JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD
SMBG Plastic-Encapsulate Diodes
ES3A THRU ES3J
Super Fast Recovery Rectifier Diodes
Features
SMBG
● IF(AV)
3A
● VRRM
50V-600V
● High surge current capability
● Polarity: Color band denotes cathode
Applications
● Rectifier
Marking
● ES3X
X : From A To J
Limiting Values(Absolute Maximum Rating)
Item
Symbol Unit
ES3
Test Conditions
A
B
C
D
E
Repetitive Peak Reverse Voltage
VRRM
V
50
100 150 200 300
Maximum RMS Voltage
V RMS
V
35
70
Average Forward Current
IF(AV)
A
60Hz Half-sine wave,
Resistance load,Ta=100℃
3.0
Surge(Non-repetitive)Forward
Current
IFSM
A
60Hz Half-sine wave,
1 cycle,Ta=25℃
100
Operation Junction and
Storage Temperature Range
TJ,TSTG
℃
G
H
J
400 500 600
105 140 210 280 350 420
-55 ~ +150
Electrical Characteristics (T=25℃ Unless otherwise specified)
Symbol
Unit
Peak Forward Voltage
VF
V
Maximum reverse recovery
time
trr
ns
Item
Peak Reverse Current
Thermal
Resistance(Typical)
IRRM1
IRRM2
RθJ-A
RθJ-L
μA
℃/ W
Test Condition
IF =3.0A
B
C
0.95
IF=0.5A,IR=1.0A,Irr=0.25A
VRM=VRRM
A
ES3
D
E
G
1.25
H
J
1.7
35
Ta =25℃
5.0
Ta =100℃
50
Between junction and ambient
47
Between junction and terminal
12
Notes:
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.27" x 0.27" (7.0 mm x 7.0 mm) copper
pad areas
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1
Rev. - 1.1
Typical Characteristics
FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT
IFSM(A)
IO(A)
FIG.1: FORWARD CURRENT DERATING CURVE
3.5
3.0
150
125
TL=75℃
8.3ms Single Half Sine Wave
2.5
100
2.0
75
1.5
50
1.0
Resistive or Inductive Load
P.C.B. Mounted on 0.2"×0.2"
(5.0mm×5.0mm)Copper Pad Areas
0.5
0
0
25
25
75
50
100
125
0
150
1
10
100
Number of Cycles
TL(℃)
FIG.4:TYPICAL REVERSE CHARACTERISTICS
100
IR(uA)
IF(A)
FIG.3: TYPICAL FORWARD CHARACTERISTICS
TJ=25℃
Pulse width=300us
1% Duty Cycle
100
10
10
Tj=150℃
Tj=125℃
1
ES3A-D
1.0
ES3F-G
Tj=75 ℃
0.1
ES3H-J
Tj=25℃
0.1
0.01
0.4
0.01
0.001
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VF(V)
0
20
40
60
80
100
Voltage(%)
FIG.5: Diagram of circuit and Testing wave form of reverse recovery time
I
D
trr
IF
VR
RL
IF
t
0
IRR
IR
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2
Rev. - 1.1
SMBG
0.155(3.94)
0.130(3.30)
0.087 (2.20)
0.071 (1.80)
0.180(4.57)
0.160(4.06)
0.012(0.305)
0.006(0.152)
0.096(2.44)
0.084(2.13)
0.060(1.52)
0.030(0.76)
0.008(0.203)MAX.
0.220(5.59)
0.205(5.21)
Dimensions in inches and (millimeters)
SMBG
4.26
1.8
NOTICE
JSCJ reserves the right to make modifications,enhancements,improvements,corrections or other
changes without further notice to any product herein.JSCJ does not assume any liability arising
out of the application or use of any product described herein.
www.jscj-elec.com
3
Rev. - 1.1
Reel Taping Specifications For Surface Mount Devices-SMBG
FIG:CONFIGURATION OF SURFACE MOUNTED DEVICES TAPING
SMBG
75 1.0 2.95 0.039
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4
Rev. - 1.1
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