EMIF02-02OABRY

EMIF02-02OABRY IPAD™ automotive grade integrated protected low pass filter for BroadR Reach™ interface Datasheet - production data Description The EMIF02-02OABRY is a highly integrated solution designed to suppress EMI noise in BroadR Reach™ interfaces in automotive applications. This low pass filter includes a 15 kV ISO10605 protection and is housed in a 3 x 3 mm² wettable flanks QFN. Figure 1. EMIF02-02OABRY equivalent circuit ϭ ϲ Ϯ ϱ ϯ ϰ Features  Attenuation profile compliant with BroadR Reach™ requirements from -40 °C to 125 °C  Return loss (Sdd11) at 60 MHz: -20 dB  Components matching: 1% (between line 1 and 2)  Package: – Dimensions: 3.0 x 3.0 mm – Pitch: 1.1 µm – Wettable flank QFN  AEC-Q101 compliant Complies with the following standards  ISO 10605 (330 Ω / 330 pF) (pins 1 and 3): – 15 kV (air discharge) – 15 kV (contact discharge)  ISO 7637-3 (pins 1 and 3): – Pulse 3a: -150 V – Pulse 3b: +100 V  MIL-STD883J (HBM) (pins 4 and 6) – ±2 kV TM: IPAD is a trademark of STMicroelectronics. June 2016 This is information on a product in full production. DocID029487 Rev 1 1/11 www.st.com Characteristics 1 EMIF02-02OABRY Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol Parameter and test conditions Value Unit External pins (pin 1 and pin 3): IEC 61000-4-2 (330 Ω / 150 pF) air discharge contact discharge ±15 ±15 External pins (pin 1 and pin 3): ISO 10605 (330 Ω / 330 pF) air discharge contact discharge ±15 ±15 VPP Transceiver side pins: HBM (pin 4 and pin 6) ±2 kV TL Maximum lead temperature for soldering 10 s 260 °C Top Operating junction temperature range -40 to +125 °C Tstg Storage temperature range -55 to +125 °C VPP kV Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Conditions Min. VBR Internal protection diode breakdown voltage, IR = 20 mA VCL IPP = 1 A, 8/20 µs RDC Serial resistance (pins 3 to 4 or 1 to 6) Typ. 6 Scd21 Sdc21 10.5 V 12 Ω -20 -20 From 10 MHz to 60 MHz, Tj = -40 °C to 125 °C -50 Figure 2. BroadR Reach application schematic       6GG 2/11 Unit V Sdd11 Sdd22 Max. DocID029487 Rev 1 6GG ddž dB EMIF02-02OABRY Characteristics Figure 3. Sdd11 differential return loss curve -external pins  6GG G% ƒ& ƒ& ƒ& ƒ&        I+]  ( ( ( ( Figure 4. Sdd22 differential return loss curve -transceiver side pins  6GGG% ƒ&  ƒ& ƒ& ƒ&       I+]  ( ( DocID029487 Rev 1 ( ( 3/11 11 Characteristics EMIF02-02OABRY Figure 5. Sdd21 attenuation curve  6GGG% ƒ& ƒ&  ƒ& ƒ&        I+]  ( ( Figure 6. ESD response to ISO 10605C = 330 pF, R = 330 Ω (+15 kV contact) 9GLY ( Figure 7. ESD response to ISO 10605C = 330 pF, R = 330 Ω (-15 kV contact) 9GLY QVGLY 4/11 ( DocID029487 Rev 1 QVGLY EMIF02-02OABRY Characteristics Figure 8. Response to ISO 7637-3 (pulse 3a) Us = -150 V Figure 9. Response to ISO 7637-3 (pulse 3b) Us = +100 V 9GLY 9GLY P$GLY P$GLY QVGLY DocID029487 Rev 1 QVGLY 5/11 11 Package information 2 EMIF02-02OABRY Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 QFN package information Figure 10. QFN package outline ( 3,1 ,1'(;$5($ 7239,(: $ $ 6($7,1* 3/$1( 'K $ 6,'(9,(: H E '   / 'Z   'Z %277209,(:  6/11 DocID029487 Rev 1 / EMIF02-02OABRY Package information Table 3. QFN package mechanical data Dimensions Ref. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 0.80 0.85 0.90 0.0315 0.0335 0.0354 A1 0.00 0.02 0.05 0.00 0.0008 0.0020 A3 0.203 0.0080 b 0.45 0.50 0.55 0.0178 0.0197 0.0217 D 2.95 3.00 3.05 0.1161 0.1181 0.1201 E 2.95 3.00 3.05 0.1161 0.1181 0.1201 e 1.105 0.0436 L 0.85 0.90 0.95 0.0335 0.0354 0.0374 D2 0.60 0.70 0.80 0.0236 0.0276 0.0315 L1 0.07 0.15 0.23 0.0028 0.0060 0.0091 Dw1 0.30 0.35 0.40 0.0118 0.0138 0.0157 (2) 0.10 0.0217 0.0236 Dh (2) 0.50 Dw2 0.0039 0.55 0.60 0.0197 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Solder filled dimples Figure 11. Footprint recommendations (in mm) Figure 12. Marking   ϭ   Ϯ ϯ ^d ϮϮ  Z z ϳ  z t t ϲ ϱ ϰ  DocID029487 Rev 1 7/11 11 Package information EMIF02-02OABRY Figure 13. Tape and reel outline I I     I I           ^d ϮϮ  Z z ϳ  zt t     6HFWLRQ$ $ 8/11  8VHUGLUHFWLRQRIXQUHHOLQJ DocID029487 Rev 1 EMIF02-02OABRY Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting ƒ& 7HPSHUDWXUHƒ&   ƒ&V ƒ&V  VHF  PD[   ƒ&V   ƒ&V  ƒ&V  7LPHV  Note:           Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-ST-020. 3.2 Stencil opening design Figure 15. Recommended stencil window position in mm (inches)          6WHQFLOZLQGRZRSHQLQJ /HDGIRRWSULQWRQ3&% DocID029487 Rev 1 9/11 11 Ordering information 4 EMIF02-02OABRY Ordering information Figure 16. 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