUT: 1 A/div IOUT: 1 A/div Figure 49. Load Transient Response (VIN = 36 V, IOUT = 0 A – 3.75 A ) Figure 48. Load Transient Response (VIN = 36 V, IOUT = 1.25 A – 3.75 A ) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Application Examples - coutinued 3 VOUT = 12 V Table 5. Specification of Application Symbol Parameter Input Voltage Specification Value VIN 18 V ～ 60 V Output Voltage VOUT 12 V Switching Frequency fOSC 200 kHz (Typ) IOUTMAX 5A Maximum Output Current VOUT_S C3 L1 VOUT_F C7 D1 GND_F GND_S R6 1 SW 2 GND CS C1 R1 C2 VIN_S U1 RS C6 R5 3 4 R2 VIN BOOT COMP EN FB RT VIN_F 8 C9 7 6 C4 C5 EN 5 GND_F GND_S BD9G500EFJ-LA R4 R3 C10 Figure 50. Application Circuit Part No. C4(Note 2) C9(Note 3) C3(Note 4) C2 C6 C7 R1 R2 R3 R4 R5 R6 D1 L1 Table 6. Recommended Component Values(Note 1) (VOUT = 12 V) Value Part Name 15 µF / 100 V KRM55WR72A156MH01L 1 µF / 100 V GRM21BC72A105KE01L 1 µF / 10 V GRM155C71A105KE11D 6800 pF / 50 V GRM1555C1H682JE01D 47 µF / 25 V KRM55WR7YA476MH01L 220 µF / 50 V Aluminum UBT1H221M 150 kΩ MCR03 series 0.3 kΩ MCR03 series 3.3 kΩ MCR03 series 47 kΩ MCR03 series 0Ω MCR03 series 0Ω MCR03 series STPS15H100C 100 V / 10 A RB088BM100TL 33 µH 7443551331 Manufacturer MURATA MURATA MURATA MURATA MURATA NICHICON ROHM ROHM ROHM ROHM ROHM ROHM ST ROHM WURTH (Note 1) These recommended component values for small output voltage ripple and improved transient response setting, please confirm on the actual equipment considering variations of the characteristics of the product and external components. Component not in table all for open conditions (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 4.7 μF. (Note 3) In order to reduce the influence of high frequency noise, connect a 1 μF ceramic capacitor as close as possible to the VIN pin and the GND pin. (Note 4) For the bootstrap capacitor C3, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less than 0.047 μF. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA 3 VOUT = 12 V – continued VIN = 18 V VIN = 24 V VIN = 36 V VIN = 48 V VIN = 55 V VIN = 60 V Figure 51. Efficiency vs Output Current Figure 52. Frequency Characteristics ( IOUT = 5.0 A ) Time: 5 µs/div Time: 0.2 ms/div VOUT: 50 mV/div VOUT: 100 mV/div VSW: 30 V/div VSW: 30 V/div Figure 54. VOUT Ripple ( IOUT = 5.0 A ) Figure 53. VOUT Ripple ( IOUT = 0 A ) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA 3 VOUT = 12 V – continued Time: 0.5 ms/div Time: 0.5 ms/div VOUT: 200 mV/div VOUT: 200 mV/div IOUT: 1 A/div IOUT: 1 A/div Figure 55. Load Transient Response ( IOUT = 1.25 A – 3.75 A ) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 56. Load Transient Response ( IOUT = 0 A – 3.75 A ) 25/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Selection of Components Externally Contact us if not use the recommended component values in Application Examples. 1. Switching Frequency BD9G500EFJ-LA can setup arbitrary internal oscillator frequency by connecting RT resistance. Recommended frequency setting range is 100 kHz to 650 kHz, For setting frequency f OSC [kHz] , RRT [kΩ], That can be used is calculated as follows. When RRT (kΩ) = 47 kΩ the frequency closed to 200 kHz (Typ) operation. 𝑅𝑅𝑇 (𝑘𝛺) = 18423 𝑓𝑂𝑆𝐶 (𝑘𝐻𝑧)1.127 𝑓𝑂𝑆𝐶 (𝑘𝐻𝑧) = 6093.5 𝑅𝑅𝑇 (𝑘𝛺)0.887 Figure 57. Switching Frequency vs RT-Resistance 2. Figure 58. RT-Resistance vs Switching Frequency Output LC Filter The DC/DC converter requires an LC filter for smoothing the output voltage in order to supply a continuous current to the load. Selecting an inductor with a large inductance causes the ripple current ΔIL that flows into the inductor to be small, decreasing the ripple voltage generated in the output voltage, but it is not advantageous in terms of the load transient response characteristic. Selecting an inductor with a small inductance improves the transient response characteristic but causes the inductor ripple current to be large, which increases the ripple voltage in the output voltage, showing a trade-off relationship. IL Inductor saturation current > IOUTMAX + ∆IL/2 ∆IL Maximum Output Current IOUTMAX t Figure 59. Waveform of Inductor Current