STB36N60M6
N-channel 600 V, 85 mΩ typ., 30 A MDmesh™ M6
Power MOSFET in a D²PAK package
Datasheet - production data
Features
x
x
x
x
x
D2PAK
Order code
VDS
RDS(on) max.
ID
STB36N60M6
600 V
99 mΩ
30 A
Reduced switching losses
Lower RDS(on) x area vs previous generation
Low gate input resistance
100% avalanche tested
Zener-protected
Applications
x
Figure 1: Internal schematic diagram
Description
The new MDmesh™ M6 technology incorporates
the most recent advancements to the well-known
and consolidated MDmesh family of SJ
MOSFETs. STMicroelectronics builds on the
previous generation of MDmesh devices through
its new M6 technology, which combines excellent
RDS(on) * area improvement with one of the most
effective switching behaviors available, as well as
a user-friendly experience for maximum endapplication efficiency.
D ( 2 TAB )
G(1)
S(3)
Switching applications
AM15572V1
Table 1: Device summary
Order code
Marking
Package
Packing
STB36N60M6
36N60M6
D²PAK
Tape and reel
March 2017
DocID027339 Rev 4
This is information on a product in full production.
1/20
www.st.com
Contents
STB36N60M6
Contents
1
Electrical ratings ............................................................................. 3
2
Electrical characteristics ................................................................ 4
2.1
Electrical characteristics (curves) ...................................................... 6
3
Test circuits ..................................................................................... 8
4
Package information ....................................................................... 9
5
2/20
4.1
D2PAK type A package information .................................................. 9
4.2
D²PAK (TO-263) type B package information ................................. 12
4.3
D2PAK type A packing information ................................................. 15
4.4
D²PAK type B packing information .................................................. 17
Revision history ............................................................................ 19
DocID027339 Rev 4
STB36N60M6
1
Electrical ratings
Electrical ratings
Table 2: Absolute maximum ratings
Symbol
Parameter
VGS
Gate-source voltage
Value
Unit
± 25
V
ID
Drain current (continuous) at TC = 25 °C
30
A
ID
Drain current (continuous) at TC = 100 °C
19
A
ID(1)
Drain current (pulsed)
102
A
PTOT
W
Total dissipation at TC = 25 °C
208
dv/dt(2)
Peak diode recovery voltage slope
15
dv/dt(3)
MOSFET dv/dt ruggedness
50
TJ
Operating junction temperature range
Tstg
Storage temperature range
V/ns
-55 to 150
°C
Notes:
(1)
Pulse width limited by safe operating area.
(2)I
SD
(3)V
≤ 30 A, di/dt = 400 A/μs; VDS peak < V(BR)DSS, VDD = 400 V
DS
≤ 480 V
Table 3: Thermal data
Symbol
Parameter
Value
Rthj-case
Thermal resistance junction-case
0.6
Rthj-pcb
Thermal resistance junction-pcb(1)
30
Unit
°C/W
Notes:
(1)When
mounted on 1 inch² FR-4, 2 Oz copper board.
Table 4: Avalanche characteristics
Symbol
Parameter
IAR
Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax.)
EAS
Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V)
DocID027339 Rev 4
Value
Unit
5
A
750
mJ
3/20
Electrical characteristics
2
STB36N60M6
Electrical characteristics
TC = 25 °C unless otherwise specified
Table 5: On/off-state
Symbol
V(BR)DSS
Parameter
Test conditions
Drain-source breakdown
voltage
VGS= 0 V, ID = 1 mA
Min.
Typ.
Max.
600
Unit
V
VGS = 0 V, VDS = 600 V
1
μA
VGS = 0 V, VDS = 600 V;
TC = 125 °C (1)
100
μA
IDSS
Zero gate voltage drain
current
IGSS
Gate body leakage current
VDS = 0 V, VGS = ±25 V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 μA
RDS(on)
Static drain-source onresistance
VGS = 10 V, ID = 15 A
3.25
±5
μA
4
4.75
V
85
99
mΩ
Notes:
(1)Defined
by design, not subject to production test.
Table 6: Dynamic
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
-
1960
-
pF
-
93
-
pF
-
6
-
pF
332
-
pF
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Coss eq.(1)
Equivalent output
capacitance
VDS = 0 to 480 V, VGS = 0 V
-
RG
Intrinsic gate resistance
f = 1 MHz open drain
-
1.6
-
Ω
Qg
Total gate charge
-
44.3
-
nC
Qgs
Gate-source charge
-
10.1
-
nC
Qgd
Gate-drain charge
VDD = 480 V, ID = 30 A,
VGS = 0 to 10 V,
(See Figure 15: "Test
circuit for gate charge
behavior")
-
25
-
nC
VDS = 100 V, f = 1 MHz,
VGS = 0 V
Notes:
(1)C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C oss when VDS
increases from 0 to 80% VDSS.
Table 7: Switching times
Symbol
td(on)
tr
td(off)
tf
4/20
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
VDD = 300 V, ID = 15 A,
RG = 4.7 Ω, VGS = 10 V
(See Figure 14: "Test circuit
for resistive load switching
times" and Figure 19:
"Switching time waveform")
DocID027339 Rev 4
Min.
Typ.
Max.
Unit
-
15.2
-
ns
-
5.3
-
ns
-
50.2
-
ns
-
7.3
-
ns
STB36N60M6
Electrical characteristics
Table 8: Source-drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain current
-
30
A
ISDM(1)
Source-drain current
(pulsed)
-
102
A
VSD(2)
Forward on voltage
ISD = 30 A, VGS = 0 V
-
1.6
V
ISD = 30 A, di/dt = 100 A/μs,
VDD = 60 V, (see Figure 16:
"Test circuit for inductive load
switching and diode recovery
times")
-
340
ns
-
5.3
μC
-
31
A
ISD = 30 A, di/dt = 100 A/μs,
VDD = 60 V, Tj = 150 °C
(see Figure 16: "Test circuit
for inductive load switching
and diode recovery times")
-
430
ns
-
7.7
μC
-
36
A
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
Notes:
(1)Pulse
width limited by safe operating area.
