Data Sheet
10V Drive Nch MOSFET
RCX330N25
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
TO-220FM
10.0
φ3.2
4.5 2.8
Features 1) Low on-resistance. 2) Fast switching speed. 3) Gate-source voltage VGSS garanteed to be ±30V . 4) High package power.
15.0
12.0
8.0
14.0
2.5
1.3
1.2
0.8 2.54
(1) (2) (3)
2.54
0.75
2.6
Application Switching
Inner circuit
∗1
Packaging specifications Package Code Basic ordering unit (pieces) RCX330N25 Type Bulk 500
(1) Gate (2) Drain (3) Source
(1) (2) (3)
1 BODY DIODE
Absolute maximum ratings (Ta 25°C) Symbol Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Avalanche Current Avalanche Energy Power dissipation (Tc=25°C) Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 L≒ 500H, VDD=50V, Rg=25 , starting Tch=25°C *3 Limited only by maximum temperature allowed.
Limits 250 30
Unit V V A A A A A mJ W C C
VDSS VGSS Continuous Pulsed Continuous Pulsed ID IDP IS ISP IAS EAS PD Tch Tstg
*3 *1 *3 *1 *2 *2
33 132 33 132 16.5 74.8 40 150 55 to 150
Thermal resistance Parameter Channel to Case Symbol Rth (ch-c) Limits 3.13 Unit C / W
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2011.09 - Rev.A
RCX330N25
Electrical characteristics (Ta = 25 C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Symbol IGSS IDSS VGS (th) * RDS (on) l Yfs l* Ciss Coss Crss td(on) * tr * td(off) * tf * Qg * Qgs * Qgd * Min. 250 3 10 Typ. 77 4500 220 130 50 200 120 140 80 25 27 Max. 100 10 5 105 Unit nA V A V Conditions VGS=±30V, VDS=0V ID=1mA, VGS=0V VDS=250V, VGS=0V VDS=10V, ID=1mA
Data Sheet
Drain-source breakdown voltage V(BR)DSS
m ID=16.5A, VGS=10V S pF pF pF ns ns ns ns nC nC nC ID=16.5A, VDS=10V VDS=25V VGS=0V f=1MHz ID=16.5A, VDD 125V VGS=10V RL=7.6 RG=10 ID=33A, VDD 125V VGS=10V
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.5
Unit V
Conditions Is=33A, VGS=0V
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2011.09 - Rev.A
RCX330N25
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics (Ⅰ) 35 Ta=25°C Pulsed
Data Sheet
Fig.2 Typical Output Characteristics (Ⅱ) 35 VGS=10.0V Ta=25°C Pulsed
30
VGS=10.0V VGS=8.0V
30
VGS=8.0V
Drain Current : ID [A]
Drain Current : ID [A]
25
25
20
20 VGS=7.0V 15
15
VGS=7.0V
10
10 VGS=6.5V VGS=6.0V VGS=5.5V 5
VGS=6.5V VGS=6.0V VGS=5.5V
5
0 0 1 2 3 4 5 Drain-Source Voltage : VDS [V]
0 0 10 20 30 40 50 Drain-Source Voltage : VDS [V]
Fig.3 Typical Transfer Characteristics 100 VDS=10V pulsed Gate Threshold Voltage : VGS(th) [V] 10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 6
Fig.4 Gate Threshold Voltage vs. Channel Temperature
VDS=10V ID=1mA pulsed 5
Drain Currnt : ID [A]
1
4
0.1
3
0.01
0.001 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 Gate-Source Voltage : VGS [V]
2 -50 0 50 100 150 Channel Temperature : Tch [℃]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current 1000 VGS=10V pulsed Static Drain-Source On-State Resistance RDS(on) [mW ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Fig.6 Static Drain-Source On-State Resistance vs. Channel Temperature 200 180 Static Drain-Source On-State Resistance RDS(on) [mW ] 160 140 120 100 ID=16.5A 80 60 40 20 ID=33A VGS=10V pulsed
100
10 0.01
0 0.1 1 Drain Current : ID [A] 10 100 -50 -25 0 25 50 75 100 125 150 Channel Temperature : Tch [℃]
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2011.09 - Rev.A
RCX330N25
Data Sheet
Fig.7 Forward Transfer Admittance vs. Drain Current 100 VDS=10V pulsed 100
Fig.8 Source Current vs. Source-Drain Voltage
VGS=0V pulsed Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Forward Transfer Admittance |Yfs | [S]
10 Source Current : Is [A] 10 100
10
1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
1
0.1
0.1
0.01 0.01
0.01 0.1 1 Drain Current : ID [A] 0.0 0.5 1.0 1.5 2.0 Source-Drain Voltage : VSD [V]
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage 0.5 Ta=25°C Pulsed Static Drain-Source On-State Resistance RDS(on) [Ω] 0.4 1000 Switching Time : t [ns] ID=16.5A 0.3 ID=33.0A 10000
Fig.10 Switching Characteristics
tf
VDD≒125V VGS=10V RG=10Ω Ta=25°C Pulsed
td(off) 100 td(on)
0.2
tr 10
0.1
0 0 2 4 6 8 10 12 14 16 18 20 Gate-Source Voltage : VGS [V]
1 0.01 0.1 1 Drain Current : ID [A] 10 100
Fig.11 Dynamic Input Characteristics 14 Ta=25°C VDD=125V ID=33A Pulsed 1000 10000
Fig.12 Typical Capacitance vs. Drain-Source Voltage
12
Ciss
Gate-Source Voltage : VGS [V]
10 Capacitance : C [pF]
8
6
Coss 100
4 Ta=25°C f=1MHz VGS=0V 10 0 10 20 30 40 50 60 70 80 90 0.01 0.1 1 10 100 1000 Total Gate Charge : Qg [nC] Drain-Source Voltage : VDS [V] Crss
2
0
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4/6
2011.09 - Rev.A
RCX330N25
Data Sheet
Fig.13 Maximum Safe Operating Area 1000 Normalized Transient Thermal Resistance : r(t) Ta=25°C Single Pulse 100 Drain Current : ID [ A ] Operation in this area is limited by RDS(on) (VGS = 10V) PW = 100μs
Fig.14 Normalized Transient Thermal Resistance v.s. Pulse Width
10
Ta=25°C Single Pulse
1
10
0.1
1 PW = 1ms 0.1 PW = 10ms
0.01
0.001
Rth(ch-a)=44.9°C/W Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.0001 0.0001 0.001 0.01 0.1 1 10 100 1000
0.01 0.01
0.1
1
10
100
1000
Drain-Source Voltage : VDS [ V ]
Pulse width : Pw (s)
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5/6
2011.09 - Rev.A
RCX330N25
Measurement circuits
Data Sheet
Pulse width
VGS ID RL D.U.T. RG VDD VDS
VGS VDS
50% 10% 10% 90% td(on) ton tr
90%
50% 10% 90%
td(off) toff
tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
VGS ID RL IG(Const.) D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
VGS
IAS L
VDS
V(BR)DSS
D.U.T. RG
IAS VDD EAS = 1 2 L IAS
2
VDD
V(BR)DSS V(BR)DSS - VDD
Fig.3-1 Avalanche Measurement Circuit
Fig.3-2 Avalanche Waveform
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6/6
2011.09 - Rev.A
Notice
Notes
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