STPSC20H12G-TR

STPSC20H12 Datasheet 1200 V power Schottky silicon carbide diode Features A K K K A A NC K K D²PAK TO-220AC DO-247 LL A K • • • • • No or negligible reverse recovery Switching behavior independent of temperature Robust high voltage periphery Operating from -40 °C to 175 °C Low VF • ECOPACK® compliant component Description The SiC diode, available in TO-220AC, D²PAK and TO-247 LL, is an ultrahigh performance power Schottky rectifier. It is manufactured using a silicon carbide substrate. The wide band-gap material allows the design of a low VF Schottky diode structure with a 1200 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. Especially suited for use in PFC and secondary side applications, this ST SiC diode will boost the performance in hard switching conditions. This rectifier will enhance the performance of the targeted application. Its high forward surge capability ensures a good robustness during transient phases. Product status link STPSC20H12 Product summary Symbol Value IF(AV) 20 A VRRM 1200 V T j(max.) 175 °C VF(max.) 1.35 V DS11651 - Rev 5 - April 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPSC20H12 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage (Tj= -40 °C to +175 °C) IF(RMS) Forward rms current Average forward current IFRM Repetitive peak forward current Tj 1200 V 38 A 20 A DO-247 LL, Tc = 150 °C ,DC current Surge non repetitive forward current TO-220AC, D²PAK, TC = 155 °C, Tj = 175 °C, δ = 0.1 78 DO-247 LL, TC = 150 °C, Tj = 175 °C, δ = 0.1 79 tp = 10 ms sinusoidal tp = 10 µs square Tstg Unit TO-220AC, D²PAK, TC = 155 °C(1) , DC current IF(AV) IFSM Value TC = 25 °C 140 TC = 150 °C 120 TC = 25 °C 700 A A Storage temperature range -65 to +175 °C Operating temperature range -40 to +175 °C 1. Value based on Rth(j-c) max. Table 2. Thermal parameters Symbol Rth(j-c) Parameter Junction to case Typ. value Max. value TO-220AC, D²PAK 0.30 0.45 DO-247 LL 0.40 0.55 Unit °C/W Table 3. Static electrical characteristics Symbol Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 20 A Min. Typ. Max. - 10 120 - 60 800 - 1.35 1.50 - 1.75 2.25 Unit µA V 1. Pulse test: tp = 10 ms, δ < 2% 2. Pulse test: tp = 500 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.07 x IF(AV) + 0.059 x IF 2 (RMS) DS11651 - Rev 5 page 2/15 STPSC20H12 Characteristics Table 4. Dynamic electrical characteristics Symbol QCj (1) Cj Parameter Total capacitive charge Total capacitance Test conditions Min. Typ. Max. Unit VR = 800 V - 129 - nC VR = 0 V, Tc = 25 °C, F = 1 MHz - 1650 - VR = 800 V, Tc = 25 °C, F = 1 MHz - 110 - pF 1. Most accurate value for the capacitive charge: VR Qcj VR =   ∫ C j V dV 0 DS11651 - Rev 5 page 3/15 STPSC20H12 Characteristics (curves) 1.2 Characteristics (curves) Figure 1. Forward voltage drop versus forward current (typical values) IF(A) 40 Figure 2. Reverse leakage current versus reverse voltage applied (typical values) IR(µA) 1.E+02 Pulse test : tp = 500 µs 35 1.E+01 30 Tj = 150 °C 25 Ta = 25 °C 1.E+00 Ta = 150 °C Tj = 25 °C 20 1.E-01 15 10 1.E-02 5 VR (V) VF (V) 1.E-03 0 0.0 0.5 1.0 1.5 2.0 2.5 Figure 3. Peak forward current versus case temperature (TO-220AC, D²PAK) 140 IM(A) δ = 0.1 tp δ = tp/T 100 200 300 400 500 600 700 800 900 1000 1100 1200 Figure 4. Peak forward current versus case temperature (DO-247 LL) 140 T 120 0 3.0 IM (A) T δ = 0.1 120 δ =tp/T tp 100 100 80 80 δ = 0.3 60 δ = 0.3 60 δ = 0.5 δ = 0.5 40 40 δ = 0.7 δ= 1 20 TC(°C) Tc (°C) 0 0 0 25 50 75 100 125 150 0 175 Figure 5. Junction capacitance versus reverse voltage applied (typical values) 1800 Cj(pF) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C 1400 25 50 75 100 125 150 175 Figure 6. