ESDA6V1SC5

ESDAxxSCx Quad Transil™ array for ESD protection Datasheet - production data Description The ESDAxxSC5 and ESDAxxSC6 are monolithic voltage suppressors designed to protect components which are connected to data and transmission lines against ESD. SOT23-5L (SC-59) ESDAxxSC5 SOT23-6L (SC-59) ESDAxxSC6 They clamp the voltage just above the logic level supply for positive transients, and to a diode drop below ground for negative transient. Figure 1. ESDAxxSC5 functional diagram Features • 4 unidirectional ESD protection 1 • 400 W peak pulse power (8/20 µs) 2 • Benefits – High ESD protection level: up to 30 kV – High integration – Suitable for high density boards 5 3 4 Figure 2. ESDAxxSC6 functional diagram • Complies with the following standards – IEC 61000-4-2 level exceed level 4: – 30 kV (air discharge) – 30 kV (contact discharge) • MIL STD 883E- Method 3015-7: class3B – human body model 1 6 2 5 3 4 Table 1. Device summary Applications Order code VBR min. Package Where transient overvoltage protection in ESD sensitive equipment is required, such as: ESDA5V3SC5 5.3 V SOT23-5L • Computers ESDA5V3SC6 5.3 V SOT23-6L • Printers ESDA6V1SC5 6.1 V SOT23-5L • Communication systems ESDA6V1SC6 6.1 V SOT23-6L • Cellular phone handsets and accessories ESDA14V2SC5 14.2 V SOT23-5L • Other telephone set ESDA14V2SC6 14.2 V SOT23-6L ESDA19SC6 19 V SOT23-6L ESDA25SC6 25 V SOT23-6L • Set top boxes TM: Transil is a trademark of STMicroelectronics. August 2015 This is information on a product in full production. DocID7056 Rev 10 1/9 www.st.com Characteristics 1 ESDAxxSCx Characteristics Table 2. Absolute ratings (Tamb = 25 °C) Symbol VPP PPP Parameter ESD discharge Peak pulse power (8/20µs) Value Unit MIL STD 883E - Method 3015-7 IEC61000-4-2 air discharge IEC61000-4-2 contact discharge 30 kV ESDA5V3SCx ESDA6V1SCx 300 W ESDA14V2SCx ESDA19SC6 ESDA25SC6 400 W ESDA5V3SCx ESDA6V1SCx ESDA14V2SCx ESDA19SC6 ESDA25SC6 22 18 14 13 9 A -55 to +150 °C 260 °C -55 to +150 °C IPP Peak pulse current Tstg Storage temperature range TL Maximum lead temperature for soldering during 10 s Top Operating junction temperature range Table 3. Electrical characteristics - definitions (Tamb = 25 °C) Symbol Parameter I 2/9 VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current @ VRM IPP Peak pulse current αT Voltage temperature coefficient C Capacitance Rd Dynamic resistance VF Forward voltage drop IF VBR VF V RM VCL I RM Rd DocID7056 Rev 10 I PP V ESDAxxSCx Characteristics Table 4. Electrical characteristics - values (Tamb = 25 °C) VBR @ IR Order codes IRM @ VRM αT VCL @ IPP max. C typ. max.(1) max. VF@ IF min. max. V V mA µA V V A 10-4/°C pF V mA ESDA5V3SC5 ESDA5V3SC6 5.3 5.9 1 2 3 21 22 5 320 1.25 200 ESDA6V1SC5 ESDA6V1SC6 6.1 7.2 1 2 5.25 19 18 6 190 1.25 200 ESDA14V2SC5 ESDA14V2SC6 14.2 15.8 1 5 12 35 14 10 100 1.25 200 ESDA19SC6 19 21 1 0.1 15 39 13 8.5 80 1.2 10 ESDA25SC6 25 30 1 1 24 51 9 10 60 1.2 10 0 V bias max. 1. VBR @ TJ = VBR @ 25 °C x (1 + αT x (TJ – 25)) Figure 3. Peak power dissipation versus initial Figure 4. Peak pulse power versus exponential junction temperature pulse duration (Tj initial = 25 °C) PPP[Tj initial] / PPP[Tj initial=25°C] PPP (W) 10000 1.1 ESDA5V3 - ESDA6V1 1.0 ESDA14V2 - ESDA19 - ESDA25 0.9 0.8 0.7 0.6 1000 0.5 0.4 0.3 0.2 0.1 Tj initial (°C) 100 0.0 0 25 50 75 100 125 150 Figure 5. Clamping voltage versus peak pulse current (Tj initial = 25 °C). Rectangular waveform tp = 2.5 µs tp (µs) 1 10 100 Figure 