RRL035P03FRATR

RRL035P03 FRA Pch -30V -3.5A Power MOSFET Datasheet zOutline VDSS 30V RDS(on) (Max.) 50m: ID 3.5A PD 1.0W zFeatures (6) (5) TUMT6 (4) (1) (2) (3) zInner circuit 1) Low on - resistance. (1) (2) (3) (4) (5) (6) 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (TUMT6). 4) Pb-free lead plating ; RoHS compliant Drain Drain Gate Source Drain Drain 1 ESD PROTECTION DIODE 2 BODY DIODE 5) AEC-Q101 Qualified zPackaging specifications Packaging Taping Reel size (mm) zApplication 180 Tape width (mm) DC/DC converters 8 Type Basic ordering unit (pcs) 3,000 Taping code TR Marking UF zAbsolute maximum ratings(Ta = 25°C) Parameter Symbol Value Unit Drain - Source voltage VDSS 30 V Continuous drain current ID r3.5 A r14 A VGSS r20 V PD *3 1.0 W PD *4 0.32 W Tj 150 °C Tstg 55 to 150 °C Pulsed drain current ID,pulse Gate - Source voltage Power dissipation Junction temperature Range of storage temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. *1 1/11 *2 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zThermal resistance Values Parameter Symbol Thermal resistance, junction - ambient Unit Min. Typ. Max. RthJA *3 - - 125 °C/W RthJA *4 - - 391 °C/W zElectrical characteristics(Ta = 25°C) Values Parameter Drain - Source breakdown voltage Breakdown voltage temperature coefficient Symbol V(BR)DSS Conditions VGS = 0V, ID = 1mA ΔV(BR)DSS ID= 1mA ΔTj referenced to 25°C Unit Min. Typ. Max. 30 - - V - 25 - mV/°C Zero gate voltage drain current IDSS VDS = 30V, VGS = 0V - - 1 PA Gate - Source leakage current IGSS VGS = r20V, VDS = 0V - - r10 PA Gate threshold voltage VGS (th) VDS = 10V, ID = 1mA 1.0 - 2.5 V Gate threshold voltage temperature coefficient ΔV(GS)th ΔTj ID=b 1mA referenced to 25°C - 3.9 - mV/°C VGS= 10V, ID= 3.5A - 36 50 VGS= 4.5V, ID= 1.7A - 52 72 VGS= 4.0V, ID= 1.7A - 58 81 VGS= 10V, ID= 3.5A, Tj=125°C - 52 73 f = 1MHz, open drain - 19 - : VDS= 10V, ID= 3.5A 2.3 6.5 - S Static drain - source on - state resistance Gate input resistannce Transconductance RDS(on) RG gfs *5 *5 m: *1 Limited only by maximum temperature allowed. *2 Pw d 10Ps, Duty cycle d 1% *3 Mounted on a ceramic board (30×30×0.8mm) *4 Mounted on a FR4 (15×20×0.8mm) *5 Pulsed www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zElectrical characteristics(Ta = 25°C) Values Parameter Symbol Conditions Unit Min. Typ. Max. Input capacitance Ciss VGS = 0V - 800 - Output capacitance Coss VDS = 10V - 120 - Reverse transfer capacitance Crss f = 1MHz - 110 - VDD 䏡 15V, VGS = 10V - 7 - ID = 1.7A - 9 - RL = 8.8: - 75 - RG = 10: - 40 - Turn - on delay time Rise time tr Turn - off delay time Fall time *5 td(on) *5 *5 td(off) tf *5 pF ns zGate Charge characteristics(Ta = 25°C) Values Parameter Total gate charge Symbol Conditions Unit Min. Typ. Max. VDD 䏡 15V, ID= 3.5A VGS = 5V - 8.0 - VDD 䏡 15V, ID= 3.5A VGS = 10V - 14 - - 2.5 - - 3.0 - *5 Qg Gate - Source charge Qgs *5 Gate - Drain charge Qgd *5 VDD 䏡 15V, ID= 3.5A VGS = 5V nC zBody diode electrical characteristics (Source-Drain)(Ta = 25°C) Values Parameter Inverse diode continuous, forward current Forward voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. Symbol IS *1 VSD *5 Conditions Unit Min. Typ. Max. Ta = 25°C - - 0.8 A VGS = 0V, Is = 3.5A - - 1.2 V 3/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zElectrical characteristic curves Fig.2 Maximum Safe Operating Area Fig.1 Power Dissipation Derating Curve 100 Operation in this area is limited by RDS(on) (VGS = 10V) 100 80 60 40 20 PW = 1ms 1 PW = 10ms DC Operation 0.1 0.01 0 0 50 100 150 Ta=25ºC Single Pulse Mounted on a ceramic board. (30mm 㽢 30mm 㽢 0.8mm) 0.1 200 1 10 100 Drain - Source Voltage : -VDS [V] Junction Temperature : Tj [rC] Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width Fig.4 Single Pulse Maxmum Power dissipation 1000 10 Ta=25ºC Single Pulse Ta=25ºC Single Pulse 1 top D = 1 D = 0.5 D = 0.1 D = 0.05 D = 0.01 bottom Single 0.1 0.01 0.001 0.0001 Rth(ch-a)=125ºC/W Rth(ch-a)(t)=r(t)㽢Rth(ch-a) Mounted on ceramic board (30mm 㽢 30mm 㽢 0.8mm) 0.01 1 Peak Transient Power : P(W) Normalized Transient Thermal Resistance : r(t) PW = 100Ps 10 Drain Current : -ID [A] Power Dissipation : PD/PD max. [%] 120 10 1 0.0001 100 Pulse Width : PW [s] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 100 0.01 1 100 Pulse Width : PW [s] 4/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zElectrical characteristic curves Fig.5 Typical Output Characteristics(I) Fig.6 Typical Output Characteristics(II) 10 10 VGS= 10.0V VGS= 10.0V VGS= 4.0V 6 4 VGS= 3.0V 2 VGS= 2.5V VGS= 3.5V 8 VGS= 3.5V Drain Current : -ID [A] Drain Current : -ID [A] 8 VGS= 4.5V VGS= 4.5V 6 VGS= 3.0V VGS= 4.0V 4 VGS= 2.5V 2 Ta=25ºC Pulsed Ta=25ºC Pulsed 0 0 0 0.2 0.4 0.6 0.8 0 1 4 6 8 10 Drain - Source Voltage : -VDS [V] Drain - Source Voltage : -VDS [V] Fig.8 Typical Transfer Characteristics Fig.7 Breakdown Voltage 㻌 㻌 㻌 vs. Junction Temperature 10 60 VDS= 10V Pulsed VGS = 0V ID = 1mA Pulsed 1 Drain Current : -ID [A] Drain - Source Breakdown Voltage : -V(BR)DSS [V] 2 40 20 Ta= 125ºC Ta= 75ºC Ta= 25ºC Ta= 25ºC 0.1 0.01 0.001 0 -50 0 50 100 0 150 Junction Temperature : Tj [rC] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1 3 2 Gate - Source Voltage : -VGS [V] 5/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zElectrical characteristic curves Fig.9 Gate Threshold Voltage vs. Junction Temperature Fig.10 Transconductance vs. Drain Current 10 VDS= 10V Pulsed VDS = 10V ID = 1mA Pulsed Transconductance : gfs [S] Gate Threshold Voltage : -VGS(th) [V] 3 2 1 0 -50 0 50 100 Ta= 25ºC Ta=25ºC Ta=75ºC Ta=125ºC 1 0.1 0.01 150 Junction Temperature : Tj [rC] 1 10 Drain Current : -ID [A] Fig.11 Drain CurrentDerating Curve Fig.12 Static Drain - Source On - State Resistance vs. Gate Source Voltage 200 1 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 100 125 150 Static Drain - Source On-State Resistance : RDS(on) [m:] 1.2 Drain Current Dissipation : ID/ID max. (%) 0.1 150 ID = 1.7A ID = 3.5A 100 50 0 0 5 10 15 Gate - Source Voltage : -VGS [V] Junction Temperature : Tj [ºC] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. Ta=25ºC Pulsed 6/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zElectrical characteristic curves Fig.13 Static Drain - Source