STPS3030CT

STPS3030/CT/CG/CR Low drop power Schottky rectifier Main product characteristics A1 IF(AV) VRRM Tj (max) VF(max) 2 x 15 A 30 V 150° C 0.42 V A2 K K Features and benefits ■ ■ ■ ■ ■ ■ Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop for higher efficiency Low thermal resistance Avalanche capability specified A2 A1 D2PAK STPS3030CG A1 K A2 TO-220AB STPS3030CT Description Dual Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged in TO-220AB, D2PAK and I2PAK, this device is intended for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. K A1 A2 I2PAK STPS3030CR j October 2006 Rev 4 1/9 www.st.com 9 Characteristics STPS3030CT/CG/CR 1 Characteristics Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt 1. d Ptot --------------dTj Absolute ratings (limiting values, per diode) Parameter Repetitive peak reverse voltage RMS forward current Average forward current Tc = 135° C Per diode δ = 0.5 Per device Value 30 30 15 A 30 250 1 3 4100 -65 to + 150 (1) Unit V A Surge non repetitive forward current tp = 10 ms sinusoidal Peak repetitive reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature tp = 2 µs square F= 1 kHz tp = 100 µs square tp = 1 µs Tj = 25° C A A A W °C °C V/µs 150 10000 Critical rate of rise of reverse voltage (rated VR, Tj = 25° C) 1 < -------------------------- condition to avoid thermal runaway for a diode on its own heatsink Rth ( j – a ) Table 2. Symbol Rth(j-c) Rth(c) Thermal resistance Parameter Junction to case TO-220AB - D2PAK - I2PAK Per diode Total Coupling Value 1.2 0.8 0.4 °C/W Unit Table 3. Symbol IR(1) Static electrical characteristics (per diode) Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM IF = 15 A IF = 15 A IF = 30 A IF = 30 A Min. Typ. 0.23 125 0.44 0.36 0.53 0.49 Max. 1.0 mA 180 0.49 0.40 V 0.58 0.53 Unit VF(1) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.26 x IF(AV) + 0.0107 IF2(RMS) 2/9 STPS3030CT/CG/CR Characteristics Figure 1. P(W) 10 9 8 7 6 5 Conduction losses versus average Figure 2. current IF(av)(A) 18 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Average forward current versus ambient temperature (δ = 0.5) 16 14 δ=1 Rth(j-a)=Rth(j-c) 12 10 8 4 3 2 1 0 0 2 4 6 8 10 12 14 T 6 4 2 Rth(j-a)=50°C/W IF(av)(A) δ=tp/T 16 18 tp Tamb(°C) 0 25 50 75 100 125 150 0 20 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 PARM(tp) PARM(25°C) 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration IM(A) 250 225 200 175 150 125 100 75 50 25 0 1.E-03 TC=125°C TC=25°C Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse δ = 0.2 δ = 0.1 δ = 0.5 TC=75°C T t(s) 1.E-02 1.E-01 1.E+00 0.1 0.0 1.E-03 tp(s) 1.E-02 1.E-01 δ=tp/T tp 1.E+00 3/9 Characteristics STPS3030CT/CG/CR Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) F=1MHz Vosc=30mV Tj=25°C IR(mA) 1.E+03 Tj=150°C C(nF) 10.0 1.E+02 Tj=125°C 1.E+01 Tj=100°C Tj=75°C 1.0 1.E+00 Tj=50°C 1.E-01 Tj=25°C VR(V) 1.E-02 0 5 10 15 20 25 30 0.1 1 VR(V) 10 100 Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm) Rth(j-a)(°C/W) 80 D²PAK IFM(A) 100 70 Tj=125°C (Maximum values) 60 50 Tj=25°C (Maximum values) Tj=125°C (Typical values) 10 40 30 20 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 10 0 0 5 10 15 S(cm²) 20 25 30 35 40 4/9 STPS3030CT/CG/CR Package information 2 Package information ● ● ● ● Epoxy meets UL94,V0 Cooling method: C Recommended torque value: 0.55 Nm Maximum torque value: 0.70 Nm I2PAK dimensions Dimensions Ref. Millimeters Min. A E L2 c2 Table 4. Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055 Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 A A1 b b1 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 D c c2 L1 L b1 A1 D e e1 E b e e1 c L L1 L2 5/9 Package information Table 5. D2PAK dimensions STPS3030CT/CG/CR Dimensions Ref Millimeters Min. A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 A A1 A2 D 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 B B2 L L3 A1 B2 B G A2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 11. Footprint (dimensions in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 6/9 STPS3030CT/CG/CR Table 6. TO-220AB dimensions Package information Dimensions Ref Millimeters Min. A C H2 Dia L5 C L7 L6 L2 F2 F1 L9 L4 F G1 G M E D A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information STPS3030CT/CG/CR 3 Ordering information Delivery mode Tube Tube Tape and reel Tube Ordering type STPS3030CT STPS3030CG STPS3030CG-TR STPS3030CR Marking STPS3030CT STPS3030CG STPS3030CG STPS3030CR Package TO-220AB D PAK D PAK I2PAK 2 2 Weight 2.2 g 1.48 g 1.48 g 1.49 g Base qty 50 50 1000 50 4 Revision history Date Jul-2006 16-Oct-2006 Revision 3A 4 Initial release. Reformatted to current standards. Corrected dimensions for I2PAK in Table 4 Changes 8/9 STPS3030CT/CG/CR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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