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MR48V256ATAZBARL

MR48V256ATAZBARL

  • 厂商:

    ROHM(罗姆)

  • 封装:

    TSSOP28

  • 描述:

    IC FRAM 256KBIT PAR 28TSOP I

  • 数据手册
  • 价格&库存
MR48V256ATAZBARL 数据手册
PEDR48V256A-06 Issue Date: Oct. 17, 2011 MR48V256A 32,768-Word  8-Bit FeRAM (Ferroelectric Random Access Memory) GENERAL DESCRIPTION The MR48V256A is a nonvolatile 32,768-word x 8-bit ferroelectric random access memory (FeRAM) developed in the ferroelectric process and silicon-gate CMOS technology. Unlike SRAMs, this device, whose cells are nonvolatile, eliminates battery backup required to hold data. This device has no mechanisms of erasing and programming memory cells and blocks, such as those used for various EEPROMs. Therefore, the write cycle time can be equal to the read cycle time and the power consumption during a write can be reduced significantly. The MR48V256A can be used in various applications, because the device is guaranteed for the write/read tolerance of 1012 cycles per bit and the rewrite count can be extended significantly. FEATURES • • • • • • • • • 32,768-word  8-bit configuration A single 3.3 V  0.3 V power supply Read access time: 70 ns (Max.) Write enable time: 70 ns (Min.) Random read/write cycle time 150 ns (Min.) Read/write tolerance 1012 cycles/bit Data retention 10 years Guaranteed operating temperature range 40 to 85C (Extended temperature version) Package options: 28-pin plastic TSOPI (TSOP(1)28-08134-0.55-ZK) PRODUCT FAMILY Access Time Family MR48V256A Relative to OE Read/Write Cycle Time Package Relative to CE 70ns 40ns 150ns 28pin TSOPI 1/12 PEDR48V256A-06 MR48V256A PIN CONFIGURATION 28-pin plastic TSOPI OE# A11 A9 A8 A13 WE# VCC A14 A12 A7 A6 A5 A4 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 MR48V256A-XX 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A10 CE# DQ7 DQ6 DQ5 DQ4 DQ3 VSS DQ2 DQ1 DQ0 A0 A1 A2 Note: Signal names that end with # indicate that the pins are negative-true logic. 2/12 PEDR48V256A-06 MR48V256A PIN DESCRIPTIONS Pin Name CE# OE# WE# A14 to A0 DQ7 to DQ0 VCC, VSS Description Chip enable (input, negative logic) Latches an address by low input, activates the FeRAM, and enables a read or write operation. Output enable (input, negative logic) The FeRAM is in read mode when the FeRAM is active and this pin is low, and data is output after the specified time. Write enable (input, negative logic) The FeRAM is in write mode when the FeRAM is active and this pin is low, and data is capture at the timing of WE#="H" or CE#="H", whichever is earlier. Address (input) The FeRAM captures an address at the timing when CE#="L" is established. 3-state data bus (input/output) Outputs data in the read mode, and captures data in the write mode. Power supply Apply the specified voltage to VCC. Connect VSS to ground. TRUTH TABLE Operating Mode CE# WE# Standby Mode H X Address Latched ↓ X Read Mode L H Write Mode L ↓ 3/12 PEDR48V256A-06 MR48V256A ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Parameter Rating Symbol Min. Unit Max. Note Pin Voltage (Input Signal) VIN –0.5 VCC + 0.5 V Pin Voltage (Input/Output Voltage) VINQ, VOUTQ –0.5 VCC + 0.5 V VCC –0.5 4.6 V Tstg –55 125 °C Topr –40 85 °C Power Supply Voltage Storage Temperature (Extended Temperature Version) Operating Temperature (Extended Temperature Version) Power Dissipation PD 1,000 mW Allowable Input Current IIN ±20 mA Ta=25°C IOUT ±20 mA Ta=25°C Allowable Output Current Note: The application of stress (voltage, current, or temperature) that exceeds the absolute maximum rating may damage the device. Therefore, do not allow actual characteristics to exceed any one parameter ratings Recommended Operating Conditions Parameter Power Supply Voltage Ground Voltage Symbol VCC VSS Min. 3.0 0.0 Max. 3.3 0.0 Unit V V Note Input High Voltage VIH VCC x 0.8 VCC + 0.3 V 1 Input Low Voltage VIL –0.3 VCC x 0.15 V 2 Operating Temperature (Extended Temperature Version) Ta –40 85 °C Notes: 1. Overshoots with the pulse width of 20 ns or less and the voltage of VCC + 1.0 V or less are allowed. 2. Undershoots with the pulse width of 20 ns or less and the voltage of 1.0 V or more are allowed. Capacitance Parameter Input Capacitance Input/Output Capacitance Symbol CIN COUT Min.   