ML610Q439P-NNNTC03A7

FEDL610Q439-3 Issue Date: Jun 7, 2011 ML610Q438/ML610Q439 8-bit Microcontroller with a Built-in LCD driver GENERAL DESCRIPTION This LSI is a high-performance 8-bit CMOS microcontroller into which rich peripheral circuits, such as synchronous serial port, UART, I2C bus interface (master), melody driver, battery level detect circuit, RC oscillation type A/D converter, and LCD driver, are incorporated around 8-bit CPU nX-U8/100. The CPU nX-U8/100 is capable of efficient instruction execution in 1-instruction 1-clock mode by 3-stage pipe line architecture parallel procesing. The Flash ROM that is installed as program memory achieves low-voltage low-power consumption operation (read operation) equivalent to mask ROM and is most suitable for battery-driven applications. The on-chip debug function that is installed enables program debugging and programming. FEATURES  CPU  8-bit RISC CPU (CPU name: nX-U8/100)  Instruction system: 16-bit instructions  Instruction set: Transfer, arithmetic operations, comparison, logic operations, multiplication/division, bit manipulations, bit logic operations, jump, conditional jump, call return stack manipulations, arithmetic shift, and so on  On-Chip debug function  Minimum instruction execution time 30.5 s (@32.768 kHz system clock) 0.24 4s (@4.096 MHz system clock)  Internal memory  Internal 128KByte Flash ROM (64K16 bits) (including unusable 1KByte TEST area)  Internal 6KByte Data RAM (61448 bits), 1KByte Display Allocation RAM (1024 x 8bit)  Internal 192-byte RAM for display  Interrupt controller  2 non-maskable interrupt sources (Internal source: 1, External source: 1)  27 maskable interrupt sources (Internal sources: 19, External sources: 8)  Time base counter  Low-speed time base counter 1 channel Frequency compensation (Compensation range: Approx. 488ppm to +488ppm. Compensation accuracy: Approx. 0.48ppm)  High-speed time base counter 1 channel  Watchdog timer  Non-maskable interrupt and reset  Free running  Overflow period: 4 types selectable (125ms, 500ms, 2s, and 8s)  Timers  8 bits  4 channels (16-bit configuration available)  1 kHz timer  10 Hz/1 Hz interrupt function 1/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439  Capture  Time base capture  2 channels (4096 Hz to 32 Hz)  PWM  Resolution 16 bits  3 channel  Synchronous serial port  Master/slave selectable  LSB first/MSB first selectable  8-bit length/16-bit length selectable  Timer interrupt is used as a serial clock and selection is possible  UART  TXD/RXD  1 channel  Bit length, parity/no parity, odd parity/even parity, 1 stop bit/2 stop bits  Positive logic/negative logic selectable  Built-in baud rate generator  I2C bus interface  Master function only  Fast mode (400 kbps@４MHｚ), standard mode (100 kbps@1MHｚ, 50kbps@500kHz)  Melody driver  Scale: 29 types (Melody sound frequency: 508 Hz to 32.768 kHz)  Tone length: 63 types  Tempo: 15 types  Buzzer output mode (4 output modes, 8 frequencies, 16 duty levels)  RC oscillation type A/D converter  24-bit counter  Time division  2 channels  Successive approximation type A/D converter  12-bit A/D converter  Input  2 channels  General-purpose ports  Non-maskable interrupt input port  1 channel  Input-only port  10 channels (including secondary functions)  Output-only port  3 channels (including secondary functions)  Input/output port 20 channels (including secondary functions)  LCD driver  Dot matrix can be supported. ML610Q438: 1344 dots max. (56 seg  24 com) ML610Q439: 1024 dots max. (64 seg  16 com)  1/1 to 1/24 duty  1/3 or 1/4 bias (built-in bias generation circuit)  Frame frequency selecable (approx. 64 Hz, 73 Hz, 85 Hz, and 102 Hz)  Bias voltage multiplying clock selectable (8 types)  Contrast adjustment (1/3 bias: 32 steps, 1/4 bias: 20 steps)  LCD drive stop mode, LCD display mode, all LCDs on mode, and all LCDs off mode selectable  Programmable display allocation function (available only when 1/1~1/8 duty is selected)  The metal option of only ML610Q439 Type B : 16com x 64seg (seg63 to seg0: segment port) Type C : 16com x 56seg (seg63 to seg56: output port、seg55 to seg0: segment port) Type D : 16com x 48seg (seg63 to seg48: output port、seg47 to seg0: segment port) 2/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 Type E : 16com x 40seg (seg63 to seg40: output port、seg39 to seg0: segment port) Type F : 16com x 32seg (seg63 to seg32: output port、seg31 to seg0: segment port)  Reset  Reset through the RESET_N pin  Power-on reset generation when powered on  Reset when oscillation stop of the low-speed clock is detected  Reset by the watchdog timer (WDT) overflow  Power supply voltage detect function  Judgment voltages: One of 16 levels  Judgment accuracy: 2% (Typ.)  Clock  Low-speed clock: (This LSI can not guarantee the operation withoug low-speed clock) Crystal oscillation (32.768 kHz)  High-speed clock: Built-in RC oscillation (2M/500kHz) Built-in PLL oscillation (8.192 MHz 2.5%), crystal/ceramic oscillation (4.096 MHz), external clock  Selection of high-speed clock mode by software: Built-in RC oscillation, built-in PLL oscillation, crystal/ceramic oscillation, external clock  Power management  HALT mode: Instruction execution by CPU is suspended (peripheral circuits are in operating states).  STOP mode: Stop of low-speed oscillation and high-speed oscillation (Operations of CPU and peripheral circuits are stopped.)  Clock gear: The frequency of high-speed system clock can be changed by software (1/1, 1/2, 1/4, or 1/8 of the oscillation clock)  Block Control Function: Power down (reset registers and stop clock supply) the circuits of unused peripherals.  Shipment  Chip (Die) ML610Q438-xxxWA (Blank product: ML610Q438-NNNWA) ML610Q438P-xxxWA (Blank product: ML610Q438P-NNNWA) ML610Q439-xxxWA (Blank product: ML610Q439-NNNWA) ML610Q439P-xxxWA (Blank product: ML610Q439P-NNNWA)  144-pin plastic LQFP ML610Q438-xxxTCZ03A (Blank product: ML610Q438-NNNTCZ03A) ML610Q438P-xxxTCZ03A (Blank product: ML610Q438P-NNNTCZ03A) ML610Q439-xxxTCZ03A (Blank product: ML610Q439-NNNTCZ03A) ML610Q439P-xxxTCZ03A (Blank product: ML610Q439P-NNNTCZ03A) xxx: ROM code number  Guaranteed operating range  Operating temperature: 20C to 70C (P version : 40C to 85C)  Operating voltage: VDD = 1.1V to 3.6V, AVDD = 2.2V to 3.6V 3/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 BLOCK DIAGRAM ML610Q438 Block Diagram Figure 1 show the block diagram of the ML610Q438. "*" indicates the secondary function of each port. CPU (nX-U8/100) EPSW1～3 GREG 0～15 PSW Timing Controller On-Chip ICE TEST ECSR1～3 LR DSR/CSR EA PC ALU SP Instruction Decoder Instruction Register Data-bus VDD VSS RESET_N ELR1～3 RESET & TEST XT0 XT1 INT 1 OSC INT 4 LSCLK* OUTCLK* VDDL VDDX INT 1 Power