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ES3G

ES3G

  • 厂商:

    RUBYCON(红宝石)

  • 封装:

    SMBG

  • 描述:

    二极管配置:独立式;直流反向耐压(Vr):400V;平均整流电流(Io):3A;正向压降(Vf):1.25V@3A;反向电流(Ir):1uA@400V;反向恢复时间(trr):35ns;工作温度:-5...

  • 数据手册
  • 价格&库存
ES3G 数据手册
JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD SMBG Plastic-Encapsulate Diodes ES3A THRU ES3J Super Fast Recovery Rectifier Diodes Features SMBG ● IF(AV) 3A ● VRRM 50V-600V ● High surge current capability ● Polarity: Color band denotes cathode Applications ● Rectifier Marking ● ES3X X : From A To J Limiting Values(Absolute Maximum Rating) Item Symbol Unit ES3 Test Conditions A B C D E Repetitive Peak Reverse Voltage VRRM V 50 100 150 200 300 Maximum RMS Voltage V RMS V 35 70 Average Forward Current IF(AV) A 60Hz Half-sine wave, Resistance load,Ta=100℃ 3.0 Surge(Non-repetitive)Forward Current IFSM A 60Hz Half-sine wave, 1 cycle,Ta=25℃ 100 Operation Junction and Storage Temperature Range TJ,TSTG ℃ G H J 400 500 600 105 140 210 280 350 420 -55 ~ +150 Electrical Characteristics (T=25℃ Unless otherwise specified) Symbol Unit Peak Forward Voltage VF V Maximum reverse recovery time trr ns Item Peak Reverse Current Thermal Resistance(Typical) IRRM1 IRRM2 RθJ-A RθJ-L μA ℃/ W Test Condition IF =3.0A B C 0.95 IF=0.5A,IR=1.0A,Irr=0.25A VRM=VRRM A ES3 D E G 1.25 H J 1.7 35 Ta =25℃ 5.0 Ta =100℃ 50 Between junction and ambient 47 Between junction and terminal 12 Notes: Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.27" x 0.27" (7.0 mm x 7.0 mm) copper pad areas www.jscj-elec.com 1 Rev. - 1.1 Typical Characteristics FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT IFSM(A) IO(A) FIG.1: FORWARD CURRENT DERATING CURVE 3.5 3.0 150 125 TL=75℃ 8.3ms Single Half Sine Wave 2.5 100 2.0 75 1.5 50 1.0 Resistive or Inductive Load P.C.B. Mounted on 0.2"×0.2" (5.0mm×5.0mm)Copper Pad Areas 0.5 0 0 25 25 75 50 100 125 0 150 1 10 100 Number of Cycles TL(℃) FIG.4:TYPICAL REVERSE CHARACTERISTICS 100 IR(uA) IF(A) FIG.3: TYPICAL FORWARD CHARACTERISTICS TJ=25℃ Pulse width=300us 1% Duty Cycle 100 10 10 Tj=150℃ Tj=125℃ 1 ES3A-D 1.0 ES3F-G Tj=75 ℃ 0.1 ES3H-J Tj=25℃ 0.1 0.01 0.4 0.01 0.001 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VF(V) 0 20 40 60 80 100 Voltage(%) FIG.5: Diagram of circuit and Testing wave form of reverse recovery time I D trr IF VR RL IF t 0 IRR IR www.jscj-elec.com 2 Rev. - 1.1 SMBG 0.155(3.94) 0.130(3.30) 0.087 (2.20) 0.071 (1.80) 0.180(4.57) 0.160(4.06) 0.012(0.305) 0.006(0.152) 0.096(2.44) 0.084(2.13) 0.060(1.52) 0.030(0.76) 0.008(0.203)MAX. 0.220(5.59) 0.205(5.21) Dimensions in inches and (millimeters) SMBG 4.26 1.8 NOTICE JSCJ reserves the right to make modifications,enhancements,improvements,corrections or other changes without further notice to any product herein.JSCJ does not assume any liability arising out of the application or use of any product described herein. www.jscj-elec.com 3 Rev. - 1.1 Reel Taping Specifications For Surface Mount Devices-SMBG FIG:CONFIGURATION OF SURFACE MOUNTED DEVICES TAPING SMBG 75 1.0 2.95 0.039 www.jscj-elec.com 4 Rev. - 1.1

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