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, D²PAK) 1.0 1600 δ = 0.7 δ= 1 20 Zth(j-c)/Rth(j-c) 0.9 0.8 0.7 1200 0.6 1000 0.5 0.4 800 0.3 600 0.2 400 0.1 200 VR(V) 0 0.1 DS11651 - Rev 5 1 10 100 1000 Single pulse t p (s) 0.0 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 10000 page 4/15 STPSC20H12 Characteristics (curves) Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (DO-247 LL) 1.0 Zth(j-c) /Rth(j-c) Figure 8. Non- repetitive peak surge forward current versus pulse duration (sinusoidal waveform) 1.E+03 IFSM(A) 0.9 0.8 Ta = 25 °C 0.7 0.6 0.5 0.4 Ta = 150 °C 0.3 0.2 Single pulse 0.1 tp (s) t p (s) 0.0 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 9. Total capacitive charges versus reverse voltage applied (typical values) 140 1.E+02 1.E-05 1.E-04 1.E-03 1.E-02 Figure 10. Thermal resistance junction to ambient versus copper surface under tab for D²PAK package (typical values) Qcj(nC) 80 120 Rth(j-a) (°C/W) D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 100 60 80 50 60 40 40 30 20 20 VR (V) 10 0 0 100 200 300 400 500 600 700 800 SCu (cm²) 0 0 DS11651 - Rev 5 5 10 15 20 25 30 35 40 page 5/15 STPSC20H12 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DS11651 - Rev 5 page 6/15 STPSC20H12 TO-220AC package information 2.1 TO-220AC package information • • • • Cooling method: by conduction (C) Epoxy meets UL94,V0 Recommended torque value: 0.55 N·m Maximum torque value: 0.7 N·m Figure 11. TO-220AC package outline A H2 ØI C L5 L7 L6 L2 F1 D L9 L4 F M E G DS11651 - Rev 5 page 7/15 STPSC20H12 TO-220AC package information Table 5. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam DS11651 - Rev 5 Inches 2.6 typ. 3.75 0.102 typ. 3.85 0.147 0.151 page 8/15 STPSC20H12 DO-247 LL package information 2.2 DO-247 LL package information • • • • Cooling method: by conduction (C) Epoxy meets UL94,V0 Recommended torque value: 0.8 N·m Maximum torque value: 1.0 N·m Figure 12. DO-247 LL package outline DS11651 - Rev 5 page 9/15 STPSC20H12 DO-247 LL package information Table 6. DO-247 LL package mechanical data Dimensions Millimeters Ref. Inches(1) Min. Max. Min. Max. A 4.70 5.31 0.185 0.209 A1 2.21 2.59 0.087 0.102 A2 1.50 2.49 0.059 0.098 b 0.99 1.40 0.039 0.055 b2 1.65 2.39 0.065 0.094 c 0.38 0.89 0.015 0.035 D 20.80 21.46 0.819 0.845 D1 13.08 E 15.49 e 0.515 16.26 0.610 5.44 typ. 0.640 0.214 E1 13.46 0.530 E2 3.43 3.99 0.135 0.157 L 19.81 20.32 0.780 0.800 L1 4.50 0.177 P 3.56 3.66 0.140 0.144 P1 7.06 7.39 0.278 0.291 Q 5.38 6.20 0.219 0.244 S 6.17 typ. W 0.243 0.15 0.006 1. Inches dimensions given for reference only DS11651 - Rev 5 page 10/15 STPSC20H12 D²PAK package information 2.3 D²PAK package information • • Cooling method: by conduction (C) Epoxy meets UL 94,V0 Figure 13. D²PAK package outline DS11651 - Rev 5 page 11/15 STPSC20H12 D²PAK package information Table 7. D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. V2 0° 0.015 8° 0° 8° Figure 14. D²PAK Recommended footprint 16.90 12.20 5.08 2.54 1.60 9.75 DS11651 - Rev 5 3.50 page 12/15 STPSC20H12 Ordering information 3 Ordering information Table 8. Ordering information DS11651 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STPSC20H12D STPSC20H12D TO-220AC 1.86 g 50 Tube STPSC20H12WL STPSC20H12WL DO-247 LL 5.9 g 30 Tube STPSC20H12G-TR STPSC20H12G D²PAK 1.48 g 1000 Tape and reel page 13/15 STPSC20H12 Revision history Table 9. Document revision history DS11651 - Rev 5 Date Revision Changes 13-May-2016 1 Initial release. 26-May-2016 2 Updated Table 2: "Absolute ratings (limiting values at 25 °C, unless otherwise specified)" and Figure 8: "Non- repetitive peak surge forward current versus pulse duration (sinusoidal waveform)". 16-Mar-2017 3 Added D²PAK package. 05-Sep-2017 4 Added DO-247 LL package. Updated Section "Features" , Section 1:"Characteristics" and Table 9: "Ordering information". 10-Apr-2018 5 Updated Section 2.2 DO-247 LL package information. page 14/15 STPSC20H12 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS11651 - Rev 5 page 15/15