IN0* CS0* RS0* RT0* CRT0* RCM* IN1* CS1* RS1* RT1* TBC SCK0* SIN0* SOUT0* UART RXD0* TXD0* I2C SDA* SCL* INT 1 INT 1 INT 3 PWM ×3 1kHzTC Capture ×2 INT 4 RC-ADC ×2 WDT VPP SSIO PWM0* to PWM2* INT 1 Melody INT 1 INT 5 8bit Timer ×4 MD0* NMI P00 to P03 P10 to P11 GPIO P20 to P22 P30 to P35 P40 to P47 AVDD AVSS VREF INT 1 RAM 6144byte Interrupt Controller OSC0* OSC1* Program Memory (Flash) 128Kbyte BUS Controller INT 1 Display Allocation RAM 1KByte 12bit-ADC AIN0, AIN1 Display RAM 192Byte BLD LCD Driver COM0 to COM23 LCD BIAS VL1, VL2, VL3, VL4 SEG0 to SEG55 C1, C2, C3, C4 Figure 1 ML610Q438 Block Diagram 4/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 ML610Q439 Block Diagram Figure 2 show the block diagram of the ML610Q439. "*" indicates the secondary function of each port. CPU (nX-U8/100) EPSW1～3 GREG 0～15 PSW Timing Controller On-Chip ICE TEST ECSR1～3 LR DSR/CSR EA PC ALU SP Instruction Decoder Instruction Register Data-bus VDD VSS RESET_N ELR1～3 RESET & TEST XT0 XT1 INT 1 OSC INT 4 LSCLK* OUTCLK* VDDL VDDX INT 1 Power IN0* CS0* RS0* RT0* CRT0* RCM* IN1* CS1* RS1* RT1* TBC SCK0* SIN0* SOUT0* UART RXD0* TXD0* I2C SDA* SCL* INT 1 INT 1 INT 3 PWM ×3 1kHzTC Capture ×2 INT 4 RC-ADC ×2 WDT VPP SSIO PWM0* to PWM2* INT 1 Melody INT 1 INT 5 8bit Timer ×4 MD0* NMI P00 to P03 P10 to P11 GPIO P20 to P22 P30 to P35 P40 to P47 AVDD AVSS VREF INT 1 RAM 6144byte Interrupt Controller OSC0* OSC1* Program Memory (Flash) 128Kbyte BUS Controller INT 1 Display Allocation RAM 1KByte 12bit-ADC AIN0, AIN1 Display RAM 192Byte BLD LCD Driver COM0 to COM15 LCD BIAS VL1, VL2, VL3, VL4 SEG0 to SEG63 C1, C2, C3, C4 Figure 2 ML610Q439 Block Diagram 5/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 PIN CONFIGURATION AVDD (NC) AIN1 AIN0 VSS P07 P06 P05 P04 PA5 PA4 PA3 PA2 PA1 PA0 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 COM17 COM18 COM19 COM20 COM21 COM22 COM23 SEG55 SEG54 SEG53 SEG52 SEG51 ML610Q438 LQFP144 Pin Layout 108pin 72pin 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 109pin 73pin VREF AVSS VSS P20 P21 P22 P40 P41 VPP RESET_N P44 P45 P46 P47 P30 P31 P34 P32 P33 P35 TEST VDD VDDL VSS VDDX XT0 (NC) XT1 P42 P43 VL1 VL2 VL3 VL4 C1 C2 L610Q438 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 144pin 1pin C3 C4 P00/EXI0 P01/EXI1 P02/EXI2 P03/EXI3 NMI VSS P10 (NC) P11 VDD COM0 COM1 COM2 COM3 COM4 COM5 COM6 COM7 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 SEG50 SEG49 SEG48 SEG47 SEG46 SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 (NC) SEG16 37pin 36pin (NC): No Connection Figure 3 ML610Q438 LQFP144 Pin Configuration 6/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 AVDD (NC) AIN1 AIN0 VSS P07 P06 P05 P04 PA5 PA4 PA3 PA2 PA1 PA0 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 SEG63 SEG62 SEG61 SEG60 SEG59 SEG58 SEG57 SEG56 SEG55 SEG54 SEG53 SEG52 SEG51 ML610Q439 LQFP144 Pin Layout 108pin 72pin 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 109pin 73pin VREF AVSS VSS P20 P21 P22 P40 P41 VPP RESET_N P44 P45 P46 P47 P30 P31 P34 P32 P33 P35 TEST VDD VDDL VSS VDDX XT0 (NC) XT1 P42 P43 VL1 VL2 VL3 VL4 C1 C2 L610Q439 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 144pin 1pin C3 C4 P00/EXI0 P01/EXI1 P02/EXI2 P03/EXI3 NMI VSS P10 (NC) P11 VDD COM0 COM1 COM2 COM3 COM4 COM5 COM6 COM7 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 SEG50 SEG49 SEG48 SEG47 SEG46 SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 (NC) SEG16 37pin 36pin (NC): No Connection Figure 4 ML610Q439 LQFP144 Pin Configuration 7/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 AVDD AIN1 AIN0 VSS P07 P06 P05 P04 PA5 PA4 PA3 PA2 PA1 PA0 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 COM17 COM18 COM19 COM20 COM21 COM22 COM23 SEG55 SEG54 SEG53 SEG52 SEG51 83 82 81 80 79 78 77 76 75 74 73 72 71 □□□□□□□□□□□□□□□□□□□□□□ □□□□□□□□ □□□□□ □□ □□□□□□□□□□□□□□□□□□□□□□□□ 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 SEG50 SEG49 SEG48 SEG47 SEG46 SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 3.46m COM0 COM1 COM2 COM3 COM4 COM5 COM6 COM7 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 □□□□□□□□□ 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ P11 10 VDD 11 □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ 1 2 3 4 5 6 7 8 9 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 C3 C4 P00/EXI P01/EXI P02/EXI P03/EXI NMI VSS P10 VREF AVSS VSS P20 P21 P22 P40 P41 VPP RESET_N P44 P45 P46 P47 P30 P31 P34 P32 P33 P35 TEST VDD VDDL VSS VDDX XT0 XT1 P42 P43 VL1 VL2 VL3 VL4 C1 C2 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 ML610Q438 Chip Pin Layout & Dimension 3.51mm Chip size: PAD count: Minimum PAD pitch: PAD aperture: Chip thickness: Voltage of the rear side of chip: 3.51 mm  3.46 mm 140 pins 80 m 80 m  80 m 350 m VSS level Figure 5 ML610Q438 Chip Layout & Dimension 8/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 AVDD AIN1 AIN0 VSS P07 P06 P05 P04 PA5 PA4 PA3 PA2 PA1 PA0 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 SEG63 SEG62 SEG61 SEG60 SEG59 SEG58 SEG57 SEG56 SEG55 SEG54 SEG53 SEG52 SEG51 83 82 81 80 79 78 77 76 75 74 73 72 71 □□□□□□□□□□□□□□□□□□□□□□ □□□□□□□□ □□□□□ □□ □□□□□□□□□□□□□□□□□□□□□□□□ 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 SEG50 SEG49 SEG48 SEG47 SEG46 SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 3.46mm COM0 COM1 COM2 COM3 COM4 COM5 COM6 COM7 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 □□□□□□□□□ 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ P11 10 VDD 11 □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ □ 1 2 3 4 5 6 7 8 9 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 C3 C4 P00/EXI P01/EXI P02/EXI P03/EXI NMI VSS P10 VREF AVSS VSS P20 P21 P22 P40 P41 VPP RESET_N P44 P45 P46 P47 P30 P31 P34 P32 P33 P35 TEST VDD VDDL VSS VDDX XT0 XT1 P42 P43 VL1 VL2 VL3 VL4 C1 C2 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 ML610Q439 Chip Pin Layout & Dimension 3.51mm Chip size: PAD count: Minimum PAD pitch: PAD aperture: Chip thickness: Voltage of the rear side of chip: 3.51 mm  3.46 mm 140 pins 80 m 80 m  80 m 350 m VSS level Figure 6 ML610Q439 Chip Layout & Dimension 9/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 ML610Q438 Pad Coordinates Table 1 ML610Q438 Pad Coordinates Chip Center: X=0,Y=0 PAD No. Pad Name X (μm) Y (μm) PAD No. Pad Name X (μm) Y (μm) PAD No. Pad Name X (μm) Y (μm) 1 C3 -1485 -1624 48 SEG28 1649 -400 95 PA3 -525 1624 2 C4 -1405 -1624 49 SEG29 1649 -320 96 PA4 -605 1624 3 P00/EXI0 -1315 -1624 50 SEG30 1649 -240 97 PA5 -685 1624 4 P01/EXI1 -1235 -1624 51 SEG31 1649 -160 98 P04 -765 1624 5 P02/EXI2 /RXD0/P2 CK -1155 -1624 52 SEG32 1649 -80 99 P05 -845 1624 6 P03/EXI3 -1075 -1624 53 SEG33 1649 0 100 P06 -925 1624 7 NMI -995 -1624 54 SEG34 1649 80 101 P07 -1005 1624 8 VSS -865 -1624 55 SEG35 1649 160 102 VSS -1106 1624 9 P10 -785 -1624 56 SEG36 1649 240 103 AIN0 -1186 1624 10 P11 -625 -1624 57 SEG37 1649 320 104 AIN1 -1366 1624 11 VDD -545 -1624 58 SEG38 1649 400 105 AVDD -1446 1624 12 COM0 -445 -1624 59 SEG39 1649 480 106 VREF -1649 1430 13 COM1 -365 -1624 60 SEG40 1649 560 107 AVSS -1649 1270 14 COM2 -285 -1624 61 SEG41 1649 640 108 VSS -1649 1190 15 COM3 -205 -1624 62 SEG42 1649 720 109 P20 -1649 1095 16 COM4 -125 -1624 63 SEG43 1649 800 110 P21 -1649 1015 17 COM5 -45 -1624 64 SEG44 1649 880 111 P22 -1649 935 18 COM6 35 -1624 65 SEG45 1649 960 112 P40 -1649 855 19 COM7 115 -1624 66 SEG46 1649 1040 113 P41 -1649 775 20 SEG0 235 -1624 67 SEG47 1649 1120 114 VPP -1649 695 21 SEG1 315 -1624 68 SEG48 1649 1200 115 RESET_N -1649 615 22 SEG2 395 -1624 69 SEG49 1649 1280 116 P44 -1649 535 23 SEG3 475 -1624 70 SEG50 1649 1360 117 P45 -1649 455 24 SEG4 555 -1624 71 SEG51 1515 1624 118 P46 -1649 375 25 SEG5 635 -1624 72 SEG52 1435 1624 119 P47 -1649 295 26 SEG6 715 -1624 73 SEG53 1355 1624 120 P30 -1649 215 27 SEG7 795 -1624 74 SEG54 1275 1624 121 P31 -1649 135 28 SEG8 875 -1624 75 SEG55 1195 1624 122 P34 -1649 55 29 SEG9 955 -1624 76 COM23 1095 1624 123 P32 -1649 -25 30 SEG10 1035 -1624 77 COM22 1015 1624 124 P33 -1649 -105 31 SEG11 1115 -1624 78 COM21 935 1624 125 P35 -1649 -185 32 SEG12 1195 -1624 79 COM20 855 1624 126 TEST -1649 -265 33 SEG13 1275 -1624 80 COM19 775 1624 127 VDD -1649 -345 34 SEG14 1355 -1624 81 COM18 695 1624 128 VDDL -1649 -425 35 SEG15 1435 -1624 82 COM17 615 1624 129 VSS -1649 -505 36 SEG16 1649 -1360 83 COM16 535 1624 130 VDDX -1649 -585 37 SEG17 1649 -1280 84 COM15 375 1624 131 XT0 -1649 -665 38 SEG18 1649 -1200 85 COM14 295 1624 132 XT1 -1649 -825 39 SEG19 1649 -1120 86 COM13 215 1624 133 P42 -1649 -905 40 SEG20 1649 -1040 87 COM12 135 1624 134 P43 -1649 -985 41 SEG21 1649 -960 88 COM11 55 1624 135 VL1 -1649 -1080 42 SEG22 1649 -880 89 COM10 -25 1624 136 VL2 -1649 -1160 43 SEG23 1649 -800 90 COM9 -105 1624 137 VL3 -1649 -1240 44 SEG24 1649 -720 91 COM8 -185 1624 138 VL4 -1649 -1320 45 SEG25 1649 -640 92 PA0 -285 1624 139 C1 -1649 -1400 46 SEG26 1649 -560 93 PA1 -365 1624 140 C2 -1649 -1480 47 SEG27 1649 -480 94 PA2 -445 1624 10/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 ML610Q439 Pad Coordinates Table 2 ML610Q439 Pad Coordinates PAD No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 Pad Name C3 C4 P00/EXI0 P01/EXI1 P02/EXI2 /RXD0/P2 CK P03/EXI3 NMI VSS P10 P11 VDD COM0 COM1 COM2 COM3 COM4 COM5 COM6 COM7 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 Chip Center: X=0,Y=0 Pad X Y Name (μm) (μm) PA3 -525 1624 PA4 -605 1624 PA5 -685 1624 P04 -765 1624 X (μm) -1485 -1405 -1315 -1235 Y (μm) -1624 -1624 -1624 -1624 PAD No. 48 49 50 51 Pad Name SEG28 SEG29 SEG30 SEG31 X (μm) 1649 1649 1649 1649 Y (μm) -400 -320 -240 -160 PAD No. 95 96 97 98 -1155 -1624 52 SEG32 1649 -80 99 P05 -845 1624 -1075 -995 -865 -785 -625 -545 -445 -365 -285 -205 -125 -45 35 115 235 315 395 475 555 635 715 795 875 955 1035 1115 1195 1275 1355 1435 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1624 -1360 -1280 -1200 -1120 -1040 -960 -880 -800 -720 -640 -560 -480 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 SEG33 SEG34 SEG35 SEG36 SEG37 SEG38 SEG39 SEG40 SEG41 SEG42 SEG43 SEG44 SEG45 SEG46 SEG47 SEG48 SEG49 SEG50 SEG51 SEG52 SEG53 SEG54 SEG55 SEG56 SEG57 SEG58 SEG59 SEG60 SEG61 SEG62 SEG63 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 PA0 PA1 PA2 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1649 1515 1435 1355 1275 1195 1095 1015 935 855 775 695 615 535 375 295 215 135 55 -25 -105 -185 -285 -365 -445 0 80 160 240 320 400 480 560 640 720 800 880 960 1040 1120 1200 1280 1360 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 1624 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 P06 P07 VSS AIN0 AIN1 AVDD VREF AVSS VSS P20 P21 P22 P40 P41 VPP RESET_N P44 P45 P46 P47 P30 P31 P34 P32 P33 P35 TEST VDD VDDL VSS VDDX XT0 XT1 P42 P43 VL1 VL2 VL3 VL4 C1 C2 -925 -1005 -1106 -1186 -1366 -1446 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 -1649 1624 1624 1624 1624 1624 1624 1430 1270 1190 1095 1015 935 855 775 695 615 535 455 375 295 215 135 55 -25 -105 -185 -265 -345 -425 -505 -585 -665 -825 -905 -985 -1080 -1160 -1240 -1320 -1400 -1480 11/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 PIN LIST PAD No. Q439 Q438 8,102, 108,129 Primary function Pin name I/O Function Tertiary function Pin name I/O Function Vss  Negative power supply pin       Positive power supply pin Power supply pin for  internal logic (internally generated) Power supply pin for  low-speed oscillation (internally generated) Power supply pin for  Flash ROM Negative power supply pin for successive  approximation type ADC Positive power supply pin for successive  approximation type ADC Power supply pin for  LCD bias (internally generated) Power supply pin for  LCD bias (internally generated) Power supply pin for  LCD bias (internally generated) Power supply pin for  LCD bias (internally generated) Capacitor connection  pin for LCD bias generation Capacitor connection  pin for LCD bias generation Capacitor connection  pin for LCD bias generation Capacitor connection  pin for LCD bias generation Input/output pin for I/O testing                                                                                           Reset input pin       Low-speed clock oscillation pin Low-speed clock oscillation pin Reference power supply pin for successive approximation type ADC Successive approximation type ADC input                         8,102, 108,12 Secondary function Pin name I/O Function 9 11,127 11,127 VDD  128 128 VDDL 130 130 VDDX 114 114 VPP 107 107 AVSS 105 105 AVDD 135 135 VL1 136 136 VL2 137 137 VL3 138 138 VL4 139 139 C1 140 140 C2 1 1 C3 2 2 C4 126 126 TEST 115 115 RESET_ N I 131 131 XT0 I 132 132 XT1 O 106 106 VREF  103 103 AIN0 I 12/36 FEDL610Q439-3 LAPIS Semiconductor PAD No. Q439 Q438 ML610Q438/ML610Q439 Primary function Pin name I/O 104 104 AIN1 I 7 7 NMI I 3 3 P00/EXI0/C AP0 I 4 4 P01/EXI1/C AP1 I 5 5 P02/EXI2 /RXD0 /P2CK I 6 6 P03/EXI3 I 98 98 P04/EXI4 I/O 99 99 P05/EXI5 I/O 100 100 P06/EXI6 I/O 101 101 P07/EXI7 I/O 9 9 P10 I Secondary function Function Pin name Successive approximation type  ADC input Non-maskable interrupt  pin Input port, External interrupt 0 input,  Capture 0 input Input port, External  interrupt 1 input, Capture 1 input Input port, External interrupt 2, UART0  receive, PWM2 external clock input Input port, External  interrupt 3 Input port, External  interrupt 4 Input port, External  interrupt 5 Input port, External  interrupt 6 Input port, External  interrupt 7 Input port OSC0 Tertiary function I/O Function Pin name I/O Function                                                   I High-speed