On - State Resistance vs. Drain Current(I) Fig.14 Static Drain - Source On - State Resistance vs. Junction Temperature 60 Ta=25ºC Pulsed VGS= 4.0V VGS= 4.5V VGS= 10V 100 10 1 0.1 1 10 Static Drain - Source On-State Resistance : RDS(on) [m:] Static Drain - Source On-State Resistance : RDS(on) [m:] 1000 40 20 VGS = 10V ID = 3.5A Pulsed 0 -50 -25 Drain Current : -ID [A] Ta=125ºC Ta=75ºC Ta=25ºC Ta= 25ºC 100 10 1 1 10 Drain Current : -ID [A] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 50 75 100 125 150 Fig.16 Static Drain-Source On-State Resistance vs. Drain Current(III) Static Drain - Source On-State Resistance : RDS(on) [m:] Static Drain - Source On-State Resistance : RDS(on) [m:] 1000 0.1 25 Junction Temperature : Tj [ºC] Fig.15 Static Drain - Source On - State Resistance vs. Drain Current(II) VGS= 10V Pulsed 0 1000 VGS= 4.5V Pulsed Ta=125ºC Ta=75ºC Ta=25ºC Ta= 25ºC 100 10 1 0.1 10 1 Drain Current : -ID [A] 7/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zElectrical characteristic curves Fig.17 Static Drain - Source On - State Resistance vs. Drain Current(IV) Fig.18 Typical Capacitance 㻌 㻌 㻌 㻌 vs. Drain - Source Voltage 10000 VGS= 4.0V Pulsed Ta = 25ºC f = 1MHz VGS = 0V Ta=125ºC Ta=75ºC Ta=25ºC Ta= 25ºC Capacitance : C [pF] Static Drain - Source On-State Resistance : RDS(on) [m:] 1000 100 10 1 Ciss 1000 Coss 100 Crss 10 0.1 1 10 0.01 Drain Current : -ID [A] 1 10 100 Drain - Source Voltage : -VDS [V] Fig.19 Switching Characteristics Fig.20 Dynamic Input Characteristics 10 10000 Ta=25ºC VDD= 15V VGS= 10V RG=10: Pulsed tf td(off) 9 Gate - Source Voltage : -VGS [V] 1000 Switching Time : t [ns] 0.1 100 td(on) 10 tr 8 7 6 5 4 3 Ta=25ºC VDD= 15V ID= 3.5A RG=10: Pulsed 2 1 0 1 0.01 0.1 1 0 10 Drain Current : -ID [A] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 5 10 15 Total Gate Charge : Qg [nC] 8/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zElectrical characteristic curves Fig.21 Source Current 㻌 㻌 㻌 㻌 㻌 vs. Source Drain Voltage 10 Source Current : -IS [A] VGS=0V Pulsed 1 Ta=125ºC Ta=75ºC Ta=25ºC Ta= 25ºC 0.1 0.01 0 0.5 1 1.5 Source-Drain Voltage : -VSD [V] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 9/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zMeasurement circuits Fig.1-1 Switching Time Measurement Circuit Fig.1-2䚷Switching Waveforms Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 10/11 2016.06 2012.09 -- Rev.B Rev.B RRL035P03 FRA Data Sheet zDimensions (Unit : mm) 㻰 㻭 㼑 㼤 㻿 㻭 㻸㼜 㻴㻱 㻱 㻸 TUMT6 㼎 㼏 㼑㻝 㻭 㻭㻞 㼑 㻭㻝 㼘㻝 㼥 㻿 㻿 㼎㻞 Patterm of terminal position areas 㻰㻵㻹 㻭 㻭㻝 㻭㻞 㼎 㼏 㻰 㻱 㼑 㻴㻱 㻸 㻸㼜 㼤 㼥 㻰㻵㻹 㼑㻝 㼎㻞 㼘㻝 㻹㻵㻸㻵㻹㻱㼀㻱㻾㻿 㻹㻵㻺 㻹㻭㼄 㻙 㻜㻚㻤㻡 㻜㻚㻜㻜 㻜㻚㻝㻜 㻜㻚㻣㻞 㻜㻚㻤㻞 㻜㻚㻞㻡 㻜㻚㻠㻜 㻜㻚㻝㻞 㻜㻚㻞㻞 㻝㻚㻥㻜 㻞㻚㻝㻜 㻝㻚㻢㻜 㻝㻚㻤㻜 㻜㻚㻢㻡 㻞㻚㻜㻜 㻞㻚㻞㻜 㻜㻚㻞㻜 㻙 㻜㻚㻠㻜 㻙 㻜㻚㻝㻜 㻙 㻜㻚㻝㻜 㻹㻵㻸㻵㻹㻱㼀㻱㻾㻿 㻹㻵㻺 㻹㻭㼄 㻝㻚㻣㻜 㻙 㻜㻚㻡㻜 㻙 㻜㻚㻡㻜 㻵㻺㻯㻴㻱㻿 㻹㻵㻺 㻙 㻜 㻜㻚㻜㻞㻤 㻜㻚㻜㻝 㻜㻚㻜㻜㻡 㻜㻚㻜㻣㻡 㻜㻚㻜㻢㻟 㻹㻭㼄 㻜㻚㻜㻟㻟 㻜㻚㻜㻜㻠 㻜㻚㻜㻟㻞 㻜㻚㻜㻝㻢 㻜㻚㻜㻜㻥 㻜㻚㻜㻤㻟 㻜㻚㻜㻣㻝 㻜㻚㻜㻟 㻜㻚㻜㻣㻥 㻜㻚㻜㻤㻣 㻜㻚㻜㻝 㻙 㻙 㻙 㻜㻚㻜㻝㻢 㻜㻚㻜㻜㻠 㻜㻚㻜㻜㻠 㻵㻺㻯㻴㻱㻿 㻹㻵㻺 㻹㻭㼄 㻜㻚㻜㻢㻣 㻙 㻙 㻜㻚㻜㻞 㻜㻚㻜㻞 Dimension in mm/inches www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 11/11 2016.06 2012.09 -- Rev.B Rev.B Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003