6. Capacitance versus reverse applied voltage I P P (A ) C (pF ) 50.0 500 F =1MHz V OS C =30mV R MS E S DA25S C 6 E S DA19S C 6 10.0 E S DA5V3S C 5/S C 6 E S DA14V 2S C 5/S C 6 100 E S DA6V1S C 5/S C 6 E S DA6V 1S C 5/S C 6 1.0 E S DA5V 3S C 5/S C 6 E S DA14V2S C 5/S C 6 E S DA19S C 6 tp=2.5µs V C L (V ) 0.1 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 E S DA25S C 6 V R (V) 10 1 DocID7056 Rev 10 2 5 10 20 50 3/9 9 Characteristics ESDAxxSCx Figure 7. Relative variation of leakage current versus junction temperature 10 Figure 8. Peak forward voltage drop versus peak forward current IR (µA) 5.00 I F M(A ) E S DA5V 3S C 5/S C 6 E S DA14V 2S C 5/S C 6 & E S DA6V 1S C 5/S C 6 1 E S DA19S C 6 1.00 E S DA25S C 6 0.1 0.10 ESDA5V3 - ESDA6V1 ESDA14V2 - ESDA19 - ESDA25 0.01 T j = 25°C Tj(°C) 0.001 4/9 -50 -25 0 25 50 75 100 125 150 V F M(V ) 0.01 0.5 DocID7056 Rev 10 1.0 1.5 2.0 2.5 3.0 3.5 4.0 ESDAxxSCx 2 Ordering information Ordering information Figure 9. Ordering information scheme ESDA xx SCx ESD Arra y Breakdo wn Voltage (min) 5V3 = 5.3 Volt 6V1 = 6.1 Volt 14V2 = 14.2 Volt 19 = 19 Volt 25 = 25 Volt Pack age SC5 = SOT23-5L SC6 = SOT23-6L DocID7056 Rev 10 5/9 9 Package information 3 ESDAxxSCx Package information • Epoxy meets UL94, V0 standard In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are Lead-free. The category of second level Interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 5. SOT23-5L dimensions Dimensions Ref. Millimeters Inches A Min. Typ. Max. E e B D e A2 Typ. Max. A 0.90 A1 0 A2 0.90 1.30 0.035 0.051 b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008 D 2.80 3.05 0.118 E 1.50 1.75 0.059 e c Min. 1.45 0.035 0.057 0.10 0.004 0 0.11 0.95 0.069 0.037 A1 θ L H 2.60 3.00 0.102 0.118 L 0.10 0.60 0.004 0.024 M 0° H 10° Figure 10. SOT23-5L footprint (dimensions in mm) 0.60 1.20 0.95 3.50 6/9 2.30 DocID7056 Rev 10 1.10 0° 10° ESDAxxSCx Package information Table 6. SOT23-6L dimensions Dimensions Ref. Millimeters Inches A Min. Typ. Max. E e b D e A2 Typ. Max. A 0.90 A1 0 A2 0.90 1.30 0.035 0.051 b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008 D 2.80 3.05 0.118 E 1.50 1.75 0.059 e c Min. 1.45 0.035 0.057 0.10 0.004 0 0.11 0.95 0.069 0.037 A1 θ L H 2.60 3.00 0.102 0.118 L 0.10 0.60 0.004 0.024 θ 0° H 10° 0° 10° Figure 11. SOT23-6L footprint (dimensions in mm) 0.60 1.20 0.95 3.50 2.30 DocID7056 Rev 10 1.10 7/9 9 Ordering information 4 ESDAxxSCx Ordering information Table 7. Ordering information Order codes 5 Marking ESDA5V3SC5 EC53 ESDA6V1SC5 EC61 ESDA14V2SC5 EC15 ESDA5V3SC6 ES53 ESDA6V1SC6 ES61 ESDA14V2SC6 ES15 ESDA19SC6 ES19 ESDA25SC6 ES25 Package Weight Base qty Delivery mode 16.7 mg 3000 Tape and reel SOT23-5L SOT23-6L Revision history Table 8. Document revision history Date Revision Nov-2003 7F 4-Nov-2004 8 SOT23-6L package dimensions change for reference “D” from 3.0 millimeters (0.118 inches) to 3.05 millimeters (0.120 inches). 9 Reformatted to current standard. Units for IRM MAX inTable 4 corrected to µA. Ordering information scheme expanded to cover all devices. Package information for SOT23-5L updated. 10 Updated features on cover page. Updated Table 2, Table 4, Figure 4, Figure 5, Figure 6, Figure 7, Figure 8, Figure 9 and Table 7. Removed section “Application information” and “Technical information”. 22-Nov-2007 17-Aug-2015 8/9 Description of changes Previous issue. DocID7056 Rev 10 ESDAxxSCx IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID7056 Rev 10 9/9 9