oscillation    High-speed oscillation 10 10 P11 I Input port OSC1 O    109 109 P20/LED0 O Output port LSCLK O Low-speed clock output PWM2 O PWM2 output 110 110 P21/LED1 O Output port OUTCLK O High-speed clock output    MD0 O   O PWM2 output       O PWM0 output O PWM1 output I SSIO data input 111 111 P22/LED2 O Output port 120 120 P30 I/O Input/output port IN0 I 121 121 P31 I/O Input/output port CS0 O 123 123 P32 I/O Input/output port RS0 O 124 124 P33 I/O Input/output port RT0 O 122 122 P34 I/O Input/output port RCT0 O 125 125 P35 I/O Input/output port RCM O 112 112 P40 I/O Input/output port SDA I/O 113 113 P41 I/O Input/output port SCL I/O 133 133 P42 I/O Input/output port RXD0 I/O Input/output port Input/output port, Timer 0/Timer 2/PWM0 external clock input Input/output port, Timer 1/Timer 3/PWM1 external clock input Input/output port, PWM2 external clock input TXD0 IN1 I CS1 O RS1 O 134 134 P43 116 116 P44/T02P0 I/O CK 117 117 P45/T13P1 I/O CK 118 118 P46/T46P2 I/O CK Melody output  RC type ADC0 PWM2 oscillation input pin RC type ADC0 reference capacitor  connection pin RC type ADC0  reference resistor connection pin RC type ADC0 resistor  sensor connection pin RC type ADC0 resistor/capacitor PWM0 sensor connection pin RC type ADC oscillation PWM1 monitor I2C data input/output SIN0 I2C clock input/output SCK0 I UART data input SOUT0 O SSIO data output O UART data output PWM0 O PWM0 output RC type ADC1 oscillation input pin SIN0 I SSIO0 data input SCK0 I/O SSIO0 synchronous clock SOUT0 O SSIO0 data output RC type ADC1 reference capacitor connection pin RC type ADC1 reference resistor connection pin I/O SSIO synchronous clock 13/36 FEDL610Q439-3 LAPIS Semiconductor PAD No. Q439 Q438 ML610Q438/ML610Q439 Primary function Pin name I/O Function Secondary function Pin name I/O Function Tertiary function Pin name I/O Function 119 119 P47 I/O Input/output port RT1 O RC type ADC1 resistor sensor connection pin 92 92 PA0 I/O Input/output port       93 93 PA1 I/O Input/output port       94 94 PA2 I/O Input/output port       95 95 PA3 I/O Input/output port       96 96 PA4 I/O Input/output port       97 97 PA5 I/O Input/output port       12 12 COM0 O LCD common pin       13 13 COM1 O LCD common pin       14 14 COM2 O LCD common pin       15 15 COM3 O LCD common pin       16 16 COM4 O LCD common pin       17 17 COM5 O LCD common pin       18 18 COM6 O LCD common pin       19 19 COM7 O LCD common pin       91 91 COM8 O LCD common pin       90 90 COM9 O LCD common pin       89 89 COM10 O LCD common pin       88 88 COM11 O LCD common pin       87 87 COM12 O LCD common pin       86 86 COM13 O LCD common pin       85 85 COM14 O LCD common pin       84 84 COM15 O LCD common pin        83 COM16 O LCD common pin        82 COM17 O LCD common pin        81 COM18 O LCD common pin        80 COM19 O LCD common pin        79 COM20 O LCD common pin        78 COM21 O LCD common pin        77 COM22 O LCD common pin        76 COM23 O LCD common pin       20 20 SEG0 O LCD segment pin       21 21 SEG1 O LCD segment pin       22 22 SEG2 O LCD segment pin       23 23 SEG3 O LCD segment pin       24 24 SEG4 O LCD segment pin       25 25 SEG5 O LCD segment pin       26 26 SEG6 O LCD segment pin       27 27 SEG7 O LCD segment pin       28 28 SEG8 O LCD segment pin       29 29 SEG9 O LCD segment pin       30 30 SEG10 O LCD segment pin       31 31 SEG11 O LCD segment pin       32 32 SEG12 O LCD segment pin       33 33 SEG13 O LCD segment pin       34 34 SEG14 O LCD segment pin       35 35 SEG15 O LCD segment pin       36 36 SEG16 O LCD segment pin       PWM1 O PWM1 output 14/36 FEDL610Q439-3 LAPIS Semiconductor PAD No. Q439 Q438 ML610Q438/ML610Q439 Primary function Secondary function Pin name I/O Function Tertiary function Pin name I/O Function 37 37 SEG17 O LCD segment pin    Pin name I/O   Function  38 38 SEG18 O LCD segment pin       39 39 SEG19 O LCD segment pin       40 40 SEG20 O LCD segment pin       41 41 SEG21 O LCD segment pin       42 42 SEG22 O LCD segment pin       43 43 SEG23 O LCD segment pin       44 44 SEG24 O LCD segment pin       45 45 SEG25 O LCD segment pin       46 46 SEG26 O LCD segment pin       47 47 SEG27 O LCD segment pin       48 48 SEG28 O LCD segment pin       49 49 SEG29 O LCD segment pin       50 50 SEG30 O LCD segment pin       51 51 SEG31 O LCD segment pin       52 52 SEG32 O LCD segment pin       53 53 SEG33 O LCD segment pin       54 54 SEG34 O LCD segment pin       55 55 SEG35 O LCD segment pin       56 56 SEG36 O LCD segment pin       57 57 SEG37 O LCD segment pin       58 58 SEG38 O LCD segment pin       59 59 SEG39 O LCD segment pin       60 60 SEG40 O LCD segment pin       61 61 SEG41 O LCD segment pin       62 62 SEG42 O LCD segment pin       63 63 SEG43 O LCD segment pin       64 64 SEG44 O LCD segment pin       65 65 SEG45 O LCD segment pin       66 66 SEG46 O LCD segment pin       67 67 SEG47 O LCD segment pin       68 68 SEG48 O LCD segment pin       69 69 SEG49 O LCD segment pin       70 70 SEG50 O LCD segment pin       71 71 SEG51 O LCD segment pin       72 72 SEG52 O LCD segment pin       73 73 SEG53 O LCD segment pin       74 74 SEG54 O LCD segment pin       75 75 SEG55 O LCD segment pin       76  SEG56 O LCD segment pin       77  SEG57 O LCD segment pin       78  SEG58 O LCD segment pin       79  SEG59 O LCD segment pin       80  SEG60 O LCD segment pin       81  SEG61 O LCD segment pin       82  SEG62 O LCD segment pin       83  SEG63 O LCD segment pin       15/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 PIN DESCRIPTION Pin name I/O Description Primary/ Secondary/ Tertiary Logic — Negative — — — — Secondary Secondary — — Secondary — Secondary — Primary Positive Primary Positive Primary Positive Primary Positive Primary Positive Primary Positive Secondary Positive Primary/Se condary Positive System Reset input pin. When this pin is set to a “L” level, system reset mode is set and the internal section is initialized. When this pin is set to a “H” level subsequently, program execution starts. A pull-up resistor is internally connected. XT0 I Crystal connection pin for low-speed clock. XT1 O A 32.768 kHz crystal oscillator (see measuring circuit 1) is connected to this pin. Capacitors CDL and CGL are connected across this pin and VSS as required. OSC0 I Crystal/ceramic connection pin for high-speed clock. OSC1 O A crystal or ceramic is connected to this pin (4.1 MHz max.). Capacitors CDH and CGH (see measuring circuit 1) are connected across this pin and VSS. This pin is used as the secondary function of the P10 pin(OSC0) and P11 pin(OSC1). LSCLK O Low-speed clock output pin. This pin is used as the secondary function of the P20 pin. OUTCLK O High-speed clock output pin. This pin is used as the secondary function