STTH5R06BY-TR

STTH5R06-Y Datasheet Automotive 600 V, 5 A ultrafast diode Features K A K K A AEC-Q101 qualified Ultrafast switching Low reverse recovery current Reduces switching losses Low thermal resistance ECOPACK compliant NC A Applications NC D²PAK • • • • • • DPAK • • • Switching diode Free-wheeling diode Automotive DC/DC converter Description This 5A, 600 V ultrafast diode is specially suited as a boost diode in continuous mode power factor correction and hard switching conditions. This STTH5R06-Y is also intended for use as a free wheeling diode in power supplies and other power switching applications. Product status links STTH5R06-Y Product summary IF(AV) 5A VRRM 600 V Tj(max.) 175 °C VF(typ.) 1.5 V Trr(max.) 35 ns DS6874 - Rev 2 - March 2019 For further information contact your local STMicroelectronics sales office. www.st.com STTH5R06-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Value Unit Tj from -40 °C to 175 °C 600 V D2PAK 25 DPAK 10 D2PAK, DPAK IF(AV) Average forward current, δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Tj D2PAK TC = 145 °C A 5 tp = 10 ms sinusoidal DPAK A 70 A 50 For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 2. Thermal parameters Symbol Rth(j-c) Parameter Junction to case Maximum value Unit 2.2 °C/W Per diode Table 3. Static electrical characteristics Symbol Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 5 A Min. Typ. - 30 30 - Max. 300 3.20 1.50 1.95 Unit µA V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp =380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.35 x IF(AV) + 0.12 x IF 2 (RMS) DS6874 - Rev 2 page 2/13 STTH5R06-Y Characteristics Table 4. Dynamic electrical characteristics Symbol trr IRM Sfactor Parameter Reverse recovery time Tj = 25 °C Softness factor Reverse recovery charge tfr Forward recovery time Forward recovery voltage Tj = 125 °C Tj = 25 °C Min. Typ. Max. IF = 0.5 A, Irr = 0.25 A, IR = 1 A - 20 IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs - 35 Reverse recovery current Qrr VFP Test conditions IF = 5 A, VR = 400 V, dlF/dt = -200 A/µs Unit ns - 4.5 - 0.5 - - 110 nC IF = 5 A, VFR =2.5 V, dlF/dt = 40 A/µs 6 A 220 ns 4.5 V For more information, please refer to the following application notes related to the power losses: • AN604: Calculation of conduction losses in a power rectifier • AN5028: Calculation of turn-off power losses generated by an ultrafast diode DS6874 - Rev 2 page 3/13 STTH5R06-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Forward voltage drop versus forward current IF (A) P(W) 20.0 16 δ = 0.05 14 δ = 0.1 δ = 0.2 17.5 δ = 0.5 Tj=125 °C (Maximum values) 15.0 12 δ=1 12.5 10 Tj=25 °C (Maximum values) Tj=125 °C (Typical values) 10.0 8 7.5 6 4 5.0 T 2.5 2 IF(AV)(A) δ=tp/T 0 0 1 2 3 4 5 6 tp 7 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 0.0 0.0 VF (V) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 Figure 4. Peak reverse recovery current versus dIF/dt (typical values) Zth(j-c) /Rth(j-c) IRM(A) 1.0 9 0.9 IF=I F(AV) VR=400 V Tj=125 °C 8 0.8 7 0.7 6 0.6 5 0.5 4 0.4 3 0.3 0.2 2 Single pulse 0.1 0.0 1.E-04 DS6874 - Rev 2 1 t p (s) dI F/dt(A/µs) 0 1.E-03 1.E-02 1.E-01 1.E+00 0 50 100 150 200 250 300 350 400 450 500 page 4/13 STTH5R06-Y Characteristics (curves) Figure 5. Reverse recovery time versus dIF/dt (typical values) Figure 6. Reverse recovery charges versus dIF/dt (typical values) t rr (ns) Qrr (nC) 80 160 IF=I F(AV) VR=400 V Tj=125 °C 70 60 120 50 100 40 80 30 60 20 40 10 IF=I F(AV) VR=400 V Tj=125 °C 140 20 dI F/dt(A/µs) dI F/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 0 500 Figure 7. Softness factor versus dIF/dt (typical values) 50 100 150 200 250 300 350 400 450 500 Figure 8. Relative variations of dynamic parameters versus junction temperature S factor 0.8 2.50 IF=I F(AV) VR=400 V Tj=125 °C 0.7 IF=I F(AV) VR=400 V Reference: T j=125 °C 2.25 2.00 0.6 SFACTOR 1.75 0.5 1.50 0.4 1.25 0.3 1.00 0.75 0.2 IRM 0.50 0.1 dI F/dt(A/µs) 0.25 0.0 Tj (°C) QRR 0.00 0 50 DS6874 - Rev 2 100 150 200 250 300 350 400 450 500 25 50 75 100 125 page 5/13 STTH5R06-Y Characteristics (curves) Figure 9. Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) VFP(V) t fr (ns) 14 160 IF=I F(AV) Tj=125 °C 12 IF=I F(AV) VFR=2.5V Tj=125 °C 140 10 120 8 100 6 80 60 4 40 2 dI F/dt(A/µs) 0 0 50 100 150 200 250 300 20 350 400 450 dI F/dt(A/µs) 0 500 0 Figure 11. Junction capacitance versus reverse voltage applied (typical values, per diode) 50 100 150 200 250 300 350 400 450 500 Figure 12. Thermal resistance junction to ambient versus copper surface under tab (typical values) C(pF) 80 100 Rth(j-a) (°C/W) D²PAK F=1 MHz VOSC=30 mVRMS Tj=25 °C 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 VR(V) 10 1 10 SCu (cm²) 0 100 0 1000 5 10 15 20 25 30 35 40 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (typical values) 100 Rth(j-a) (°C/W) DPAK Epoxy printed circuit board, copper thickness: 35 µm 90 80 70 60 50 40 30 20 10 SCu (cm²) 0 0 DS6874 - Rev 2 5 10 15 20 25 30 35 40 page 6/13 STTH5R06-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 D²PAK package information • • Epoxy meets UL94, V0. Cooling method: by conduction (C) Figure 14. D²PAK package outline Note: DS6874 - Rev 2 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 7/13 STTH5R06-Y D²PAK package information Table 5. D²PAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 7.75 8.00 0.295 0.305 0.315 D2 1.10 1.30 1.50 0.043 0.051 0.060 E 10.00 10.40 0.394 E1 8.30 8.50 8.70 0.335 0.343 0.346 E2 6.85 7.05 7.25 0.266 0.278 0.282 e 0.409 2.54 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.69 0.097 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.049 0.055 L2 1.30 1.75 0.050 0.069 R V2 0.40 0° 0.015 8° 0° 8° Figure 15. D²PAK recommended footprint (dimensions are in mm) Footprint DS6874 - Rev 2 page 8/13 STTH5R06-Y DPAK package information 2.2 DPAK package information • Epoxy meets UL94, V0 Figure 16. DPAK package outline A E c2 b4 E1 L2 D1 H D L4 A1 b (2x) e R e1 c Seating plane A2 (L1) L V2 0.25 DS6874 - Rev 2 Gauge plane page 9/13 STTH5R06-Y DPAK package information Table 6. DPAK mechanical data Dimensions Dim. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.205 0.213 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 D1 4.95 5.25 0.195 E 6.40 6.60 0.252 E1 4.60 4.70 4.80 0.181 0.185 0.189 e 2.159 2.286 2.413 0.085 0.090 0.095 e1 4.445 4.572 4.699 0.175 0.180 0.185 H 9.35 10.10 0.368 0.398 L 1.00 1.50 0.039 0.059 (L1) 2.60 2.80 3.00 0.102 0.110 0.118 L2 0.65 0.80 0.95 0.026 0.031 0.037 L4 0.60 1.00 0.024 R V2 5.10 0.201 0.207 0.260 0.039 0.20 0.008 0° 8° 0° 8° 1. Inches dimensions given for reference only Figure 17. DPAK recommended footprint (dimensions are in mm) 6.3 6.1 10.7 2.8 1.8 min. B 1.5 4.572 A The device must be positioned within DS6874 - Rev 2 page 10/13 STTH5R06-Y Ordering information 3 Ordering information Table 7. Order code DS6874 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode STTH5R06GY-TR STTH5R06GY D²PAK 1.48 g 1000 Tape and reel STTH5R06BY-TR STTH5R06BY DPAK 0.35 g 2500 Tape and reel page 11/13 STTH5R06-Y Revision history Table 8. Document revision history DS6874 - Rev 2 Date Revision Changes 03-Nov-2011 1 First issue. 18-Mar-2019 2 Added Section Applications. Updated Table 7. Order code. page 12/13 STTH5R06-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 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