(2)Pulsed:
pulse duration = 300 μs, duty cycle 1.5%.
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Electrical characteristics
2.1
STB36N60M6
Electrical characteristics (curves)
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Normalized VBR(DSS)vs temperature
Figure 7: Static drain-source on-resistance
6/20
DocID027339 Rev 4
STB36N60M6
Electrical characteristics
Figure 8: Gate charge vs gate-source voltage
Figure 9: Capacitance variations
Figure 10: Normalized gate threshold voltage vs
temperature
Figure 11: Normalized on-resistance vs temperature
Figure 12: Source-drain diode forward
characteristics
Figure 13: Output capacitance stored energy
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7/20
Test circuits
3
STB36N60M6
Test circuits
Figure 15: Test circuit for gate charge
behavior
Figure 14: Test circuit for resistive load
switching times
Figure 16: Test circuit for inductive load
switching and diode recovery times
Figure 17: Unclamped inductive load test
circuit
Figure 18: Unclamped inductive waveform
8/20
DocID027339 Rev 4
Figure 19: Switching time waveform
STB36N60M6
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.1
D2PAK type A package information
Figure 20: D²PAK (TO-263) type A package outline
DocID027339 Rev 4
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Package information
STB36N60M6
Table 9: D²PAK (TO-263) type A package mechanical data
mm
Dim.
Min.
Max.
A
4.40
4.60
A1
0.03
0.23
b
0.70
0.93
b2
1.14
1.70
c
0.45
0.60
c2
1.23
1.36
D
8.95
9.35
D1
7.50
7.75
8.00
D2
1.10
1.30
1.50
E
10.00
E1
8.50
8.70
8.90
E2
6.85
7.05
7.25
e
10.40
2.54
e1
4.88
5.28
H
15.00
15.85
J1
2.49
2.69
L
2.29
2.79
L1
1.27
1.40
L2
1.30
R
V2
10/20
Typ.
1.75
0.40
0°
DocID027339 Rev 4
8°
STB36N60M6
Package information
Figure 21: D²PAK (TO-263) type A recommended footprint (dimensions are in mm)
DocID027339 Rev 4
11/20
Package information
4.2
STB36N60M6
D²PAK (TO-263) type B package information
Figure 22: D²PAK (TO-263) type B package outline
0079457_23_B
12/20
DocID027339 Rev 4
STB36N60M6
Package information
Table 10: D²PAK (TO-263) type B mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.36
4.56
A1
0
0.25
b
0.70
0.90
b1
0.51
0.89
b2
1.17
1.37
b3
1.36
1.46
c
0.38
0.694
c1
0.38
0.534
c2
1.19
1.34
D
8.60
9.00
D1
6.90
7.50
E
10.15
10.55
E1
8.10
8.70
e
2.54 BSC
H
15.00
15.60
L
1.90
2.50
L1
1.65
L2
1.78
L3
L4
0.25
4.78
DocID027339 Rev 4
5.28
13/20
Package information
STB36N60M6
Figure 23: D²PAK (TO-263) type B recommended footprint (dimensions are in mm)
14/20
DocID027339 Rev 4
STB36N60M6
4.3
Package information
D2PAK type A packing information
Figure 24: D2PAK type A tape outline
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15/20
Package information
STB36N60M6
Figure 25: D2PAK type A reel outline
Table 11: D²PAK type A tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
16/20
Dim.
Min.
Max.
Min.
A0
10.5
10.7
A
B0
15.7
15.9
B
1.5
Max.
330
D
1.5
1.6
C
12.8
D1
1.59
1.61
D
20.2
E
1.65
1.85
G
24.4
F
11.4
11.6
N
100
K0
4.8
5.0
T
13.2
26.4
30.4
P0
3.9
4.1
P1
11.9
12.1
Base quantity
1000
P2
1.9
2.1
Bulk quantity
1000
R
50
T
0.25
0.35
W
23.7
24.3
DocID027339 Rev 4
STB36N60M6
4.4
Package information
D²PAK type B packing information
Figure 26: D2PAK type B tape outline
Figure 27: D2PAK type B reel outline
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Package information
STB36N60M6
Table 12: D²PAK type B reel mechanical data
mm
Dim.
Min.
A
330
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
18/20
Max.
13.2
26.4
30.4
DocID027339 Rev 4
STB36N60M6
5
Revision history
Revision history
Table 13: Document revision history
Date
Revision
08-Jan-2015
1
Initial release.
07-Apr-2016
2
Updated Table 2: "Absolute maximum ratings", Table 6: "Dynamic",
Table 7: "Switching times" and Table 8: "Source-drain diode".
3
Updated title, the table of features in cover page, Section 1:
"Electrical ratings" and Section 2: "Electrical characteristics".
Added Section 2.1: "Electrical characteristics (curves)".
Added Section 4.2: "D²PAK (TO-263) type B package information"
and Section 4.4: "D²PAK type B packing information".
Minor text changes.
4
Updated document status from preliminary to production data.
Updated Table 2: "Absolute maximum ratings", Table 6: "Dynamic"
and Table 8: "Source-drain diode".
Updated Figure 2: "Safe operating area", Figure 4: "Output
characteristics", Figure 5: "Transfer characteristics" and Figure 9:
"Capacitance variations".
06-Feb-2017
21-Mar-2017
Changes
DocID027339 Rev 4
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STB36N60M6
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