of the P21 pin. General-purpose input port RESET_N I General-purpose input port. Since these pins have secondary functions, the pins cannot be used as a port when the secondary functions are used. P10-P11 I General-purpose input port. Since these pins have secondary functions, the pins cannot be used as a port when the secondary functions are used. General-purpose output port P20-P22 O General-purpose output port. Since these pins have secondary functions, the pins cannot be used as a port when the secondary functions are used. General-purpose input/output port P30-P35 I/O General-purpose input/output port. Since these pins have secondary functions, the pins cannot be used as a port when the secondary functions are used. P40-P47 I/O General-purpose input/output port. Since these pins have secondary functions, the pins cannot be used as a port when the secondary functions are used. PA0-PA5 I/O General-purpose input/output port. P00-P07 I UART TXD0 O RXD0 I UART data output pin. This pin is used as the secondary function of the P43 pin. UART data input pin. This pin is used as the secondary function of the P42 or the primary function of the P02 pin. 16/36 FEDL610Q439-3 LAPIS Semiconductor Pin name I/O ML610Q438/ML610Q439 Description Primary/ Secondary/ Tertiary Logic Secondary Positive Secondary Positive Tertiary — Tertiary Positive Tertiary Positive Tertiary Positive Primary — Tertiary Positive Primary — Tertiary Positive Primary — Primary Positive/ negative Positive/ negative 2 I C bus interface 2 SDA I/O I C data input/output pin. This pin is used as the secondary function of the P40 pin. This pin has an NMOS open drain output. When using this pin as 2 a function of the I C, externally connect a pull-up resistor. 2 SCL O I C clock output pin. This pin is used as the secondary function of the P41 pin. This pin has an NMOS open drain output. When using this pin as a 2 function of the I C, externally connect a pull-up resistor. Synchronous serial (SSIO) SCK0 SIN0 SOUT0 PWM PWM0 I/O Synchronous serial clock input/output pin. This pin is used as the tertiary function of the P41 or P45 pin. I Synchronous serial data input pin. This pin is used as the tertiary function of the P40 or P44 pin. O Synchronous serial data output pin. This pin is used as the tertiary function of the P42 or P46 pin. O T0P0CK I PWM1 O T1P1CK I PWM2 O P2CK I External interrupt NMI I EXI0-7 I PWM0 output pin. This pin is used as the tertiary function of the P43 or P34 pin. PWM0 external clock input pin. This pin is used as the primary function of the P44 pin. PWM1 output pin. This pin is used as the tertiary function of the P47 or P35 pin. PWM1 external clock input pin. This pin is used as the primary function of the P45 pin. PWM2 output pin. This pin is used as the tertiary function of the P20 or P30 pin. PWM2 external clock input pin. This pin is used as the primary function of the P02 pin. External non-maskable interrupt input pin. An interrupt is generated on both edges. External maskable interrupt input pins. Interrupt enable and edge selection can be performed for each bit by software. These pins are used as the primary functions of the P00-P07 pins. Primary Capture CAP0 I CAP1 I Capture trigger input pins. The value of the time base counter is captured in the register synchronously with the interrupt edge selected by software. These pins are used as the primary functions of the P00 pin(CAP0) and P01 pin(CAP1). Primary Primary Positive/ negative Positive/ negative Timer T0P0CK I T1P1CK I External clock input pin used for Timer 0. This pin is used as the primary function of the P44 pin. External clock input pin used for Timer 1. This pin is used as the primary function of the P45 pin. Melody MD0 O Melody/buzzer signal output pin. This pin is used as the secondary function of the P22 pin. LED drive LED0-2 O Nch open drain output pins to drive LED. Primary Primary — — Secondary Positive/ negative Primary Positive/ negative 17/36 FEDL610Q439-3 LAPIS Semiconductor Pin name I/O ML610Q438/ML610Q439 Description RC oscillation type A/D converter IN0 I Channel 0 oscillation input pin. This pin is used as the secondary function of the P30 pin. CS0 O Channel 0 reference capacitor connection pin. This pin is used as the secondary function of the P31 pin. RS0 O This pin is used as the secondary function of the P32 pin which is the reference resistor connection pin of Channel 0. RT0 O Resistor sensor connection pin of Channel 0 for measurement. This pin is used as the secondary function of the P34 pin. CRT0 O Resistor/capacitor sensor connection pin of Channel 0 for measurement. This pin is used as the secondary function of the P33 pin. RCM O RC oscillation monitor pin. This pin is used as the secondary function of the P35 pin. IN1 I Oscillation input pin of Channel 1. This pin is used as the secondary function of the P44 pin. CS1 O Reference capacitor connection pin of Channel 1. This pin is used as the secondary function of the P45 pin. RS1 O Reference resistor connection pin of Channel 1. This pin is used as the secondary function of the P46 pin. RT1 O Resistor sensor connection pin for measurement of Channel 1. This pin is used as the secondary function of the P47 pin. Successive approximation type A/D converter AVSS — Negative power supply pin for successive approximation type A/D converter. AVDD — Positive power supply pin for successive approximation type A/D converter. VREF — Reference power supply pin for successive approximation type A/D converter. AIN0 I Channel 0 analog input for successive approximation type A/D converter. AIN1 I Channel 1 analog input for successive approximation type A/D converter. LCD drive signal COM0-15 O COM8-23 O Common output pins. Common output pins. These pins are for the ML610Q438, but are not provided in the ML610Q439. SEG0-57 O Segment output pin. SEG58-63 O Segment output pins. These pins are for the ML610Q439, but are not provided in the ML610Q438. LCD driver power supply VL1 — Power supply pins for LCD bias (internally generated). Capacitors Ca, Cb, VL2 — Cc, and Cd (see measuring circuit 1) are connected between VSS and VL1, V — VL2, VL3, and VL4, respectively. L3 VL4 C1 C2 C3 C4 For testing — — — — — Power supply pins for LCD bias (internally generated). Capacitors C12 and C34 (see measuring circuit 1) are connected between C1 and C2 and between C3 and C4, respectively. TEST I/O Input/output pin for testing. A pull-down resistor is internally connected. Power supply VSS — Negative power supply pin. Primary/ Secondary/ Tertiary Secondary Secondary Secondary Secondary Secondary Secondary Secondary Secondary Secondary Secondary Logic — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — 18/36 FEDL610Q439-3 LAPIS Semiconductor