Ver. 201310
Multilayer Power Inductor
CIG21W Series (2012/ EIA 0805)
APPLICATION
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
FEATURES
RECOMMENDED LAND PATTERN
Low Profile (1.0mm max)
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
DIMENSION
TYPE
21
Dimension [mm]
L
W
T
D
2.0±0.2
1.25±0.2
0.9±0.1
0.5+0.2
-0.3
DESCRIPTION
Part no.
Size
Inductance
DC
Rated Current (A)
(inch/mm)
(uH)@1MHz
Resistance(Ω)
Max.
CIG21W1R0MNE
0805/2012
1.0 ±25 %
0.133 ±20 %
1.05
CIG21W1R5MNE
0805/2012
1.5 ±25 %
0.150 ±20 %
0.96
CIG21W2R2MNE
0805/2012
2.2 ±20 %
0.200 ±20 %
0.81
CIG21W3R3MNE
0805/2012
3.3 ±20 %
0.250 ±20 %
0.73
CIG21W4R7MNE
0805/2012
4.7 ±20 %
0.300 ±20 %
0.65
※Rated Current: DC current value when the self-generation of heat rises to 40℃ (Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C ( Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
CHARACTERISTIC DATA
1) Frequency characteristics (Typ.)
2) DC Bias characteristics (Typ.)
Ver. 201310
PRODUCT IDENTIFICATION
CI
(1)
(1)
(3)
(5)
(7)
(8)
G
(2)
21
(3)
W
(4)
1R0
(5)
M
(6)
N
(7)
E
(8)
Chip Inductor
(2) Power Inductor
Dimension
(4) Product Series (W:Normal Type)
Inductance (1R0:1.0uH)
(6) Tolerance (M:±20%)
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
Packaging(C:paper tape, E:embossed tape)
RECOMMENDED SOLDERING CONDITION
FLOW SOLDERING
REFLOW SOLDERING
PACKAGING
Packaging Style
Quantity(pcs/reel)
Embossed Taping
3,000
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question
regarding the data sheets, please contact our sales personnel or application engineers.
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