STTH512B-TR

STTH512 Ultrafast recovery - 1200 V diode Datasheet - production data Description . $ The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. . $ . $ 72$& . 72)3$& . . The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. 1& $ Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. 1& $ Table 1. Device summary '3$. Features  Ultrafast, soft recovery  Very low conduction and switching losses  High frequency and/or high pulsed current operation Symbol Value IF(AV) 5A VRRM 1200 V Tj(max) 175 °C VF (typ) 1.25 V trr (typ) 48 ns  High reverse voltage capability  High junction temperature  ECOPACK®2 compliant component for DPAK on demand  Insulated package: TO-220FPAC – Insulated voltage: 2000 VRMS sine February 2016 This is information on a product in full production. DocID12154 Rev 3 1/13 www.st.com Characteristics 1 STTH512 Characteristics Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise stated) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) RMS forward current Unit 1200 V TO-220AC / TO-220FPAC 30 DPAK 10 A Average forward current, δ = 0.5, square wave TO-220AC / DPAK IF(AV) Tc = 145° C TO-220FPAC Tc = 105° C IFRM Repetitive peak forward current IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Value 5 A tp = 5 µs, F = 5 kHz square 60 A tp = 10 ms Sinusoidal 55 A -65 to + 175 °C 175 °C Maximum operating junction temperature Table 3. Thermal resistance Symbol Rth(j-c) Parameter Value TO-220AC / DPAK 2.5 TO-220FPAC 5.8 Junction to case Unit °C/W Table 4. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Min. Typ. VF Forward voltage drop Tj = 125° C µA 3 30 2.20 IF = 5 A Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.5 x IF(AV) + 0.08 IF2(RMS) 2/13 Unit 5 VR = VRRM Tj = 25° C (2) Max. DocID12154 Rev 3 1.30 2.00 1.25 1.90 V STTH512 Characteristics Table 5. Dynamic characteristics Symbol Test conditions Parameter trr Typ. Unit 95 ns IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25 °C 48 70 Reverse recovery current IF = 5 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125 °C 11 16 A S Softness factor IF = 5 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125 °C 2 tfr Forward recovery time dIF/dt = 50 A/µs IF = 5 A VFR = 1.5 x VFmax, Tj = 25 °C 400 ns Forward recovery voltage IF = 5 A, dIF/dt = 50 A/µs, Tj = 25 °C VFP Figure 1. Conduction losses versus average current 9.5 IFM(A) δ = 0.2 δ = 0.1 12 50 δ=1 δ = 0.5 45 δ = 0.05 11 10 40 9 35 8 30 7 Tj=150°C (typical values) Tj=25°C (maximum values) 25 6 5 20 4 15 T 3 1 IF(AV)(A) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.5 5.0 5 tp δ =tp/T 4.0 Tj=150°C (maximum values) 10 2 0.0 V Figure 2. Forward voltage drop versus forward current P(W) VFM(V) 0 5.5 6.0 0.0 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 Max. IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C Reverse recovery time IRM 13 Min. Single pulse TO-220AC DPAK 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 tp(s) tp(s) 0.0 0.0 1.E-03 Single pulse TO-220FPAC 1.E-02 1.E-01 1.E+00 1.E-03 DocID12154 Rev 3 1.E-02 1.E-01 1.E+00 1.E+01 3/13 13 Characteristics STTH512 Figure 5. Peak reverse recovery current versus dIF/dt (typical values) trr(ns) IRM(A) 600 28 VR=600V Tj=125°C 26 24 Figure 6. Reverse recovery time versus dIF/dt (typical values) VR=600V Tj=125°C 550 500 22 IF=2 x IF(AV) 450 20 400 18 IF=IF(AV) 16 350 IF=0.5 x IF(AV) 14 300 12 250 10 IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 200 8 150 6 100 4 2 50 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0 0 100 200 300 400 500 Figure 7. Reverse recovery charges versus dIF/dt (typical