STN1NK80Z

STQ1NK80ZR-AP - STN1NK80Z STD1NK80Z - STD1NK80Z-1 N-CHANNEL 800V - 13 Ω - 1 A TO-92 /SOT-223/DPAK/IPAK Zener - Protected SuperMESH™ MOSFET Table 1: General Features TYPE STQ1NK80ZR-AP STN1NK80Z STD1NK80Z STD1NK80Z-1 ■ ■ ■ ■ ■ ■ Figure 1: Package ID 0.3 A 0.25A 1.0 A 1.0 A Pw 2 VDSS 800 V 800 V 800 V 800 V RDS(on) < 16 < 16 < 16 < 16 Ω Ω Ω Ω 3W 2.5 W 45 W 45 W 1 2 3 TYPICAL RDS(on) = 13Ω EXTREMELY HIGH dv/dt CAPABILITY ESD IMPROVED CAPABILITY 100% AVALANCHE TESTED NEW HIGH VOLTAGE BENCHMARK GATE CHARGE MINIMIZED TO-92 (Ammopack) SOT-223 3 1 1 3 2 DESCRIPTION The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip-based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products. DPAK IPAK Figure 2: Internal Schematic Diagram APPLICATIONS ■ AC ADAPTORS AND BATTERY CHARGERS ■ SWITH MODE POWER SUPPLIES (SMPS) Table 2: Order Codes SALES TYPE STQ1NK80ZR-AP STN1NK80Z STD1NK80ZT4 STD1NK80Z-1 MARKING Q1NK80ZR N1NK80Z D1NK80Z D1NK80Z PACKAGE TO-92 SOT-223 DPAK IPAK PACKAGING AMMOPAK TAPE & REEL TAPE & REEL TUBE Rev. 3 January 2006 1/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 Table 3: Absolute Maximum ratings Symbol VDS VDGR VGS ID ID IDM ( ) PTOT VESD(G-S) dv/dt (1) Tj Tstg Parameter TO-92 Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate- source Voltage Drain Current (continuous) at TC = 25°C Drain Current (continuous) at TC = 100°C Drain Current (pulsed) Total Dissipation at TC = 25°C Derating Factor Gate source ESD (HBM-C= 100pF, R= 1.5KΩ) Peak Diode Recovery voltage slope Operating Junction Temperature Storage Temperature 3 0.025 0.3 0.19 Value SOT-223 800 800 ± 30 0.25 0.16 5 2.5 0.02 1000 4.5 -55 to 150 45 0.36 1.0 0.63 DPAK/IPAK V V V A A A W W /°C V V/ns °C Unit ( ) Pulse width limited by safe operating area (1) ISD ≤ 1 A, di/dt ≤ 200 A/µs, VDD ≤ 640 Table 4: Thermal Data TO-92 Rthj-case Rthj-amb(#) Rthj-lead Tl Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Thermal Resistance Junction-lead Max Maximum Lead Temperature For Soldering Purpose -120 40 260 SOT-223 -50 --DPAK/IPAK 2.78 100 -300 Unit °C/W °C/W °C/W °C (#) When mounted on 1inch² FR-4 BOARD, 2 oz Cu Table 5: Avalanche Characteristics Symbol IAR EAS Parameter Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max) Single Pulse Avalanche Energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) Max Value 1 50 Unit A mJ Table 6: GATE-SOURCE ZENER DIODE Symbol BVGSO Parameter Gate-Source Breakdown Voltage Test Conditions Igs=± 1mA (Open Drain) Min. 30 Typ. Max. Unit V PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. 2/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED) Table 7: On/Off Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) Parameter Drain-source Breakdown Voltage Zero Gate Voltage Drain Current (VGS = 0) Gate-body Leakage Current (VDS = 0) Gate Threshold Voltage Static Drain-source On Resistance Test Conditions ID = 1 mA, VGS = 0 VDS = Max Rating VDS = Max Rating, TC = 125 °C VGS = ± 20V VDS = VGS, ID = 50 µA VGS = 10V, ID = 0.5 A 3 3.75 13 Min. 800 1 50 ±10 4.5 16 Typ. Max. Unit V µA µA µA V Ω Table 8: Dynamic Symbol gfs (1) Ciss Coss Crss Coss eq. (3) td(on) tr td(off) tf Qg Qgs Qgd Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Equivalent Output Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions VDS = 15 V, ID = 0.5 A VDS = 25 V, f = 1 MHz, VGS = 0 Min. Typ. 0.8 160 26 6.7 9.5 8 30 22 55 7.7 1.4 4.5 Max. Unit S pF pF pF pF ns ns ns ns nC nC nC VGS = 0V, VDS = 0V to 640V VDD = 400 V, ID = 0.5 A RG = 4.7Ω VGS = 10 V (see Figure 21) VDD = 640V, ID = 1.0 A, VGS = 10V (see Figure 24) Table 9: Source Drain Diode Symbol ISD ISDM (2) VSD (1) trr Qrr IRRM trr Qrr IRRM Parameter Source-drain Current Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 1.0 A, VGS = 0 ISD = 1.0 A, di/dt = 100 A/µs VDD = 50 V, Tj = 25°C (see Figure 22) ISD = 1.0 A, di/dt = 100 A/µs VDD = 50 V, Tj = 150°C (see Figure 22) 365 802 4.4 388 802.7 4.6 Test Conditions Min. Typ. Max. 1.0 5 1.6 Unit A A V ns nC A ns nC A Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. 3. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS 3/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 Figure 3: Safe Operating Area for SOT-223 Figure 6: Thermal Impedance for SOT-223 Figure 4: Safe Operating Area for TO-92 Figure 7: Thermal Impedance for TO-92 Figure 5: Safe Operating Area for IPAK-DPAK Figure 8: Thermal Impedance for DPAK-IPAK 4/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 Figure 9: Output Characteristics Figure 12: Transfer Characteristics Figure 10: Transconductance Figure 13: Static Drain-source On Resistance Figure 11: Gate Charge vs Gate-source Voltage Figure 14: Capacitance Variations 5/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 Figure 15: Normalized Gate Thereshold Voltage vs Temperature Figure 18: Normalized On Resistance vs Temperature Figure 16: Source-Drain Diode Forward Characteristics Figure 19: Normalized BVdss vs Temperature Figure 17: Avalanche Energy vs Starting Tj 6/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 Figure 20: Unclamped Inductive Load Test Circuit Figure 23: Unclamped Inductive Wafeform Figure 21: Switching Times Test Circuit For Resistive Load Figure 24: Gate Charge Test Circuit Figure 22: Test Circuit For Inductive Load Switching and Diode Recovery Times 7/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 8/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 16.4 50 22.4 18.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK QTY 2500 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 B1 D D1 E F K0 P0 P1 P2 R W BASE QTY 2500 mm MIN. 6.8 10.4 1.5 1.5 1.65 7.4 2.55 3.9 7.9 1.9 40 15.7 16.3 inch MIN. MAX. 7 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574 0.618 0.641 MAX. 10.6 12.1 1.6 1.85 7.6 2.75 4.1 8.1 2.1 9/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 TO-92 MECHANICAL DATA mm. DIM. MIN. A b D E e e1 L R S1 W V 4.32 0.36 4.45 3.30 2.41 1.14 12.70 2.16 0.92 0.41 5° TYP MAX. 4.95 0.51 4.95 3.94 2.67 1.40 15.49 2.41 1.52 0.56 MIN. 0.170 0.014 0.175 0.130 0.094 0.044 0.50 0.085 0.036 0.016 5° TYP. MAX. 0.194 0.020 0.194 0.155 0.105 0.055 0.610 0.094 0.060 0.022 inch 10/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 SOT-223 MECHANICAL DATA mm MIN. A B B1 c D e e1 E H V A1 0.02 3.30 6.70 0.60 2.90 0.24 6.30 0.70 3.00 0.26 6.50 2.30 4.60 3.50 7.00 3.70 7.30 10o 0.130 0.264 TYP. MAX. 1.80 0.80 3.10 0.32 6.70 0.024 0.114 0.009 0.248 0.027 0.118 0.010 0.256 0.090 0.181 0.138 0.276 0.146 0.287 10o MIN. inch TYP. MAX. 0.071 0.031 0.122 0.013 0.264 DIM. P008B 11/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 TO-252 (DPAK) MECHANICAL DATA mm MIN. A A1 A2 B B2 C C2 D E G H L2 L4 V2 0.60 0o 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.8 1.00 8o 0.024 0o TYP. MAX. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 MIN. 0.087 0.035 0.001 0.025 0.204 0.018 0.019 0.236 0.252 0.173 0.368 0.031 0.039 0o inch TYP. MAX. 0.094 0.043 0.009 0.035 0.213 0.024 0.024 0.244 0.260 0.181 0.398 DIM. P032P_B 12/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 TO-251 (IPAK) MECHANICAL DATA DIM. MIN. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 0.3 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.031 2.2 0.9 0.7 0.64 5.2 mm TYP. MAX. 2.4 1.1 1.3 0.9 5.4 0.85 0.012 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.039 MIN. 0.086 0.035 0.027 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.031 0.212 0.033 H C A C2 L2 D B3 B6 A1 L = = 3 B5 B A3 = B2 = G = E L1 1 2 = 0068771-E 13/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 Table 10: Revision History Date 08-Jun-2005 06-Sep-2005 16-Jan-2006 Revision 1 2 3 Description of Changes First Release Inserted Ecopack indication Corrected value on Table 3 14/15 STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners © 2006 STMicroelectronics - All Rights Reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 15/15