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STTH802G-TR

STTH802G-TR

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO263

  • 描述:

    DIODE GEN PURP 200V 8A D2PAK

  • 数据手册
  • 价格&库存
STTH802G-TR 数据手册
STTH802 Ultrafast recovery diode Datasheet - production data K K This device uses ST's 200 V planar Pt doping technology, and is especially suited for switching mode base drive and transistor circuits. K K TO-220AC Description K A A A A NC NC Packaged in TO-220AC, TO-220FPAC, DPAK, and D2PAK this device is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection. D2PAK K NC A A TO-220FPAC K Table 1: Device summary K NC A DPAK Symbol Value IF(AV) 8A VRRM 200 V Tj (max.) 175 °C VF (typ.) 0.8 V trr (typ.) 17 ns Features       Very low conduction losses Negligible switching losses Low forward and reverse recovery time High junction temperature ECOPACK®2 compliant component for DPAK and D²PAK on demand Insulated package: TO-220FPAC  Insulating voltage: 2000 VRMS sine August 2017 DocID12362 Rev 3 This is information on a product in full production. 1/17 www.st.com Characteristics 1 STTH802 Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) Forward rms current 16 A 8 A 100 A -65 to +175 °C 175 °C Average forward current δ = 0.5, square wave IF(AV) IFSM Surge non repetitive forward current Tstg Storage temperature range Tj TO-220AC, DPAK, D2PAK TC = 145 °C TO-220FPAC TC = 125 °C tp = 10 ms sinusoidal Maximum operating junction temperature Table 3: Thermal parameter Symbol Rth(j-c) Parameter Junction to case Max. value TO-220AC, DPAK, D2PAK 3.2 TO-220FPAC 5.5 Unit °C/W Table 4: Static electrical characteristics Symbol Parameter Test conditions IR(1) Reverse leakage current VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 8 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.73 x IF(AV) + 0.021 x IF2(RMS) 2/17 DocID12362 Rev 3 Min. Typ. - Max. 6 - 6 60 - 0.95 1.05 - 0.80 0.90 Unit µA V STTH802 Characteristics Table 5: Dynamic electrical characteristics Symbol trr IRM tfr VFP Test conditions Parameter Min. Typ. Max. Unit Tj = 25 °C IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V - 25 30 ns Tj = 25 °C IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V - 17 22 ns Reverse recovery current Tj = 125 °C IF = 8 A, dIF/dt = -200 A/µs, VR = 160 V - 5.5 7.0 A Forward recovery time Tj = 25 °C IF = 8 A, dIF/dt = 50 A/µs, VFR = 1.1 x VFmax - 150 ns Forward recovery voltage Tj = 25 °C IF = 8 A, dIF/dt = 50 A/µs - 1.5 V Reverse recovery time DocID12362 Rev 3 3/17 Characteristics 1.1 STTH802 Characteristics (curves) Figure 2: Forward voltage drop versus forward current (typical values) Figure 1: Peak current versus duty cycle IM (A) 100 T IM 80 δ=tp/T d tp 60 P= 5W 40 P= 2W P= 1W 20 δ 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 3: Forward voltage drop versus forward current (maximum values) Figure 4: Relative variation of thermal impedance, junction to case, versus pulse duration Zth(j-c) /Rth(j-c) 1.0 Single pulse TO-220 AC DPAK D 2 PAK tp(s) 0.1 1.E-03 Figure 5: Relative variation of thermal impedance, junction to case, versus pulse duration 1.E-02 1.E-01 1.E+00 Figure 6: Junction capacitance versus reverse applied voltage (typical values) Zth(j-c) /Rth(j-c) C(pF) 100 1.0 Single pulse TO-220F PAC F=1MHz V osc=30mV RMS T j=25°C 0.1 VR(V) tp(s) 0.0 1.E-03 4/17 10 1.E-02 1.E-01 1.E+00 1.E+01 DocID12362 Rev 3 1 10 100 1000 STTH802 Characteristics Figure 7: Reverse recovery charges versus dIF/dt (typical values) Q rr (nC) 160 t rr (ns) 80 IF = 8 A VR = 160 V 140 Figure 8: Reverse recovery time versus dIF/dt (typical values) IF = 8 A VR = 