VDD VDDL — — VDDX — VPP — Positive power supply pin. Positive power supply pin (internally generated) for internal logic. Capacitors CL0 and CL1 (see measuring circuit 1) are connected between this pin and VSS. Plus-side power supply pin (internally generated) for low-speed oscillation. Capacitor Cx (see measuring circuit 1) is connected between this pin and VSS. Power supply pin for programming Flash ROM. A pull-up resistor is internally connected. ML610Q438/ML610Q439 — — — — — — — — 19/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 TERMINATION OF UNUSED PINS Table 3 shows methods of terminating the unused pins. Table 3 Termination of Unused Pins Pin Recommended pin termination Open VPP AVDD VSS AVSS VSS VREF VSS AIN0, AIN1 Open VL1, VL2, VL3, VL4 Open C1, C2, C3, C4 RESET_N TEST NMI P00 to P07 P10 to P11 P20 to P22 P30 to P35 P40 to P47 PA0 to PA5 COM0 to 23 SEG0 to 63 Open Open Open Open VDD or VSS VDD Open Open Open Open Open Open Note: It is recommended to set the unused input ports and input/output ports to the inputs with pull-down resistors/pull-up resistors or the output mode since the supply current may become excessively large if the pins are left open in the high impedance input setting. The main difference points of ML610Q438 and ML610Q439 Table 4 The main difference points of ML610Q438 and ML610Q439. Function LCD COM LCD SEG ML610Q438 ML610Q439 COM23 to COM0 SEG55 to SEG0 COM15 to COM0 SEG63 to SEG0 20/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS (VSS = AVSS = 0V) Parameter Symbol Condition Rating Unit Power supply voltage 1 VDD Ta = 25C 0.3 to +4.6 V Power supply voltage 2 AVDD Ta = 25C 0.3 to +4.6 V Power supply voltage 3 VPP Ta = 25C 0.3 to +9.5 V Power supply voltage 4 VDDL Ta = 25C 0.3 to +3.6 V Power supply voltage 5 Power supply voltage 6 Power supply voltage 7 VDDX VL1 VL2 Ta = 25C Ta = 25C Ta = 25C 0.3 to +3.6 0.3 to +1.75 0.3 to +3.5 V V V Power supply voltage 8 VL3 Ta = 25C 0.3 to +5.25 V Power supply voltage 9 VL4 Ta = 25C 0.3 to +7.0 V Input voltage VIN Ta = 25C 0.3 to VDD+0.3 V Output voltage VOUT Ta = 25C 0.3 to VDD+0.3 V Output current 1 IOUT1 Port3–A, Ta = 25C 12 to +11 mA Output current 2 IOUT2 Port2, Ta = 25C 12 to +20 mA Power dissipation PD Ta = 25C 122 mW Storage temperature TSTG  55 to +150 C RECOMMENDED OPERATING CONDITIONS (VSS = AVSS = 0V) Parameter Operating temperature Operating voltage Symbol TOP VDD Condition Range Unit ML610Q438/Q439 20 to +70 C ML610Q438P/Q439P    1.1 to 3.6 V AVDD  2.2 to 3.6 AVDD fOP VDD = 1.1 to 3.6V VDD = 1.3 to 3.6V VDD = 1.8 to 3.6V 30k to 36k 30k to 650k 30k to 4.2M Hz fXTL  32.768k Hz CDL CGL   0 to 12 0 to 12 pF fXTH  4.0M / 4.096M Hz CDH CGH CL0 CL1     24 24 1.030% 0.130% CX  0.130% F Capacitors externally connected to VL1, 2, 3, 4 pins Ca, b, c, d  1.030% F Capacitors externally connected across C1 and C2 pins and across C3 and C4 pins C12, C34  1.030% F Operating frequency (CPU) Low-speed crystal oscillation frequency Low-speed crystal oscillation external capacitor High-speed crystal/ceramic oscillation frequency High-speed crystal oscillation external capacitor Capacitor externally connected to VDDL pin Capacitor externally connected to VDDX pin pF F 21/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 OPERATING CONDITIONS OF FLASH ROM Parameter Operating temperature Symbol TOP VDD VDDL VPP CEP YDR Operating voltage Write cycles Data retention (VSS = AVSS = 0V) Range Unit 0 to +40 C 2.75 to 3.6 V 2.5 to 2.75 7.7 to 8.3 80 cycles years 10 Condition At write/erase *1 At write/erase *1 At write/erase *1 At write/erase   *1 : In addition the power supply to VDD pin and VPP pin, within the range 2.5V to 2.75V has to be supplied to VDDL pin when programming and eraseing Flash ROM. DC CHARACTERISTICS (1/5) (VDD = 1.1 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version,unless otherwise specified ) (1/5) Measuring Rating Parameter Symbol Condition Unit circuit Min. Typ. Max. 500kHz RC oscillation frequency 4 fRC PLL oscillation frequency* fPLL Low-speed crystal oscillation 2 start time* TXTL 500kHz RC oscillation start time High-speed crystal oscillation 3 start time* PLL oscillation start time Low-speed oscillation stop detect *1 time Reset pulse width Reset noise elimination pulse width Power-on reset activation power rise time VDD = 1.3 to 3.6V Ta = 25C Ta = 20 to +70C LSCLK = 32.768kHz VDD = 1.8 to 3.6V Typ. 10% Typ. 25% 500 500 Typ. 10% Typ. 25% kHz kHz -2.5% 8.192 +2.5% MHz   0.3 2 s TRC   50 500 s TXTH VDD = 1.8 to 3.6V ― 2 20 TPLL VDD = 1.8 to 3.6V ― 1 10 TSTOP  0.2 3 20 PRST  200   PNRST    0.3 TPOR    10 1 ms s ms *1: When low-speed crystal oscillation stops for a duration more than the low-speed oscillation stop detect time, the system is reset to shift to system reset mode. 2 * : Use 32.768KHz Crystal Resonator DT-26 (Load capacitance 6pF) (KDS: DAISHINKU CORP.) 3 * : Use 4.096MHz Crystal Oscillator CHC49SFWB (Kyocera). 4 * : 1024 clock average. RESET VIL1 RESET_N VIL1 PRST RESET_N pin reset 0.9xVDD VDD 0.1xVDD TPOR Power on reset 22/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 DC CHARACTERISTICS (2/5) (VDD = 1.1 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version, unless otherwise specified) (2/5) Measuring Rating Parameter Symbol Condition Unit circuit Min. Typ. Max. CN4–0 = 00H 0.89 0.94 0.99 CN4–0 = 01H 0.91 0.96 1.01 CN4–0 = 02H 0.93 0.98 1.03 CN4–0 = 03H 0.95 1.00 1.05 CN4–0 = 04H 0.97 1.02 1.07 CN4–0 = 05H 0.99 1.04 1.09 CN4–0 = 06H 1.01 1.06 1.11 CN4–0 = 07H 1.03 1.08 1.13 CN4–0 = 08H 1.05 1.10 1.15 CN4–0 = 09H 1.07 1.12 1.17 CN4–0 = 0AH 1.09 1.14 1.19 CN4–0 = 0BH 1.11 1.16 1.21 CN4–0 = 0CH 1.13 1.18 1.23 CN4–0 = 0DH 1.15 1.20 1.25 CN4–0 = 0EH 1.17 1.22 1.27 VDD = 3.0V, CN4–0 = 0FH 1.19 1.24 1.29 VL1 voltage VL1 V Tj = 25C CN4–0 = 10H 1.21 1.26 1.31 CN4–0 = 11H 1.23 1.28 1.33 CN4–0 = 12H 1.25 1.30 1.35 CN4–0 = 13H 1.27 1.32 1.37 *1 CN4–0 = 14H 1.29 1.34 1.39 *1 CN4–0 = 15H 1.31 1.36 1.41 1 *1 CN4–0 = 16H 1.33 1.38 1.43 *1 CN4–0 = 17H 1.35 1.40 1.45 *1 CN4–0 = 18H 1.37 1.42 1.47 *1 CN4–0 = 19H 1.39 1.44 1.49 *1 CN4–0 = 1AH 1.41 1.46 1.51 *1 CN4–0 = 1BH 1.43 1.48 1.53 *1 CN4–0 = 1CH 1.45 1.50 1.55 *1 CN4–0 = 1DH 1.47 1.52 1.57 *1 CN4–0 = 1EH 1.49 1.54 1.59 *1 CN4–0 = 1FH 1.51 1.56 1.61 VL1 temperature deviation VL1 VL1 voltage dependency VL1 VL2 voltage VL2 VL3 voltage VL3 VL4 voltage VL4 LCD bias voltage generation time TBIAS    mV/C VDD = 1.3 to 3.6V  5 20 mV/V VDD = 3.0V, Tj = 25C 300k load (VL4VSS) 1/3 bias VDD = 3.0V, Tj = 25C 1/4 bias 300k load 1/3 bias (VL4VSS) 1/4 bias Typ. % Typ. 10% VL12 Typ. 10% VL12 VL13 VL13 VL14 Typ. +4% Typ. +4%    VDD = 3.0V V Typ. +5% 600 ms *1: When using 1/4 bias, the VL1 voltage is set to typ. 1.32 V (same voltage as in CN4–0 = 13H). 