www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA 2. Output LC Filter – Connected Computation ∆IL. with VIN = 48 V, VOUT = 5 V, L = 33 µH, and switching frequency fOSC = 200 kHz, the method is as below. ∆𝐼𝐿 = 𝑉𝑂𝑈𝑇 × (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 1 = 679 [mA] 𝑉𝐼𝑁 × 𝑓𝑂𝑆𝐶 × 𝐿 Also for saturation current of inductor, select the one with larger current than the total of maximum output current and 1/2 of inductor ripple current ∆IL.Output capacitor COUT affects output ripple voltage characteristics. Select output capacitor COUT so that necessary ripple voltage characteristics are satisfied. Output ripple voltage can be expressed in the following method. ∆𝑉𝑅𝑃𝐿 = ∆𝐼𝐿 × (𝑅𝐸𝑆𝑅 + 1 8 × 𝐶𝑂𝑈𝑇 × 𝑓𝑂𝑆𝐶 ) [V] RESR is the serial equivalent series resistance here. With COUT = 267 µF, RESR = 30 mΩ the output ripple voltage is calculated as below. ∆𝑉𝑅𝑃𝐿 = 0.679 × (30𝑚𝛺 + 1 ) = 21.96 [mV] 8 × 267𝜇 × 200𝑘 Be careful of total capacitance value, when additional capacitor C LOAD is connected to output capacitor COUT. Use maximum additional capacitor CLOAD (Max) condition which satisfies the following method. Maximum starting inductor ripple current IL_START must smaller than over current limit 6.4 A (Min). Maximum starting inductor ripple current IL_START can be expressed in the following method. 𝐼𝐿_𝑆𝑇𝐴𝑅𝑇 = 𝐼𝑂𝑈𝑇𝑀𝐴𝑋 + ( ∆𝐼𝐿 2 ) + 𝐼𝐶𝐴𝑃 [A] Charge current to output capacitor ICAP can be expressed in the following method. 𝐼𝐶𝐴𝑃 = (𝐶𝑂𝑈𝑇 + 𝐶𝐿𝑂𝐴𝐷 ) × 𝑉𝑂𝑈𝑇 𝑡𝑆𝑆 [A] Computation with VIN = 48 V, VOUT = 5 V, L = 33 µH, IOUTMAX = 5 A (Max), switching frequency fOSC = 180 kHz (Min), Output capacitor COUT = 267 µF, Soft Start Time tSS = 15 ms (Min), the method is as below. ∆𝐼 (6.4 − 𝐼𝑂𝑈𝑇𝑀𝐴𝑋 − 2𝐿 ) × 𝑡𝑆𝑆 𝐶𝐿𝑂𝐴𝐷 (𝑀𝑎𝑥) ≤ − 𝐶𝑂𝑈𝑇 = 2801 [µF] 𝑉𝑂𝑈𝑇 3. Catch Diode BD9G500EFJ-LA should be taken to connect external catch diode between the SW pin and the GND pin. The diode require adherence to absolute maximum ratings of application. Opposite direction voltage should be higher than maximum voltage of the VIN pin. Also for saturation current of diode, select the one with larger current than the total of maximum output current and 1/2 of inductor ripple current ∆IL. 4. Bootstrap capacitor Bootstrap capacitor C3 shall be 1 μF. Connect a bootstrap capacitor between the SW pin and the BOOT pin. For capacitance of Bootstrap capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less than 0.047 μF. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Selection of Components Externally – Connected 5. Output Voltage Set Point The output voltage value can be set by the feedback resistance ratio. 𝑉𝑂𝑈𝑇 = 𝑅6 + 𝑅2 + 𝑅3 [V] 𝑅2 VOUT R6 R3 FB R2 ERR 1.0V Figure 60. Feedback Resistor Circuit 6. Input capacitor configuration For input capacitor, use a ceramic capacitor. For normal setting, 15 μF is recommended, but with larger value, input ripple voltage can be further reduced. Also, for capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less than 4.7 μF. 7. Phase Compensation A current mode control buck DC/DC converter is a two-pole, one-zero system. Two-pole formed by an error amplifier and load and one zero point added by phase compensation. The phase compensation resistor R1 determines the crossover frequency fCRS where the total loop gain of the DC/DC converter is 0 dB. High value for this crossover frequency fCRS provides a good load transient response characteristic but inferior stability. Conversely, specifying a low value for the crossover frequency fCRS greatly stabilizes the characteristics but the load transient response characteristic is impaired. 7.1 Selection of Phase Compensation Resistor R1 The phase compensation resistance R1 can be determined by using the following equation. 𝑅1 = 2 × 𝜋 × 𝑉𝑂𝑈𝑇 × 𝑓𝐶𝑅𝑆 × 𝐶𝑂𝑈𝑇 𝑉𝐹𝐵 × 𝐺𝑀𝑃 × 𝐺𝑀𝐴 [Ω] Where: VOUT is the output voltage fCRS is the crossover frequency COUT is the output capacitance VFB is the feedback reference voltage (1.0 V (Typ)) GMP is the current sense gain (14 A / V (Typ)) GMA is the error amplifier transconductance (200 µA/V (Typ)) 7.2 Selection of phase compensation capacitance C2 For stable operation of the DC/DC converter, inserting a zero point under 1/9 of the zero crossover frequency cancels the phase delay due to the pole formed by the load often provides favorable characteristics. The phase compensation capacitance C2 can be determined by using the following equation. 