Max. 6 8 Unit pF pF Note 1 1 Note: Sampling value. Measurement conditions are VIN = VOUT = GND, f = 1MHz, and Ta = 25°C 4/12 PEDR48V256A-06 MR48V256A DC Characteristics (Under recommended operating conditions) Parameter Symbol Output High Voltage VOH Output Low Voltage VOL Condition Min. Max. Unit IOH = –2 mA VCC  0.85  V Note  IOL = 2 mA  VCC  0.15 V  Input Leakage Current ILI  –10 10 µA Output Leakage Current ILO –10 10 µA Power Supply Current (Standby) ICCS  VIN = 0.2V or VCC–0.2V, CE# = VCC–0.2V IOUT = 0 mA  400 µA Power Supply Current (Operating) ICCA  10 mA Read Cycle, tRC = Min. VIN = 0.2V or VCC–0.2V, CE# = 0.2V, IOUT = 0 mA 1 Note: 1. Average current. Address change must be one time or less during time tRC. Read/Write Cycles and Data Retention (Under recommended operating conditions) Parameter Read/Write Cycle Data Retention Min. 1012 10 Max.   Unit Cycle Year Note 1 Notes: 1. This is applicable to the read cycle, write cycle, and CE-only cycle counts. This is the cycle count per bit (for one address). 5/12 PEDR48V256A-06 MR48V256A AC Characteristics (Read Cycle) (Under recommended operating conditions) Parameter -70 Symbol Unit Min. Max. Address Set-up Time tAVEL 5 ― ns Address Hold Time (CE#) tELAX 10 ― ns CE# High Pulse Width tEHEL 80 ― ns Output Hold Time (CE#) tEHQX 5 ― ns Output High Impedance Time (CE#) tEHQZ ― 25 ns CE# Active Time tELEH 70 2000 ns Read Cycle Time (CE# cycle Time) tELEL 150 ― ns CE# Access Time tELQV ― 70 ns Output Low Impedance Time (CE#) tEHQX 5 ― ns Output Hold Time (OE#) tGHQX 5 ― ns Output High Impedance Time (OE#) tGHQZ ― 25 ns OE# Access Time tGLQV ― 40 ns Output Low Impedance Time (OE#) tGLQX 5 ― ns Note 1 1 Notes: The read data is output at the point where all of the maximum values of tELQV and tGLQV are satisfied. 6/12 PEDR48V256A-06 MR48V256A AC Characteristics (Write Cycle) (Under recommended operating conditions) Note 1 Parameter -70 Symbol Unit Min. Max. Note Address Set-up Time tAVEL 5 ― ns Data Set-up Time (WE#) tDVWH 20 ― ns Data Set-up Time (CE#) tDVEH 40 ― ns Address Hold Time (CE#) tELAX 10 ― ns Data Hold Time (CE#) tEHDX 0 ― ns CE# High Pulse Width tEHEL 80 ― ns CE# Active Time tELEH 70 2000 ns Write Cycle Time (CE# Cycle Time) tELEL 150 ― ns Write Command Set-up Time (CE# to WE#) tELWH 70 ― ns Data Hold Time (WE#) tWHDX 0 ― ns Write Command Pulse Width tWLWH 40 ― ns WE# Set-up Time (CE#) tELWL 0 ― ns 1 WE# Hold Time (CE#) tWHEH 0 ― ns 1 Notes: “CE# controled WRITE”mode or “OE# controled WRITE” mode is decided by the rerationship between CE# and OE#. 7/12 PEDR48V256A-06 MR48V256A Timing Diagrams Read cycle tELEL tELEH tEHEL CE# tELAX An Address Valid tAVEL tGLQV tGHQX OE# tGLQX tGHQZ tELQX DQ Valid Data Out tEHQX tELQV tEHQZ Note: WE# = “H” Write cycle tELEL tELEH tEHEL CE# tELAX An Address Valid tAVEL WE# tELWL tWHEH OE# tDVEH DQ tEHDX Data In 8/12 PEDR48V256A-06 MR48V256A WE Control Write Cycle tELEH tEHEL CE# tELWH tELAX An Address Valid tAVEL WE# tWHEH tELWL tWLWH OE# tDVWH DQ tWHDX Data In 9/12 PEDR48V256A-06 MR48V256A CE-Only Cycle An Invalid Address In Address Valid tAVEL tELAX tELEH tEHEL CE# Note: OE# = “H”, WE# = “H”, DQ = High-Z Power-On and Power-Off Characteristics (Under recommended operating conditions) Parameter Power-On CE# High Hold Time Power-Off CE# High Hold Time Power-On Interval Time Symbol tVHEL tEHVL tVLVH Min. 50 100 1 Max.    Unit s ns s Note 1, 2 1 2 Notes: 1. To prevent an erroneous operation, be sure to maintain CE#="H", and set the FeRAM in an inactive state (standby mode) before and after power-on and power-off. 2. Powering on at the intermediate voltage level will cause an erroneous operation; thus, be sure to power up from 0 V. 3. Enter all signals at the same time as power-on or enter all signals after power-on. Power-On and Power-Off Sequences tEHVL tVHEL VCC VCC VCC Min. VCC Min. VIH Min. VIH Min. tVLVH VIL Max. CE# 0V VIL Max. CE# 0V 10/12 PEDR48V256A-06 MR48V256A REVISION HISTORY Page Document No. Date Previous Edition Current Edition PEDR48V256A-01 Mar. 30, 2010 – – Preliminary edition 1 from PJDR48V256A-05 1 1 Package code name PEDR48V256A-02 Aug. 26, 2010 1,4,5 1,4,5 PEDR48V256A-03 Dec. 02, 2010 4 4 PEDR48V256A-04 Mar. 04, 2011 1,2,4 1,2,4 PEDR48V256A-05 Sep. 05, 2011 8,9 10 8,9 10 PEDR48V256A-06 Oct. 17, 2011 1-12 1-12 Description Input Voltage 2.0/0.8 ⇒ Vcc x 0.8 / Vcc x 0.2 Input Voltage VIL Vcc x 0.2 ⇒ Vcc x 0.15 Pin name VDD ⇒ VCC temperature version ⇒ Extended version OE# wave in Timing chart Input signal state in power-on Changed corporate name and logo to LAPIS Semiconductor. 11/12 PEDR48V256A-06 MR48V256A NOTES No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co., Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing LAPIS Semiconductor's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from LAPIS Semiconductor upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). LAPIS Semiconductor shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Copyright 2011 LAPIS Semiconductor Co., Ltd. 12/12
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