23/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 DC CHARACTERISTICS (3/5) (VDD = 1.1 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version,unless otherwise specified) (3/5) Rating Measuring Parameter Symbol Condition Unit circuit Min. Typ. Max. LD2–0 = 0H 1.35 LD2–0 = 1H 1.4 LD2–0 = 2H 1.45 LD2–0 = 3H 1.5 LD2–0 = 4H 1.6 LD2–0 = 5H 1.7 LD2–0 = 6H 1.8 BLD LD2–0 = 7H 1.9 Typ. Typ. threshold VDD = 1.35 to 3.6V V VBLD 2% +2% LD2–0 = 8H 2.0 voltage LD2–0 = 9H 2.1 LD2–0 = 0AH 2.2 LD2–0 = 0BH 2.3 LD2–0 = 0CH 2.4 LD2–0 = 0DH 2.5 LD2–0 = 0EH 2.7 LD2–0 = 0FH 2.9 BLD threshold voltage temperature deviation Supply current 1 Supply current 2 Supply current 3 Supply current 4 Supply current 5 VBLD IDD1 IDD2 IDD3 IDD4 IDD5  0  Ta = 25C  0.15 0.50 Ta = -20 to +70C   2.50 Ta = 25C  0.5 1.3 Ta = -20 to +70C   3.5 Ta = 25C  5 7 Ta = -20 to +70C   12 Ta = 25C  70 85 Ta = -20 to +70C   100 Ta = 25C  0.8 1.0 Ta = -20 to +70C   1.2 VDD = 1.35 to 3.6V CPU: In STOP state. Low-speed/high-speed oscillation: stopped. CPU: In HALT state (LTBC, RTC: Operating*3*5). High-speed oscillation: Stopped. LCD/BIAS circuits: Stopped. CPU: In 32.768kHz operating state.*1*3 High-speed oscillation: Stopped. LCD/BIAS circuits: Operating.*2 CPU: In 500kHz CR operating state. LCD/BIAS circuits: Operating.*2*3 CPU: In 4.096MHz operating state. PLL: In oscillating state. LCD/BIAS circuits: Operating. *2*3 VDD = 1.8 to 3.6V 1 %/C A A A A mA 1 * : CPU operating rate is 100% (No HALT state). 2 * : All SEGs: off waveform, No LCD panel load, 1/3 bias, 1/3 duty, Frame frequency: Approx. 64 Hz, Bias voltage multiplying clock: 1/128 LSCLK (256Hz) 3 * : Use 32.768KHz Crystal Resonator DT-26 (Load capacitance 6pF) (KDS: DAISHINKU CORP.) 4 * : Use 4.096MHz Crystal Oscillator CHC49SFWB (Kyocera). 5 * : Significant bits of BLKCON0~BLKCON4 registers are all “1”. 24/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 DC CHARACTERISTICS (4/5) (VDD = 1.1 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version,unless otherwise specified) (4/5) Measuring Rating Parameter Symbol Condition Unit circuit Min. Typ. Max. VDD   IOH1 = 0.5mA, VDD = 1.8 to 3.6V 0.5 Output voltage 1 VDD nd VOH1   IOH1 = -0.1mA, VDD = 1.3 to 3.6V (P20–P22/2 0.3 function is VDD IOH1 = -0.03mA, VDD = 1.1 to 3.6V   selected) 0.3 (P30–P36) IOL1 = +0.5mA, VDD = 1.8 to 3.6V   0.5 (P40–P47) IOL1 = +0.1mA, V = 1.3 to 3.6V   0.5 DD (PA0–PA5) VOL1 IOL1 = +0.03mA, VDD = 1.1 to 3.6V   0.3 IOH1 = 0.5mA, VDD = 1.8 to 3.6V Output voltage 2 nd (P20–P22/2 function is Not selected) Output voltage 3 (P40–P41) Output voltage 4 (COM0–23) (SEG0–63) Output leakage (P20–P22) (P30–P35) (P40–P47) (PA0–PA5) VOH2 IOH1 = -0.03mA, VDD = 1.1 to 3.6V Input current 1 (TEST)      IOL2 = +5mA, VDD = 1.8 to 3.6V   0.5 VOL3 IOL3 = +3mA, VDD = 2.0 to 3.6V 2 (when I C mode is selected)   0.4 VOH4 IOH4 = 0.2mA, VL1=1.2V VL4 0.2   VOMH4 IOMH4 = +0.2mA, VL1=1.2V   VL3 +0.2 VOMH4S IOMH4S = 0.2mA, VL1=1.2V VL3 0.2   VOM4 IOM4 = +0.2mA, VL1=1.2V   VL2 +0.2 VOM4S IOM4S = 0.2mA, VL1=1.2V VL2 0.2   VOML4 IOML4 = +0.2mA, VL1=1.2V   VL1 +0.2 VOML4S IOML4S = 0.2mA, VL1=1.2V VL1 0.2   VOL4 IOL4 = +0.2mA, VL1=1.2V   0.2 IOOH VOH = VDD (in high-impedance state)   1 IOOL IIL1 IIH1 IIL1 Input current 2 (NMI) (P00–P03) (P04–P07)  VOL2 IIH1 Input current 1 (RESET_N) IOH1 = -0.1mA, VDD = 1.3 to 3.6V VDD 0.5 VDD 0.3 VDD 0.3 1   0 600 600 600 20 10 2 -1  300 300 300 300 300 300  1 20 -10 -2 600 600 600  VDD = 1.8 to 3.6V 2 30 200 VDD = 1.3 to 3.6V VDD = 1.1 to 3.6V VDD = 1.8 to 3.6V 0.2 0.01 200 30 30 30 200 200 2 VOL = VSS (in high-impedance state) VIH1 = VDD VDD = 1.8 to 3.6V VIL1 = VSS VDD = 1.3 to 3.6V VDD = 1.1 to 3.6V VDD = 1.8 to 3.6V VIH1 = VDD VDD = 1.3 to 3.6V VDD = 1.1 to 3.6V VIL1 = Vss IIH2 VIH2 = VDD (when pulled-down) IIL2 VIL2 = VSS V 2 A 3 A 4 25/36 FEDL610Q439-3 LAPIS Semiconductor (P10–P11) (P30–P35) (P40–P47) (PA0–PA5) ML610Q438/ML610Q439 (when pulled-up) VDD = 1.3 to 3.6V VDD = 1.1 to 3.6V 200 200 30 30 -0.2 -0.01 IIH2Z VIH2 = VDD (in high-impedance state)   1 IIL2Z VIL2 = VSS (in high-impedance state) 1   DC CHARACTERISTICS (5/5) (VDD = 1.1 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version,unless otherwise specified) (5/5) Rating Measuring Parameter Symbol Condition Unit circuit Min. Typ. Max. Input voltage 1 (RESET_N) (TEST) (NMI) (P00–P03) (P04–P07) (P10–P11) (P31–P35) (P40–P43) (P45–P47) (PA0–PA5) Hysteresis width (RESET_N) (TEST) (NMI) (P00–P03) (P04–P07) (P10–P11) (P31–P35) (P40–P43) (P45–P47) (PA0–PA5) Input voltage 2 (P30, P44) Input pin capacitance (NMI) (P00–P03) (P04–P07) (P10–P11) (P30–P35) (P40–P47) (PA0–PA5) VDD = 1.3 to 3.6V 0.7 VDD  VDD VDD = 1.1 to 3.6V 0.7 VDD  VDD VDD = 1.3 to 3.6V 0  0.3 VDD VDD = 1.1 to 3.6V 0  0.2 VDD VDD = 2.0 to 3.6V 0.05 VDD 0.18 VDD 0.4 VDD VDD = 1.1 to 3.6V 0.02 VDD 0.18 VDD 0.4 VDD VIH2  0.7 VDD  VDD VIL2  0  0.3 VDD CIN f = 10kHz Vrms = 50mV Ta = 25C   5 VIH1 VIL1 V 5 pF  VT HYSTERESIS WIDTH VT Input signal VDD VSS Internal signal VDDL VSS 26/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 MEASURING CIRCUITS MEASURING CIRCUIT 1 XT0 C4 XT1 C3 C2 C34 32.768kHz crystal CGH P10/OSC0 C12 C1 CDH CV: CL0: CL1: CX: Ca,Cb,Cc,Cd: C12,C34: CGH: CDH: P11/OSC1 4.096MHz crystal VDD AVDD VREFVDDL VDDX VL1 VL2 VL3 VL4 VSS AVSS A CV CL1 CL0 CX Ca Cb Cc Cd 1F 1F 0.1F 0.1F 1F 1F 24pF 24pF 32.768KHz Crystal Resonator ： DT-26 (Load capacitance 6pF) (KDS: DAISHINKU CORP.) 4.096MHz crystal: HC49SFWB (Kyocera) MEASURING CIRCUIT 2 (*2) VIL Input pins (*1) Output pins VIH VDD VDDL VDDX VL1 VL2 VL3 V VL4 AVDDVREF VSSAVSS (*1) Input logic circuit to determine the specified measuring conditions. (*2) Measured at the specified output pins. 27/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 MEASURING CIRCUIT 3 (*2) VIL Input pins RS1 Output pins VIH VDD VDDL VDDX VL1 VL2 VL3 A VL4 AVDDVREF VSSAVSS *1: Input logic circuit to determine the specified measuring conditions. *2: Measured at the specified output pins. MEASURING CIRCUIT 4 Input pins Output pins (*3) A VDD VDDL VDDX VL1 VL2 VL3 VL4 AVDD VREF VSSAVSS *3: Measured at the specified output pins. VIL Input pins (*1) Output pins VIH VDD VDDL VDDX VL1 VL2 VL3 Waveform monitoring MEASURING CIRCUIT 5 VL4 AVDDVREF VSSAVSS *1: Input logic circuit to determine the specified measuring conditions. 