UM6K1N_1

UM6K1N Transistors 2.5V Drive Nch+Nch MOS FET UM6K1N Structure Silicon N-channel MOS FET External dimensions (Unit : mm) UMT6 2.0 1.3 0.9 0.65 (5) (6) (4) Features 1) Two 2SK3018 transistors in a single UMT package. 2) The MOS FET elements are independent, eliminating mutual interference. 3) Mounting cost and area can be cut in half. 4) Low On-resistance. 5) Low voltage drive (2.5V drive) makes this device ideal for portable equipment. 0.65 0.7 1pin mark (1) (2) (3) 1.25 2.1 0.2 0.15 Each lead has same dimensions Abbreviated symbol : K1 Applications Interfacing, switching (30V, 100mA) Packaging specifications Package Type UM6K1N Code Basic ordering unit (pieces) Taping TN 3000 Inner circuit (6) (5) Gate Protection Diode 0.1Min. (4) ∗ Tr1 Tr2 (1) Gate Protection Diode ∗ (2) (3) Absolute maximum ratings (Ta=25°C) Parameter Drain-source voltage Gate-source voltage Drain current Total power dissipation Channel temperature Range of storage temperature ∗1 Pw≤10µs, Duty cycle≤1% ∗2 With each pin mounted on the recommended lands. (1) (2) (3) (4) (5) (6) Tr1 Tr1 Tr2 Tr2 Tr2 Tr1 Source Gate Drain Source Gate Drain ∗ A protection diode has been built in between the gate and the source to protect against static electricity when the product is in use. Use the protection circuit when rated voltages are exceeded. Continuous Pulsed Symbol VDSS VGSS ID IDP ∗1 PD ∗2 Tch Tstg Limits 30 ±20 ±100 ±400 150 150 −55 to +150 Unit V V mA mA mW °C °C Thermal resistance Parameter Channel to ambient ∗ With each pin mounted on the recommended lands. Symbol Rth(ch-a) ∗ Limits 833 1042 Unit °C / W / TOTAL °C / W / ELEMENT Rev.B 1/3 UM6K1N Transistors Electrical characteristics (Ta=25°C) Parameter Symbol Min. − 30 − 0.8 − − 20 − − − − − − − IGSS Gate-source leakage Drain-source breakdown voltage V(BR) DSS Zero gate voltage drain current IDSS Gate threshold voltage VGS (th) Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time RDS (on) Typ. − − − − 5 7 − 13 9 4 15 35 80 80 Max. ±1 − 1.0 1.5 8 13 − − − − − − − − Unit µA V µA V Ω Ω mS pF pF pF ns ns ns ns Conditions VGS=±20V, VDS=0V ID= 10µA, VGS=0V VDS= 30V, VGS=0V VDS= 3V, ID= 100µA ID= 10mA, VGS= 4V ID= 1mA, VGS= 2.5V ID= 10mA, VDS= 3V VDS= 5V VGS=0V f=1MHz VDD 5V ID= 10mA VGS= 5V RL=500Ω RG=10Ω Yfs Ciss Coss Crss td (on) tr td (off) tf Electrical characteristic curves GATE THRESHOLD VOLTAGE : VGS(th) (V) 0.15 4V DRAIN CURRENT : ID (A) 200m 3V DRAIN CURRENT : ID (A) 100m 50m 20m 10m 5m 2m 1m 0.5m VDS=3V Pulsed 2 VDS=3V ID=0.1mA 3.5V 1.5 0.1 2.5V 1 0.05 2V VGS=1.5V Ta=125°C 75°C 25°C −25°C 0.5 0.2m 0 0 1 2 3 4 5 0.1m 0 1 2 3 4 0 −50 −25 0 25 50 75 100 125 150 DRAIN-SOURCE VOLTAGE : VDS (V) GATE-SOURCE VOLTAGE : VGS (V) CHANNEL TEMPERATURE : Tch (°C) Fig.1 Typical Output Characteristics Fig.2 Typical Transfer Characteristics Fig.3 Gate Threshold Voltage vs. Channel Temperature 50 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) 20 10 5 Ta=125°C 75°C 25°C −25°C STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) 20 10 5 Ta=125°C 75°C 25°C −25°C STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) VGS=4V Pulsed 50 VGS=2.5V Pulsed 15 Ta=25°C Pulsed 10 2 1 0.5 0.001 0.002 2 1 0.5 0.001 0.002 5 ID=0.1A ID=0.05A 0.005 0.01 0.02 0.05 0.1 0.2 0.5 0.005 0.01 0.02 0.05 0.1 0.2 0.5 0 0 5 10 15 20 DRAIN CURRENT : ID (A) DRAIN CURRENT : ID (A) GATE-SOURCE VOLTAGE : VGS (V) Fig.4 Static Drain-Source On-State Resistance vs. Drain Current ( ) Fig.5 Static Drain-Source On-State Resistance vs. Drain Current ( ) Fig.6 Static Drain-Source On-State Resistance vs. Gate-Source Voltage Rev.B 2/3 UM6K1N Transistors 9 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) REVERCE DRAIN CURRENT : IDR (A) 8 7 6 5 4 3 2 1 0 −50 −25 0 25 50 75 ID=100mA VGS=4V Pulsed FORWARD TRANSFER ADMITTANCE : Yfs (S) 0.5 VDS=3V Pulsed 200m 100m 50m 20m 10m 5m 2m 1m 0.5m 0.2m 0.1m 0.2 0.1 0.05 0.02 0.01 0.005 0.002 100 125 150 VGS=0V Pulsed ID=50mA Ta=−25°C 25°C 75°C 125°C Ta=125°C 75°C 25°C −25°C 0.001 0.0001 0.0002 0.0005 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 0 0.5 1 1.5 CHANNEL TEMPERATURE : Tch (°C) DRAIN CURRENT : ID (A) SOURCE-DRAIN VOLTAGE : VSD (V) Fig.7 Static Drain-Source On-State Resistance vs. Channel Temperature Fig.8 Forward Transfer Admittance vs. Drain Current Fig.9 Reverse Drain Current vs. Source-Drain Voltage ( ) REVERCE DRAIN CURRENT : IDR (A) 200m 100m 50m 20m 10m 5m 2m 1m 0.5m 0.2m 0.1m VGS=4V Ta=25°C Pulsed 50 20 CAPACITANCE : C (pF) Ta=25°C f=1MHZ VGS=0V Pulsed 1000 500 SWITHING TIME : t (ns) tf td(off) Ciss 10 5 200 100 50 20 10 5 2 0.1 0.2 Ta=25°C VDD=5V VGS=5V RG=10Ω 0V Coss Crss tr td(on) 2 1 0 0.5 1 1.5 SOURCE-DRAIN VOLTAGE : VSD (V) 0.5 0.1 0.2 0.5 1 2 5 10 20 50 0.5 1 2 5 10 20 50 100 DRAIN-SOURCE VOLTAGE : VDS (V) DRAIN CURRENT : ID (mA) Fig.10 Reverse Drain Current vs. Source-Drain Voltage ( ) Fig.11 Typical Capacitance vs. Drain-Source Voltage Fig.12 Switching Characteristics Switching characteristics measurement circuit Pulse Width 50% 10% 10% 90% 50% VGS VGS ID D.U.T. RL VDS RG VDS 10% 90% 90% td(off) tf toff VDD td(on) ton tr Fig.13 Switching Time Test Circuit Fig.14 Switching Time Waveforms Rev.B 3/3 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction. Appendix1-Rev1.1