STPS40150CGY-TR

STPS40150C-Y Datasheet Automotive 150 V, 2 x 20 A high voltage power Schottky rectifier Features A1 K A2 K K A2 A1 D²PAK • • • • • • AEC-Q101 qualified revision C PPAP capable High junction temperature capability Low leakage current Low thermal resistance High frequency operation • ECOPACK®2 compliant Applications • • Switching mode power supply Automotive DC/DC converter Description Dual center tab Schottky rectifier suited for high frequency switched mode power supplies. Product status links STPS40150C-Y Product summary IF(AV) 2 x 20 A VRRM 150 V Tj(max.) 175 °C VF(typ.) 0.69 V DS12474 - Rev 3 - December 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPS40150C-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, per diode at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Tj from -40 °C to 175 °C Value Unit 150 V 60 A TC = 150 °C Per diode 20 TC = 145 °C Per device 40 IF(AV) Average forward current, δ = 0.5, square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 250 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 1080 W Storage temperature range -65 to +175 °C Operating junction temperature(1) -40 to +175 °C Tstg Tj A 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal parameters Symbol Value Parameter Rth(j-c) Junction to case Rth(c) Coupling Unit Max. Per diode 1.2 Total 0.85 °C/W 0.5 °C/W When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) Table 3. Static electrical characteristics (per diode) Symbol IR Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 20 A IF = 40 A Min. Typ. - 4 - Unit 15 µA 17 mA 0.92 0.69 - Max. 0.75 1.00 0.79 V 0.86 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp =380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.64 x IF(AV) + 0.0055 x IF 2 (RMS) DS12474 - Rev 3 page 2/9 STPS40150C-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (per diode) 22 PF(AV)(W) δ=0.1 δ=0.05 20 δ=0.2 Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) 50 δ=0.5 IF(AV) (A) 45 18 δ=1.0 16 Rth(j-a)=Rth(j-c) 40 35 14 30 12 25 10 20 8 6 15 T 4 T 10 2 δ=tp/T 0 0 2 4 6 8 10 12 14 16 IF(AV) (A) tp 18 20 22 24 26 5 28 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration δ=tp/T tp Tamb (°C) 0 0 25 50 75 100 125 150 175 Figure 4. Reverse leakage current versus reverse voltage applied (typical values, per diode) I R (µA) Z th(j-c) / R th(j-c) 1.E+05 1.0 0.9 Tj = 150 °C 1.E+04 0.8 Tj = 125 °C 0.7 1.E+03 Tj = 100 °C 0.6 1.E+02 0.5 0.4 Tj = 75 °C Tj = 50 °C 1.E+01 0.3 Tj = 25 °C 1.E+00 0.2 0.1 0.0 1.E-05 VR(V) t p(s) Single pulse 1.E-01 0 1.E-04 1.E-03 1.E-02 1.E-01 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 1.E+00 Figure 5. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) Figure 6. Forward voltage drop versus forward current (typical values, per diode) 1000.0 1000 I F (A) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C 100.0 Tj = 75 °C Tj = 125 °C 10.0 100 Tj = 25 °C 1.0 VF(V) VR(V) 0.1 10 1 DS12474 - Rev 3 10 100 1000 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 page 3/9 STPS40150C-Y Characteristics (curves) Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy printed board FR4, eCu = 35 µm) 80 Figure 8. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) Rth(j-a) (°C/W) 1 D²PAK 70 PARM (t p ) PARM (10 µs) Epoxy printed board FR4, copper thickness = 35 µm 60 0.1 50 40 30 0.01 20 10 SCu (cm²) 0.001 0 0 5 DS12474 - Rev 3 10 15 20 25 30 35 40 t p(µs) 1 10 100 1000 page 4/9 STPS40150C-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 D²PAK package information • • Epoxy meets UL94, V0. Cooling method: by conduction (C) Figure 9. D²PAK package outline Note: DS12474 - Rev 3 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 5/9 STPS40150C-Y D²PAK package information Table 4. D²PAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 7.75 8.00 0.295 0.305 0.315 D2 1.10 1.30 1.50 0.043 0.051 0.060 E 10.00 10.40 0.394 E1 8.30 8.50 8.70 0.335 0.343 0.346 E2 6.85 7.05 7.25 0.266 0.278 0.282 e 0.409 2.54 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.69 0.097 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.049 0.055 L2 1.30 1.75 0.050 0.069 R V2 0.40 0° 0.015 8° 0° 8° Figure 10. D²PAK recommended footprint (dimensions are in mm) Footprint DS12474 - Rev 3 page 6/9 STPS40150C-Y Ordering information 3 Ordering information Table 5. Order code DS12474 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode STPS40150CGY-TR STPS40150CGY D²PAK 1.48 G 1000 Tape and reel page 7/9 STPS40150C-Y Revision history Table 6. Document revision history DS12474 - Rev 3 Date Revision Changes 12-Mar-2018 1 First issue. 07-Dec-2018 2 Added Figure 8. Updated Table 1. 12-Dec-2018 3 Updated Table 3. page 8/9 STPS40150C-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12474 - Rev 3 page 9/9