28/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 AC CHARACTERISTICS (External Interrupt) (VDD = 1.1 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. External interrupt disable period TNUL Interrupt: Enabled (MIE = 1), CPU: NOP operation System clock: 32.768kHz  76.8 106.8 s P00–P07 (Rising-edge interrupt) tNUL P00–P07 (Falling-edge interrupt) tNUL NMI, P00–P07 (Both-edge interrupt) tNUL AC CHARACTERISTICS (UART) (VDD = 1.1 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. Transmit baud rate  tTBRT  1 BRT* 1  s 1 BRT* BRT* 1 BRT* s 3% +3% *1: Baud rate period (including the error of the clock frequency selected) set with the UART baud rate register (UA0BRTL,H) and the UART mode register 0 (UA0MOD0). Receive baud rate  tRBRT tTBRT TXD0* tRBRT RXD0* *: Indicates the secondary function of the port. 29/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 AC CHARACTERISTICS (Synchronous Serial Port) (VDD = 1.1 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. When high-speed oscillation is 10   s not active SCLK input cycle tSCYC (slave mode) When high-speed oscillation is 1   s active (VDD = 1.8 to 3.6V) SCLK output cycle 1   SCLK*  s tSCYC (master mode) When high-speed oscillation is 4   s not active SCLK input pulse width tSW (slave mode) When high-speed oscillation is 0.4   s active (VDD = 1.8 to 3.6V) 1 1 1 SCLK* SCLK* SCLK* SCLK output pulse width s  tSW (master mode) 0.5 0.4 0.6 SOUT output delay time tSD    180 ns (slave mode) SOUT output delay time    80 ns tSD (master mode) SIN input setup time tSS  80   ns (slave mode) SIN input setup time  180   ns tSS (master mode) SIN input tSH  80   ns hold time *1: Clock period selected with S0CK3–0 of the serial port 0 mode register (SIO0MOD1) tSCYC tSW tSW SCLK0* tSD tSD SOUT0* tSS tSH SIN0* *: Indicates the secondary function of the port. 30/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 AC CHARACTERISTICS (I2C Bus Interface: Standard Mode 100kHz) (VDD = 1.8 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. SCL clock frequency fSCL  0  100 kHz SCL hold time  4.0   s tHD:STA (start/restart condition) SCL ”L” level time tLOW  4.7   s SCL ”H” level time  4.0   s tHIGH SCL setup time tSU:STA  4.7   s (restart condition) SDA hold time tHD:DAT  0  3.45 s SDA setup time  0.25   s tSU:DAT SDA setup time  4.0   s tSU:STO (stop condition) Bus-free time tBUF  4.7   s AC CHARACTERISTICS (I2C Bus Interface: Fast Mode 400kHz) (VDD = 1.8 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. SCL clock frequency fSCL  0  400 kHz SCL hold time tHD:STA  0.6   s (start/restart condition) SCL ”L” level time  1.3   s tLOW SCL ”H” level time tHIGH  0.6   s SCL setup time tSU:STA  0.6   s (restart condition) SDA hold time tHD:DAT  0  0.9 s SDA setup time tSU:DAT  0.1   s SDA setup time tSU:STO  0.6   s (stop condition) Bus-free time  1.3   s tBUF Start condition Restart condition Stop condition P40/SDA P41/SCL tHD:STA tLOW tHIGH tSU:STA tHD:STA tSU:DAT tHD:DAT tSU:STO tBUF 31/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 AC CHARACTERISTICS (RC Oscillation A/D Converter) (VDD = 1.3 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. RS0, RS1, Resistors for oscillation RT0, CS0, CT0, CS1  740pF 1   k RT0-1,RT1 fOSC1 Resistor for oscillation = 1k 209.4 330.6 435.1 kHz Oscillation frequency 55.27 64.16 41.29 f Resistor for oscillation = 10k kHz OSC2 VDD = 1.5V 5.97 7.06 4.71 fOSC3 Resistor for oscillation = 100k kHz 5.982 6.225 RT0, RT0-1, RT1 = 1kHz 5.567 Kf1  RS to RT oscillation frequency 1 1.01 ratio *1 RT0, RT0-1, RT1 = 10 kHz 0.99 Kf2  VDD = 1.5V 0.108 0.118 RT0, RT0-1, RT1 = 100 kHz 0.104 Kf3  fOSC1 fOSC2 fOSC3 Kf1 Kf2 Kf3 Oscillation frequency VDD = 3.0V RS to RT oscillation frequency ratio *1 VDD = 3.0V Resistor for oscillation = 1k Resistor for oscillation = 10k Resistor for oscillation = 100k RT0, RT0-1, RT1 = 1kHz RT0, RT0-1, RT1 = 10 kHz RT0, RT0-1, RT1 = 100 kHz 407.3 49.76 5.04 8.006 0.99 0.100 486.7 59.28 5.993 8.210 1 0.108 594.6 72.76 7.04 8.416 1.01 0.115 kHz kHz kHz    *1: Kfx is the ratio of the oscillation frequency by the sensor resistor to the oscillation frequency by the reference resistor on the same conditions. fOSCX(RT0-1CS0 oscillation) fOSCX(RS0CS0 oscillation) , IN0 CS0 RCT0 (*1) VIL *1: Input logic circuit to determine the specified measuring conditions. VDDL fOSCX(RT1CS1 oscillation) fOSCX(RS1CS1 oscillation) VDDX RT0, RT0-1, RT1: 1k /10k/100k RS0, RS1: 10k CS0, CT0, CS1: 560pF CVR0, CVR1: 820pF IN1 CS1 RS1 RT1 RCM VDD CV RT1 RT0 RS0 RS0 RT0 Input pins VIH , CVR1 RI0-1 CT0 CS0 CVR0 RS1 fOSCX(RT0CS0 oscillation) fOSCX(RS0CS0 oscillation) (x = 1, 2, 3) CS1 Kfx = Frequency measurement (fOSCX) VSS CL1 CL0 CX Note: - Please have the shortest layout for the common node (wiring patterns which are connected to the external capacitors, resistors and IN0/IN1 pin), including CVR0/CVR1. Especially, do not have long wire between IN0/IN1 and RS0/RS1. The coupling capacitance on the wires may occur incorrect A/D conversion. Also, please do not have signals which may be a source of noise around the node. - When RT0/RT1 (Thermistor and etc.) requires long wiring due to the restricted placement, please have VSS(GND) trace next to the signal. - Please make wiring to components (capacitor, resisteor and etc.) necessory for objective measurement. Wiring to reserved components may affect to the A/D conversion operation by noise the components itself may have. 32/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 Electrical Characteristics of Successive Approximation Type A/D Converter (VDD = 1.8 to 3.6V, AVDD = 2.2 to 3.6V, VSS = AVSS = 0V, Ta = 20 to +70C, Ta = 40 to +85C for P version, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. Resolution n    12 bit 2.7V  VREF  3.6V 4  +4 Integral non-linearity error IDL 2.2V  VREF  2.7V 6  +6 2.7V  VREF  3.6V 3  +3 Differential non-linearity error LSB DNL 2.2V  VREF  2.7V 5  +5 Zero-scale error VOFF  6  +6 Full-scale error FSE  6  +6 Reference voltage  2.2  AVDD V VREF SACK = 0  25  (HSCLK = 375kHz to 625kHz) Conversion time /CH tCONV SACK = 1  112  (HSCLK = 1.5MHz to 4.2MHz) : Period of high-speed clock (HSCLK) AVDD Reference voltage VREF VDD VDDL 10F 1F A 0.1F  1F RI5k + Analog input 0.1F VDDX AIN0, AIN1 0.1F VSS AVSS 33/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 Package Dimensions (Unit: mm) Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact our responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 34/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 Revision History Document No. FEDL610Q439-01 FEDL610Q439-02 FEDL610Q439-03 Date Aug. 24,2010 Feb. 2,2011 Jun. 7,2011 Page Previous Current Edition Edition – 34 3 – 34 3 Description Formally edition 1.0 Change of a Package Dimensions Add the P persion 35/36 FEDL610Q439-3 LAPIS Semiconductor ML610Q438/ML610Q439 NOTICE No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co., Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing LAPIS Semiconductor's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from LAPIS Semiconductor upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). LAPIS Semiconductor shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Copyright 2010 - 2011 LAPIS Semiconductor Co., Ltd. 36/36