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STB50N25M5

STB50N25M5

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT404

  • 描述:

    MOSFET N-CH 250V 28A D2PAK

  • 数据手册
  • 价格&库存
STB50N25M5 数据手册
STB50N25M5 N-channel 250 V, 0.065 Ω, 28 A, MDmesh™ V Power MOSFET in D²PAK package Datasheet — production data Features Type VDSS RDS(on) max ID STB50N25M5 250 V < 0.075 Ω 28 A ■ Amongst the best RDS(on)* area ■ High dv/dt capability ■ Excellent switching performance ■ Easy to drive ■ 100% avalanche tested 3 ) s ( ct u d o 1 r P e D²PAK t e l o Application ■ TAB Switching applications ) (s Description s b O Figure 1. Internal schematic diagram t c u $OR4!" This device is an N-channel MDmesh™ V Power MOSFET based on an innovative proprietary vertical process technology, which is combined with STMicroelectronics’ well-known PowerMESH™ horizontal layout structure. The resulting product has extremely low onresistance, which is unmatched among siliconbased Power MOSFETs, making it especially suitable for applications which require superior power density and outstanding efficiency. d o r P e ' t e l o bs 3 O !-V Table 1. Device summary Order code Marking Package Packaging STB50N25M5 50N25M5 D²PAK Tape and reel March 2012 This is information on a product in full production. Doc ID 15923 Rev 3 1/14 www.st.com 14 Contents STB50N25M5 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ......................... 6 3 Test circuits .............................................. 8 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 2/14 Doc ID 15923 Rev 3 STB50N25M5 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Symbol Value Unit Gate- source voltage ±25 V ID Drain current (continuous) at TC = 25 °C 28 A ID Drain current (continuous) at TC = 100 °C 18 A IDM (1) Drain current (pulsed) 112 A PTOT Total dissipation at TC = 25 °C 110 VGS Parameter IAR Avalanche current, repetitive or not-repetitive (pulse width limited by TJ max) EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V) dv/dt(2) TJ Tstg 1. Pulse width limited by safe operating area t c u A d o r 15 V/ns -55 to 150 °C Value Unit P e t e l o Operating junction temperature Storage temperature W 9 350 Peak diode recovery voltage slope (s) mJ s b O 2. ISD ≤ 28 A, di/dt ≤ 400 A/µs, VPeak < V(BR)DSS Table 3. Thermal data Symbol t c u ) (s Parameter od Rthj-case Thermal resistance junction-case max 0.31 °C/W Rthj-pcb Thermal resistance junction-pcb max 30 °C/W e t e ol Pr s b O Doc ID 15923 Rev 3 3/14 Electrical characteristics 2 STB50N25M5 Electrical characteristics (Tcase =25°C unless otherwise specified) Table 4. On /off states Symbol V(BR)DSS Parameter Test conditions Drain-source breakdown voltage ID = 1 mA, VGS = 0 IDSS Zero gate voltage VDS = 250 V drain current (VGS = 0) VDS = 250 V, TC=125 °C IGSS Gate-body leakage current (VDS = 0) Unit 250 V ±100 nA 5 V 0.065 0.075 Ω Min. Typ. Max. Unit VDS = 50 V, f = 1 MHz, VGS = 0 - 1700 100 15 - pF pF pF ) s ( ct VGS = ± 25 V RDS(on) Static drain-source onVGS = 10 V, ID = 14 A resistance e t e ol Dynamic Parameter s b O Test conditions u d o 3 Pr 4 Ciss Coss Crss Input capacitance Output capacitance Reverse transfer capacitance Co(er)(1) Equivalent output capacitance energy related VGS = 0, VDS = 0 to 80% V(BR)DSS - 89 - pF Equivalent output capacitance time related VGS = 0, VDS = 0 to 80% V(BR)DSS - 171 - pF