values) 0 100 200 300 400 500 Figure 8. Softness factor versus dIF/dt (typical values) Qrr(nC) S factor 2000 4.0 VR=600V Tj=125°C 1800 IF ≤ 2xIF(AV) VR=600V Tj=125°C 3.5 1600 IF=2 x IF(AV) 3.0 1400 1200 2.5 IF=IF(AV) 1000 IF=0.5 x IF(AV) 2.0 800 600 1.5 400 1.0 200 dIF/dt(A/µs) dIF/dt(A/µs) 0.5 0 0 100 200 300 400 0 500 Figure 9. Relative variations of dynamic parameters versus junction temperature 100 200 300 400 500 Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 2.25 50 IF=IF(AV) VR=600V Reference: Tj=125°C 2.00 1.75 IF=IF(AV) Tj=125°C 45 40 S factor 1.50 35 1.25 30 25 1.00 trr 0.75 20 IRM 15 0.50 10 QRR 0.25 Tj(°C) 5 dIF/dt(A/µs) 0.00 25 50 75 100 125 0 0 4/13 DocID12154 Rev 3 50 100 150 200 250 300 STTH512 Characteristics Figure 11. Forward recovery time versus dIF/dt (typical values) Figure 12. Junction capacitance versus reverse voltage applied (typical values) C(pF) tfr(ns) 700 100 F=1MHz VOSC=30mVRMS Tj=25°C IF=IF(AV) VFR=1.5 x VF max. Tj=125°C 600 500 10 400 300 VR(V) dIF/dt(A/µs) 1 200 0 50 100 150 200 250 300 350 400 450 1 500 10 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab  5WKMDƒ&: (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P   '3$.         6 FPð &8        DocID12154 Rev 3    5/13 13 Package information 2 STTH512 Package information  Epoxy meets UL94, V0  Cooling method: by conduction (C)  Recommended torque values: 0.55 N·m for TO-220AC and TO-220FPAC  Maximum torque value: 0.7 N·m for TO-220AC and TO-220FPAC In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 TO-220AC package information Figure 14. TO-220AC package outline A H2 ØI C L5 L7 L6 L2 F1 D L9 L4 F M E G 6/13 DocID12154 Rev 3 STTH512 Package information Table 6. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 2.60 typ. 3.75 0.102 typ. 3.85 DocID12154 Rev 3 0.147 0.151 7/13 13 Package information 2.2 STTH512 TO-220FPAC package information Figure 15. TO-220FPAC package outline A B H Dia L6 L2 L7 L3 F1 D L4 F G1 G 8/13 DocID12154 Rev 3 E STTH512 Package information Table 7. TO-220FPAC package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 B 2.50 2.70 0.098 0.106 D 2.50 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1.00 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.40 2.70 0.094 0.106 H 10.00 10.40 0.393 0.409 L2 16.00 Typ. 0.630 Typ. L3 28.60 30.60 1.126 1.205 L4 9.80 10.60 0.386 0.417 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 DocID12154 Rev 3 9/13 13 Package information 2.3 STTH512 DPAK package information Figure 16. DPAK package outline ( $ E F 7KHUPDOSDG ( / ' ' 5 + / $ E H H 5 F $ / /  Note: 10/13 9 *DXJH SODQH This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID12154 Rev 3 STTH512 Package information Table 8. DPAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.264 E1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° 8° Figure 17. Footprint (dimensions in mm)      % 7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ DocID12154 Rev 3 $   $ % 11/13 13 Ordering information 3 STTH512 Ordering information Table 9. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STTH512D STTH512D TO-220AC 1.86 g 50 Tube STTH512FP STTH512FP TO-220FPAC 1.9 g 50 Tube STTH512B-TR STTH512B DPAK 0.32 g 2500 Tape and reel Revision history Table 10. Document revision history 12/13 Date Revision Changes 02-Mar-2006 1 First issue. 26-Nov-2014 2 Updated DPAK package information and reformatted to current standard. 24-Feb-2016 3 Updated DPAK package information and reformatted to current standard. DocID12154 Rev 3 STTH512 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID12154 Rev 3 13/13 13