STTH810DI

STTH810 Ultrafast recovery - high voltage diode Main product characteristics IF(AV) VRRM Tj VF (typ) trr (typ) 8A 1000 V 175° C 1.30 V 47 ns A K A K TO-220AC STTH810D K TO-220FPAC STTH810FP A Features and benefits ■ ■ ■ ■ ■ ■ Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature Insulated packages: – TO-220Ins – Electrical insulation = 2500 VRMS Capacitance = 7 pF – TO-220FPAC Electrical insulation = 2500 VRMS Capacitance = 12 pF K A NC K A D2PAK STTH810G TO-220Ins STTH810DI Description The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. Order codes Part Number STTH810D STTH810G STTH810G-TR STTH810FP STTH810DI Marking STTH810D STTH810G STTH810G STTH810FP STTH810DI March 2006 Rev 1 1/11 www.st.com 11 Characteristics STTH810 1 Table 1. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values at 25° C, unless otherwise specified) Parameter Repetitive peak reverse voltage TO-220AC / D PAK / TO-220FPAC RMS forward current TO-220AC Ins TO-220AC / D2PAK IF(AV) Average forward current, δ = 0.5 TO-220FPAC TO-220AC Ins IFRM IFSM Tstg Tj Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 130° C Tc = 75° C Tc = 105° C 100 60 -65 to + 175 175 A A °C °C 8 A 20 2 Value 1000 30 Unit V A tp = 5 µs, F = 5 kHz square tp = 10 ms Sinusoidal Table 2. Symbol Thermal parameters Parameter TO-220AC / D 2PAK Value 2.5 5.8 4.1 Unit Rth(j-c) Junction to case TO-220FPAC TO-220AC Ins °C/W Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ Max. 5 µA 2 20 2 IF = 8 A 1.4 1.3 1.8 1.7 V Unit VF (2) Forward voltage drop Tj = 100° C Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.3 x IF(AV) + 0.05 IF2(RMS) 2/11 STTH810 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C Reverse recovery current Softness factor Forward recovery time Forward recovery voltage IF = 8 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C IF = 8 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C dIF/dt = 50 A/µs IF = 8 A VFR = 1.5 x VFmax, Tj = 25° C IF = 8 A, dIF/dt = 50 A/µs, Tj = 25° C 5.5 Min. Typ 64 47 12 2 300 ns V Max. 85 ns 65 16 A Unit trr Reverse recovery time IRM S tfr VFP Figure 1. P(W) 18 Conduction losses versus average current =0.05 =0.1 =0.2 =0.5 =1 Figure 2. IFM(A) 80 70 60 50 Forward voltage drop versus forward current 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 T Tj=150°C (Maximum values) Tj=150°C (Typical values) Tj=25°C (Maximum values) 40 30 20 10 0 0.0 IF(AV)(A) VFM(V) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 Single pulse DO-220AB D²PAK Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse TO-220FPAB tp(s) 1.E-02 1.E-01 1.E+00 0.1 0.0 1.E-03 1.E-02 1.E-01 tp(s) 1.E+00 1.E+01 3/11 Characteristics STTH810 Figure 5. IRM(A) 25 VR=600V Tj=125°C Peak reverse recovery current versus dIF/dt (typical values) IF= 2 x IF(AV) Figure 6. trr(ns) 500 450 400 Reverse recovery time versus dIF/dt (typical values) VR=600V Tj=125°C IF= 2 x IF(AV) 20 IF= IF(AV) 350 300 IF= IF(AV ) 15 IF=0.5 x IF(AV) 250 200 150 10 5 100 IF=0.5 x IF(AV) dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 50 0 0 50 100 dIF/dt(A/µs) 150 200 250 300 350 400 450 500 Figure 7. Qrr(µC) 2.5 VR=600V Tj=125°C Reverse recovery charges versus dIF/dt (typical values) Figure 8. S factor 3.0 Softness factor versus dIF/dt (typical values) IF = 2 x IF(AV) VR=600V Tj=125°C IF= 2 x IF(AV) 2.0 2.5 IF= IF(AV) 1.5 2.0 1.0 IF=0.5 x IF(AV) 1.5 0.5 0.0 0 50 100 150 200 dIF/dt(A/µs) 250 300 350 400 450 500 dIF/dt(A/µs) 1.0 0 50 100 150 200 250 300 350 400 450 500 Figure 9. Relative variations of dynamic parameters versus junction temperature Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 45 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 25 QRR IRM Sfactor IF = IF(AV) VR=600V Reference: Tj=125°C 40 35 30 25 20 15 IF = IF(AV) Tj=125°C tRR 10 Tj(°C) 75 100 125 5 0 0 100 200 dIF/dt(A/µs) 300 400 500 50 4/11 STTH810 Characteristics Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus (typical values) reverse voltage applied (typical values) tfr(ns) 600 550 500 450 400 350 300 250 200 0 100 IF = IF(AV) VFR = 1.5 x V F max. Tj=125°C C(pF) 100 F=1MHz Vosc=30mVRMS Tj=25°C 10 dIF/dt(A/µs) 200 300 400 500 VR(V) 1 1 10 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 µm) Rth(j-a)(°C/W) 80 D²PAK 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 SCU(cm²) 5/11 Package information STTH810 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC, TC-220Ins, TO-220FPAC) Maximum torque value: 0.7 Nm (TO-220AC, TO-220Ins, TO-220FPAC) Table 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Min. A H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 M E 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 L4 L5 L6 L7 L9 M Diam. I G 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/11 STTH810 Table 6. T0-220Ins dimensions Package information DIMENSIONS REF Millimeters Min. A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 M 13.00 10.00 0.61 1.23 4.40 0.49 2.40 4.80 6.20 3.75 15.20 3.75 14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 5.40 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.189 0.244 0.147 Max. Min. Inches Max. 0.625 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.212 0.259 0.151 15.90 0.598 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 2.60 2.95 1.70 0.104 0.044 0.102 0.116 0.066 7/11 Package information Table 7. T0-220FPAC dimensions DIMENSIONS REF Millimeters Min. A A H B STTH810 Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D Dia L6 L2 L3 L5 F1 L4 D L7 E F F1 G G1 H L2 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L3 L4 L5 L6 L7 Dia. 8/11 STTH810 Table 8. D2PAK dimensions Package information DIMENSIONS REF. Millimeters Min. A A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D B2 C L L3 A1 B2 B G A2 2mm min. FLAT ZONE R C2 C D E G L V2 L2 L3 M R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 14. D2PAK footprint (all dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information STTH810 3 Ordering information Part Number STTH810D STTH810DI STTH810FP STTH810G STTH810G-TR Marking STTH810D STTH810DI STTH810FP STTH810G STTH810G Package TO-220AC TO-220Ins TO-220FPAC D2 D2 PAK PAK Weight 1.86 g 1.86 g 2.2 g 1.48 g 1.48 g Base qty 50 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tape & reel 4 Revision history Date 02-Mar-2006 Revision 1 First issue. Description of Changes 10/11 STTH810 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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