Rg Gate input resistance f=1 MHz open drain - 1.8 - Ω Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD = 200 V, ID = 28 A, VGS = 10 V (see Figure 15) - 44 10 23 - nC nC nC )- s ( t c u d o r P e t e l o Co(tr) s b O Max. µA µA Gate threshold voltage VDS = VGS, ID = 100 µA Symbol Typ. 1 100 VGS(th) Table 5. Min. (2) 1. Co(er) is a constant capacitance value that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS 2. Co(tr) is a constant capacitance value that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS 4/14 Doc ID 15923 Rev 3 STB50N25M5 Electrical characteristics Table 6. Switching times Symbol Parameter td(on) tr td(off) tf Turn-on delay time Rise time Turn-off-delay time Fall time Table 7. ISDM (1) VSD (2) trr Qrr IRRM trr Qrr IRRM Min. Typ. - 16 44 35 20 VDD = 125 V, ID = 14 A, RG = 4.7 Ω, VGS = 10 V (see Figure 14) Max Unit - ns ns ns ns Source drain diode Symbol ISD Test conditions Parameter Test conditions Min. Typ. Source-drain current Source-drain current (pulsed) ISD = 28 A, VGS = 0 Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 28 A, di/dt = 100 A/µs VDD= 60 V, TJ = 25 °C (see Figure 16) Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 28 A, di/dt = 100 A/µs VDD= 60 V TJ = 150 °C (see Figure 16) 1. Pulse width limited by safe operating area ) (s ct - Forward on voltage s b O e t e ol u d o - Pr (s) Max Unit 28 112 A A 1.6 V - 174 1.5 18 ns µC A - 195 2 20 ns µC A 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5% t c u d o r P e t e l o s b O Doc ID 15923 Rev 3 5/14 Electrical characteristics STB50N25M5 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance AM03968v1 ID (A) D S( on ) O Li per m at ite io d ni by n m this ax a R rea is 100 10 10µs 100µs 10ms u d o Sinlge pulse 0.1 0.1 Figure 4. 10 1 100 Figure 5. AM03969v1 VGS=10V 50 )- 7V du 20 e t e l 5 10 15 AM03970v1 VDS=20V 40 30 6V o r P 10 O t e l o ID (A) s b O s ( t c 30 o s b Transfer characteristics 50 40 0 0 r P e VDS(V) Output characteristics ID (A) Figure 6. ) s ( ct 1ms Tj=150°C Tc=25°C 1 20 10 5V 20 25 30 Normalized BVDSS vs temperature AM10399v1 VDS 0 0 VDS(V) (norm) Figure 7. 2 4 6 8 10 VGS(V) Static drain-source on-resistance AM03972v1 RDS(on) (Ω) 1.08 ID = 1mA VGS=10V 1.06 0.070 1.04 1.02 0.065 1.00 0.98 0.060 0.96 0.94 0.92 -50 -25 6/14 0 25 50 75 100 TJ(°C) 0.055 0 Doc ID 15923 Rev 3 5 10 15 20 25 ID(A) STB50N25M5 Figure 8. Electrical characteristics Output capacitance stored energy Figure 9. AM04951v1 Eoss (µJ) Capacitance variations AM03973v1 C (pF) 2.5 Ciss 1000 2.0 100 1.5 Coss 1.0 Crss 10 ) s ( ct 0.5 0 0 100 50 150 200 250 1 0.1 VDS(V) 1 10 100 VDS(V) u d o Figure 10. Gate charge vs gate-source voltage Figure 11. Normalized on-resistance vs temperature AM03974v1 VGS (V) t e l o VGS VDD=200V 12 2.1 ID=28A VDS 10 r P e RDS(on) (norm) AM03976v1 ID=14A VGS=10V s b O 1.7 8 )- 6 s ( t c 4 u d o 2 0 0 e t e ol Figure 12. Pr 20 10 30 40 50 Qg(nC) 1.3 0.9 0.5 -50 -25 0 25 50 75 100 TJ(°C) Normalized gate threshold voltage Figure 13. Source-drain diode forward vs temperature characteristics AM03975v1 VGS(th) (norm) 1.10 s b O ID=100µA AM03978v1 VSD (V) TJ=-50°C 1.2 1.0 1.00 0.8 0.90 TJ=25°C 0.6 TJ=150°C 0.4 0.80 0.2 0.70 -50 -25 0 0 25 50 75 100 TJ(°C) Doc ID 15923 Rev 3 0 10 20 30 40 50 ISD(A) 7/14 Test circuits 3 STB50N25M5 Test circuits Figure 14. Switching times test circuit for resistive load Figure 