160 V 70 120 60 100 50 Tj = 125 °C 80 40 60 30 40 20 Tj = 125 °C Tj = 25 °C Tj = 25 °C 20 10 dIF/dt (A/µs) dIF/dt (A/µs) 0 0 10 100 1000 10 100 Figure 9: Peak reverse recovery current versus dIF/dt (typical values) 12 1000 Figure 10: Relative variation of dynamic parameters versus junction temperature 1.4 IRM (A) IF = 8 A VR = 160 V IF = 8 A VR = 160 V Reference: Tj = 125 °C 1.2 10 1.0 8 IRM 0.8 Tj = 125 °C 6 0.6 4 Qrr 0.4 2 0.2 Tj = 25 °C Tj(°C) dIF/dt (A/µs) 0.0 0 10 100 25 1000 Figure 11: Thermal resistance, junction to ambient, versus copper surface under tab 75 100 125 150 Figure 12: Thermal resistance, junction to ambient, versus copper surface under tab R th (j-a) (°C/W ) Rth(j-a) (°C/W) 80 100 D²PAK 70 50 DPAK 90 Epoxy printed board FR4, copper thickness = 35 µm 80 60 70 50 60 40 50 30 40 30 20 Epoxy printed board FR4, e Cu= 35 µm 20 10 SCu(cm²) 10 0 SCu(cm²) 0 0 5 10 15 20 25 30 35 40 DocID12362 Rev 3 0 5 10 15 20 25 30 35 5/17 40 Package information 2 STTH802 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     6/17 Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N·m (for TO-220AC and TO-220FPAC) Maximum torque value: 0.7 N·m (for TO-220AC and TO-220FPAC) DocID12362 Rev 3 STTH802 2.1 Package information D²PAK package information Figure 13: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID12362 Rev 3 7/17 Package information STTH802 Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 8/17 Inches 0.4 typ. 0° 0.015 8° DocID12362 Rev 3 0° 8° STTH802 Package information Figure 14: D²PAK recommended footprint (dimensions in mm) DocID12362 Rev 3 9/17 Package information 2.2 STTH802 DPAK package information Figure 15: DPAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 10/17 DocID12362 Rev 3 STTH802 Package information Table 7: DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 16: DPAK recommended footprint (dimensions in mm) DocID12362 Rev 3 11/17 Package information 2.3 STTH802 TO-220AC package information Figure 17: TO-220AC package outline 12/17 DocID12362 Rev 3 STTH802 Package information Table 8: TO-220AC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M ØI 2.6 typ. 3.75 0.102 typ. 3.85 DocID12362 Rev 3 0.147 0.151 13/17 Package information 2.4 STTH802 TO-220FPAC package information Figure 18: TO-220FPAC package outline A B H Dia L6 L2 L7 L3 F1 D L4 F G1 G 14/17 DocID12362 Rev 3 E STTH802 Package information Table 9: TO-220FPAC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.50 2.70 0.098 0.106 D 2.50 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1.00 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.40 2.70 0.094 0.106 H 10.00 10.40 0.393 L2 16.00 typ. 0.409 0.630 typ. L3 28.60 30.60 0.126 1.205 L4 9.80 10.60 0.386 0.417 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 DocID12362 Rev 3 15/17 Ordering information 3 STTH802 Ordering information Table 10: Ordering information Order code Marking Weight Base qty Delivery mode STTH802D STTH802 TO-220AC 1.86g 50 Tube STTH802FP STTH802 TO-220FPAC 1.9g 50 Tube STTH802B-TR STTH 802 DPAK 0.32g 2500 Tape and reel STTH802 D2PAK 1.38g 50 Tube STTH802 D2PAK 1.38g 1000 Tape and reel STTH802G STTH802G-TR 4 Package Revision history Table 11: Document revision history Date Revision 03-may-2006 1 First issue. 22-Sep-2006 2 Added D2PAK package. 3 Updated features and image in cover page. Updated Section 1.1: "Characteristics (curves)". Updated Section 2: "Package information". Minor text changes. 07-Aug-2017 16/17 Changes DocID12362 Rev 3 STTH802 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID12362 Rev 3 17/17
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