FERD20U60DJF-TR

FERD20U60 Field effect rectifier Datasheet − production data Description A This single rectifier is based on a proprietary technology, enabling to achieve the best in class VF/IR trade-off for a given silicon surface. A K A Packaged in PowerFLAT™ 5x6, this device is intended to be used in rectification and freewheeling operations in switch-mode power supplies. A K K Table 1. Device summary A A PowerFLAT 5x6 FERD20U60DJF Symbol Value IF(AV) 20 A VRRM 60 V Tj (max) +150 °C VF(typ) 350 mV Features • ST proprietary process • Stable leakage current over reverse voltage • Low forward voltage drop • High frequency operation TM: PowerFLAT is a trademark of STMicroelectronics June 2014 This is information on a product in full production. DocID025986 Rev 2 1/8 www.st.com Characteristics 1 FERD20U60 Characteristics Table 2. Absolute ratings (limiting values, at 25 °C, unless otherwise specified anode terminals short-circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 45 A IF(AV) Average forward current, δ = 0.5 Tc = 115 °C 20 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A Tstg Storage temperature range -65 to + 175 °C T (1) Maximum operating junction temperature 150 °C j 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj 1. Table 3. Thermal resistance Symbol Rth(j-c) Parameter Value (max) Unit 2.6 °C/W Junction to case Table 4. Static electrical characteristics (anode terminals short-circuited) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 10 A Max. Unit 800 µA 30 70 mA 0.380 0.425 0.350 0.400 0.465 0.510 0.465 0.505 V IF = 20 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.295 x IF(AV) + 0.0105 IF2(RMS) 2/8 Typ. DocID025986 Rev 2 FERD20U60 Characteristics Figure 1. Average forward power dissipation versus average forward current PF(AV)(W) 16 14 Figure 2. Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) 35 d = 0.05 d = 0.2 d = 0.1 d = 0.5 R th(j-a) = R th(j- c) 30 d=1 12 25 10 20 8 15 6 T T 10 4 2 5 IF(AV)(A) 0 0 2 4 6 8 10 12 d=tp/T 14 16 18 20 tp 22 24 26 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 1.0 d=tp/T Tamb(°C) tp 0 Zth(j-c)/Rth(j-c) 0 25 50 75 100 125 150 Figure 4. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) 1.E+02 0.9 Tj = 125 °C 0.8 1.E+01 0.7 Tj = 100 °C Tj = 75 °C 0.6 0.5 1.E+00 Tj = 50 °C 0.4 0.3 0.2 Single pulse 0.1 t p (s) 0.0 1.E-04 1.E-03 Tj = 25 °C 1.E-01 1.E-02 1.E-01 V R (V) 1.E-02 0 1.E+00 Figure 5. Junction capacitance versus reverse voltage applied (typical values) C(pF) 10 15 20 25 30 35 40 45 50 55 60 Figure 6. Forward voltage drop versus forward current (typical values) 100.0 10000 5 IF ( A ) F = 1 MHz Vosc = 30 mVRMS Tj = 25 °C 10.0 Tj = 75 °C 1000 Tj = 125 °C 1.0 Tj = 25 °C VR (V) 1 10 V F (V) 0.1 100 100 0.00 DocID025986 Rev 2 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 3/8 8 Characteristics FERD20U60 Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values) R th( j - a)(°C/W) 150 Epoxy printed board Fr4, copper thickness = 35 µm 125 100 75 50 25 SCu (cm²) 0 0 4/8 1 2 3 4 5 DocID025986 Rev 2 6 7 8 9 10 FERD20U60 2 Package information Package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. PowerFLAT-8L dimensions (definitions) D2 E2 K b e L A A1 D A2 E Table 5. PowerFLAT-8L dimensions (values) Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.02 0.05 0.001 0.002 A2 b 0.25 0.30 D D2 0.010 0.50 0.012 5.20 4.11 0.020 0.205 4.31 0.162 0.170 e 1.27 0.050 E 6.15 0.242 E2 3.50 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.275 1.575 0.050 0.062 DocID025986 Rev 2 5/8 8 Package information FERD20U60 Figure 9. Footprint (dimensions in mm) 3.86 4.33 6.29 5.35 4.41 0.98 0.95 0.62 1.27 6/8 DocID025986 Rev 2 FERD20U60 3 Ordering information Ordering information Table 6. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode FERD20U60DJF-TR FD20U60 PowerFLAT 5x6 95 mg 3000 Tape and reel Revision history Table 7. Document revision history Date Revision Changes 25-Mar-2014 1 Initial release. 06-Jun-2014 2 Updated device name. DocID025986 Rev 2 7/8 8 FERD20U60 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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