15. Gate charge test circuit VDD 12V 47kΩ 1kΩ 100nF 3.3 μF 2200 RL μF IG=CONST VDD VGS 100Ω Vi=20V=VGMAX VD RG 2200 μF D.U.T. ) s ( t VG 2.7kΩ c u d PW 47kΩ 1kΩ PW D.U.T. AM01468v1 e t e ol o r P AM01469v1 Figure 16. Test circuit for inductive load Figure 17. Unclamped inductive load test switching and diode recovery times circuit A A D.U.T. FAST DIODE B B A D G S s ( t c 3.3 μF B 25 Ω D 1000 μF RG S r P e 2200 μF 3.3 μF VDD ID Vi D.U.T. Pw let AM01470v1 Figure 18. Unclamped inductive waveform b O L VD VDD u d o G so )- L=100μH s b O AM01471v1 Figure 19. Switching time waveform ton V(BR)DSS tdon VD toff tr tdoff tf 90% 90% IDM 10% ID VDD 10% 0 VDD VDS 90% VGS AM01472v1 8/14 0 Doc ID 15923 Rev 3 10% AM01473v1 STB50N25M5 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 8. D²PAK (TO-263) mechanical data mm Dim. Min. 4.40 4.60 A1 0.03 0.23 b 0.70 b2 1.14 c 0.45 c2 1.23 D 8.95 D1 7.50 E 10 E1 8.50 u d o 0.93 e t e ol ) (s s b O t c u e1 Pr 1.70 0.60 1.36 9.35 10.40 2.54 4.88 5.28 15 15.85 2.49 2.69 L 2.29 2.79 L1 1.27 1.40 L2 1.30 1.75 H od Pr J1 s b O Max. A e e t e ol ) s ( ct Typ. R V2 0.4 0° 8° Doc ID 15923 Rev 3 9/14 Package mechanical data STB50N25M5 Figure 20. D²PAK (TO-263) drawing ) s ( ct u d o r P e t e l o ) (s t c u s b O 0079457_T Figure 21. D²PAK footprint(a) od r P e 16.90 t e l o s b O 12.20 5.08 1.60 3.50 9.75 a. All dimensions are in millimeters 10/14 Doc ID 15923 Rev 3 Footprint STB50N25M5 5 Packaging mechanical data Packaging mechanical data Table 9. D²PAK (TO-263) tape and reel mechanical data Tape Reel mm mm Dim. Dim. Min. Max. A0 10.5 10.7 A B0 15.7 15.9 B 1.5 D 1.5 1.6 C 12.8 D1 1.59 1.61 D 20.2 E 1.65 1.85 G 24.4 F 11.4 11.6 N K0 4.8 5.0 T P0 3.9 4.1 P1 11.9 12.1 P2 1.9 2.1 R 50 T 0.25 W 23.7 ) (s 0.35 t c u Min. 330 ) s ( ct 13.2 u d o r P e 100 t e l o s b O Max. 26.4 30.4 Base qty 1000 Bulk qty 1000 24.3 d o r P e t e l o s b O Doc ID 15923 Rev 3 11/14 Packaging mechanical data STB50N25M5 Figure 22. Tape for D²PAK (TO-263) 10 pitches cumulative tolerance on tape +/- 0.2 mm P0 Top cover tape T P2 D E F W K0 B0 A0 D1 P1 ) s ( ct User direction of feed u d o r P e let o s b O ) s ( t c R Bending radius User direction of feed AM08852v2 u d o Figure 23. Reel for D²PAK (TO-263) T r P e REEL DIMENSIONS 40mm min. t e l o s b O Access hole At sl ot location B D C N A Full radius Tape slot in core for tape start 25 mm min. width G measured at hub AM08851v2 12/14 Doc ID 15923 Rev 3 STB50N25M5 6 Revision history Revision history Table 10. Document revision history Date Revision Changes 23-Jun-2009 1 First release 15-Mar-2012 2 Section 4: Package mechanical data has been updated. Minor text changes. 28-Mar-2012 3 Figure 7: Static drain-source on-resistance has been updated. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 15923 Rev 3 13/14 STB50N25M5 ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. r P e All ST products are sold pursuant to ST’s terms and conditions of sale. t e l o Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. ) (s s b O UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. t c u d o r UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. P e t e l o Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. s b O ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 14/14 Doc ID 15923 Rev 3
STB50N25M5 价格&库存

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