ESDA37WY

ESDA37WY Datasheet Automotive dual Transil™ array for ESD protection Features 3 2 1 SOT323-3L 1 3 2 • • • AEC-Q101 qualified Dual unidirectional Transil functions Low leakage current (IR max. < 1 µA at VRM) • • • • • 300 W peak pulse power (8/20 µs) High ESD protection level: up to 25 kV High integration Suitable for high density boards Complies with the following standards/ – ISO 10605: C = 330 pF, R = 330 Ω: 30 kV (air discharge), 30 kV (contact discharge) – ISO 7637-3 fast transient: Pulse a: VS = -150 V, Pulse b: VS = +100 V – ISO 7637-3 slow transient: Positive pulse: VS = +85 V, Negative pulse: VS = -85 V Applications Product status Where transient overvoltage protection in ESD sensitive equipment is required, such as: • Entertainment • Signal communications • Connectivity • Comfort and convenience ESDA37WY Description This device is a diode array designed to protect 1 line or 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required It can also be used as bidirectional suppressor by connecting only pin 1 and 2. DS12297 - Rev 2 - April 2018 For further information contact your local STMicroelectronics sales office. www.st.com ESDA37WY ESDA37WY_Characteristics 1 ESDA37WY_Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Vpp Parameter Value ISO 10605 (C = 330 pF, R = 330 Ω): Peak pulse voltage(1) Unit kV 30 Contact discharge 30 Air discharge 30 ISO 10605 (C = 150 pF, R = 330 Ω): 30 Contact discharge Air discharge Ppp Peak pulse power (8/20 μs) 300 W Ipp Peak pulse current (8/20 μs) 6.3 A Tj Maximum operating junction temperature range -55 to 175 °C Storage junction temperature range -65 to 175 °C 260 °C Tstg TL Maximum temperature for soldering during 10 s 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 1. Electrical characteristics (definitions) Symbol VBR VCL VRM IRM IF IPP IR VF C Rd αT I Parameter Breakdown voltage Clamping voltage Stand-off voltage Leakage current Forward current Peak pulse current Breakdown current Forward voltage drop Capacitance Dynamic impedance Voltage temperature = = = = = = = = = = = IF VBR Vcl VF VRM IRM V Slope = 1/Rd IPP Table 2. Electrical characteristics (Tamb = 25 °C) VBR at IR Order code ESDA37WY IRM at VRM Rd (1) αT(2) Cline Max. Typ. Max. Typ. at 0 V bias Max. pF V mA 48 0.9 10 Min. Max. V V mA µA V mΩ 10-4/°C 37 43.3 1 1 36 2400 11 VF at IF 1. Square pulse Ipp = 15 A, tp = 2.5 µs 2. Δ VBR = αT x (Tamb -25 °C) x VBR (25 °C) DS12297 - Rev 2 page 2/12 ESDA37WY Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Peak pulse power dissipation versus initial junction temperature Figure 3. Peak pulse power versus exponential pulse duration (maximum values) PPP(W) PPP(W) 350 Tj initial = 25 °C maximum value 300 1000 250 200 150 100 100 Tj(°C) 50 0 25 50 75 100 125 150 175 Figure 4. Variation of clamping voltage versus peak pulse current (maximum values) 100 tp(µs) 10 10 100 1000 Figure 5. Variation of leakage current at VR = VRM versus junction temperature IPP(A) 1000 Ir(nA) Tj initial = 25 °C 8/20µs 100 10 10 1 1 ESDA37LY (VR = VRM = 36 V) VCL(V) 0.1 20 DS12297 - Rev 2 Tj(°C) 0.1 25 30 35 40 45 50 55 60 25 50 75 100 125 150 175 page 3/12 ESDA37WY Characteristics (curves) Figure 6. ISO 7637-3 fast transient pulse a response (VS = -150 V) 10 V/div 0.5 V/div 1A/div 50 ns/div Figure 8. ISO 7637-3 slow transient positive pulse (VS = +85 V) 10 V/div 2 A/div DS12297 - Rev 2 Figure 7. ISO 7637-3 fast transient pulse b response (VS = +100 V) 500 mA/div 50 ns/div Figure 9. ISO 7637-3 slow transient negative pulse (VS = -85 V) 5 V/div 5 µs/div 5 A/div 2 µs/div page 4/12 ESDA37WY Application and design guidelines 2 Application and design guidelines Refer to STMicroelectronics application note: • AN2689: Protection of automotive electronics from electrical hazards, guidelines for design and component selection. DS12297 - Rev 2 page 5/12 ESDA37WY Package information 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 3.1 [Package name] package information • • Epoxy meets UL 94,V0 Lead-free package Figure 10. SOT-323 3L package outline c θ L H A E e D b A1 DS12297 - Rev 2 page 6/12 ESDA37WY SOT-323 3L package information Table 3. SOT323-3L package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.000 0.003 b 0.25 0.4 0.0098 0.0157 c 0.1 0.26 0.003 0.0102 D 1.8 2.0 2.2 0.070 0.078 0.086 E 1.15 1.25 1.35 0.0452 0.0492 0.0531 e 0.60 0.65 0.70 0.024 0.026 0.028 H 1.8 2.1 2.4 0.070 0.082 0.094 L 0.1 0.2 0.30 0.004 0.008 0.012 0 30° 0 ϴ 30° Figure 11. SOT323-3L recommended footprint 0.95 (0.037) 1.0 (0.039) 0.8 (0.031) DS12297 - Rev 2 2.9 (0.114) 0.50 (0.019) page 7/12 ESDA37WY Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Solder paste 1. 2. 3. 4. 4.2 Placement 1. 2. 3. 4. 5. 6. 4.3 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. DS12297 - Rev 2 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-45 µm. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. page 8/12 ESDA37WY Reflow profile 4.4 Reflow profile Figure 12. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12297 - Rev 2 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. page 9/12 ESDA37WY ESDA37WY_Ordering information 5 ESDA37WY_Ordering information Figure 13. Ordering information scheme ESDA XX WY ESD Array Minimum breakdown voltage Package W = SOT323-3L Y = Automotive grade Table 4. Ordering information Order code Marking(1) Package Weight Base qty. Delivery mode ESDA37WY E3Y SOT323-3L 6.6 mg 3000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location. DS12297 - Rev 2 page 10/12 ESDA37WY Revision history Table 5. Document revision history DS12297 - Rev 2 Date Revision Changes 18-Dec-2017 1 First issue. 09-Apr-2018 2 Updated Figure 2. Peak pulse power dissipation versus initial junction temperature. page 11/12 ESDA37WY IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 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