𝐶2 = 1 2 × 𝜋 × 𝑅1 × 𝑓𝑍 [F] Where:fz is Zero point inserted 7.3 Loop stability In order to secure stability of DC/DC converter, confirm there is enough phase margin on actual equipment. Under the worst condition, it is recommended to secure phase margin more than 45°. In practice, the characteristics may vary depending on PCB layout, routing of wiring, types of parts to use and operating environments (temperature, etc.). Use gain-phase analyzer or FRA to confirm frequency characteristics on actual equipment. Contact the manufacturer of each measuring equipment to check its measuring method, etc. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA PCB Layout Design PCB layout design for DC/DC converter power supply IC is as important as the circuit design. Appropriate layout can avoid various problems caused by power supply circuit. Figure 66-a to 66-c show the current path in a buck DC/DC converter circuit. The Loop1 in Figure 66-a is a current path when High Side switch is ON, the Loop2 in Figure 66-b is when High Side switch is OFF. The thick line in Figure 66-c shows the difference between Loop1 and Loop2. The current in thick line changes sharply each time the switching element change from OFF to ON, and vice versa. These sharp changes induce several harmonics in the waveform. Therefore, the loop area of thick line that is consisted by input capacitor and IC should be as small as possible to minimize noise. For more detail, refer to application note of switching regulator series “PCB Layout Techniques of Buck Converter”. Loop1 VIN VOUT L High Side switch CIN COUT GND GND Figure 61-a. Current path when High Side switch = ON VIN VOUT L CIN High Side switch COUT Loop2 GND GND Figure 61-b. Current Path when High Side switch = OFF VIN VOUT L CIN High Side FET COUT GND GND Figure 61-c. Difference of Current and Critical Area in Layout www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA PCB Layout Design - continued Accordingly, design the PCB layout with particular attention paid to the following points. ·Provide the input capacitor close to the VIN pin of the IC as possible on the same plane as the IC. ·If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist heat dissipation from the IC and the surrounding components. ·Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Trace to the coil and catch diode as thick and short as possible. ·Provide lines connected to the FB pin and the COMP pin as far from the SW node. ·Provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. Bottom Layer Top Layer Figure 62. Example of Sample Board Layout Pattern www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA I/O Equivalence Circuit 1. SW 7. BOOT 3. COMP VREG BOOTREG BOOT VIN COMP SW GND GND 4. FB GND GND 5. RT FB RT GND GND GND 6. EN EN GND GND GND GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 GND 31/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 32/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 63. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 33/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Ordering Information B D 9 G 5 0 0 E F J Package EFJ: HTSOP-J8 - LAE2 Product Class LA: For Industrial Applications Packaging and forming specification E2: Embossed tape and reel Marking Diagram HTSOP-J8 (TOP VIEW) Part Number Marking D 9 G 5 0 0 LOT Number Pin 1 Mark www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 34/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Physical Dimension and Packing Information Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 HTSOP-J8 35/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 BD9G500EFJ-LA Revision History Date Revision 11.Jun.2020 001 Changes New Release www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 36/36 TSZ02201-0F2F0AJ00280-1-2 11.Jun.2020 Rev.001 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001