SI52144-A01AGM

Si52144 PCI-E XPRESS G EN 1, G EN 2 , & G EN 3 Q UAD O UTPUT C L O C K G ENERATOR Features        PCI-Express Gen 1, Gen 2, Gen 3, and Gen 4 common clock compliant Gen 3 SRNS Compliant Supports Serial ATA (SATA) at 100 MHz Low power, push-pull HCSL compatible differential outputs No termination resistors required Dedicated output enable hardware pins for each clock output Dedicated hardware pin for spread spectrum control  Four PCI-Express clocks 25 MHz crystal input or clock input  Signal integrity tuning       I2C support with readback capabilities Triangular spread spectrum profile for maximum electromagnetic interference (EMI) reduction Industrial temperature –40 to 85 °C 3.3 V power supply 24-pin QFN package Ordering Information: See page 18 Applications SDATA SCLK 23 XOUT 24 22 21 20 19 VDD_DIFF 1 1 18 OE3 1 OE1 2 17 VDD_DIFF SSON2 3 VSS 4 OE21 5 VDD_DIFF 6 16 DIFF3 25 GND 15 DIFF3 14 DIFF2 7 8 9 10 11 12 DIFF0 DIFF1 DIFF1 VDD_DIFF 13 DIFF2 DIFF0 The Si52144 is a spread-spectrum enabled PCIe clock generator that can source four PCIe clocks. The device has four hardware output enable pins for enabling the outputs, and one hardware pin to control spread spectrum on PCIe clock outputs. In addition to the hardware control pins, I2C programmability is also available to dynamically control skew, edge rate and amplitude on the true, compliment, or both differential signals on the PCIe clock outputs. This control feature enables optimal signal integrity as well as optimal EMI signature on the PCIe clock outputs. Refer to AN636 for signal integrity and configurability. Measuring PCIe clock jitter is quick and easy with the Silicon Labs PCIe Clock Jitter Tool. Download it for free at www.silabs.com/pcie-learningcenter. VDD_CORE Description XIN/CLKIN Wireless access point  Routers VSS_CORE Pin Assignments  Network attached storage  Multi-function printer OE01  Notes: 1. Internal 100 kohm pull-up. 2. Internal 100 kohm pull-down. Patents pending Functional Block Diagram DIFF0 XIN/CLKIN XOUT DIFF1 PLL (SSC) Divider DIFF2 DIFF3 SCLK SDATA OE [3:0] Control & Memory Control RAM SSON Rev. 1.4 4/16 Copyright © 2016 by Silicon Laboratories Si52144 Si52144 2 Rev. 1.4 Si52144 TABLE O F C ONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2.1. Crystal Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2.2. OE Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 2.3. OE Assertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 2.4. OE Deassertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 2.5. SSON Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3. Test and Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4.1. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.2. Data Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 5. Pin Descriptions: 24-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8. Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Rev. 1.4 3 Si52144 1. Electrical Specifications Table 1. DC Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit 3.3 V Operating Voltage VDD core 3.3 ±5% 3.135 3.3 3.465 V 3.3 V Input High Voltage VIH Control input pins 2.0 — VDD + 0.3 V 3.3 V Input Low Voltage VIL Control input pins VSS – 0.3 — 0.8 V Input High Voltage VIHI2C SDATA, SCLK 2.2 — — V Input Low Voltage VILI2C SDATA, SCLK — — 1.0 V Input High Leakage Current IIH Except internal pull-down resistors, 0 < VIN < VDD — — 5 A Input Low Leakage Current IIL Except internal pull-up resistors, 0 < VIN < VDD –5 — — A High-impedance Output Current IOZ –10 — 10 A Input Pin Capacitance CIN 1.5 — 5 pF COUT — — 6 pF LIN — — 7 nH — — 50 mA Output Pin Capacitance Pin Inductance Dynamic Supply Current 4 IDD_3.3V All outputs enabled. Differential clocks with 5” traces and 2 pF load. Rev. 1.4 Si52144 Table 2. AC Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit LACC Measured at VDD/2 differential — — 250 ppm TDC Measured at VDD/2 45 — 55 % CLKIN Rising and Falling Slew Rate TR/TF Measured between 0.2 VDD and 0.8 VDD 0.5 — 4.0 V/ns Cycle to Cycle Jitter TCCJ Measured at VDD/2 — — 250 ps Long Term Jitter TLTJ Measured at VDD/2 — — 350 ps Input High Voltage VIH XIN/CLKIN pin 2 — VDD+0.3 V Input Low Voltage VIL XIN/CLKIN pin — — 0.8 V Input High Current IIH XIN/CLKIN pin, VIN = VDD — — 35 uA Input Low Current IIL XIN/CLKIN pin, 0 < VIN