STTH812DI

STTH812 Ultrafast recovery - 1200 V diode Main product characteristics A IF(AV) 8A VRRM 1200 V Tj 175° C VF (typ) 1.25 V trr (typ) 50 ns Ultrafast, soft recovery ■ Very low conduction and switching losses ■ High frequency and/or high pulsed current operation ■ High reverse voltage capability ■ High junction temperature ■ Insulated packages: – TO-220Ins Electrical insulation = 2500 VRMS Capacitance = 7 pF – TO-220FPAC Electrical insulation = 2000 VRMS Capacitance = 12 pF A A K K TO-220FPAC STTH812FP TO-220AC STTH812D Features and benefits ■ K K A A NC D2PAK STTH812G K TO-220Ins STTH812DI Order codes Part Number Marking Description STTH812D STTH812D The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. STTH812G STTH812G STTH812G-TR STTH812G STTH812FP STTH812FP STTH812DI STTH812DI Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. March 2006 Rev 1 1/11 www.st.com 11 Characteristics STTH812 1 Characteristics Table 1. Absolute ratings (limiting values at 25° C, unless otherwise specified) Symbol VRRM Parameter Repetitive peak reverse voltage Value Unit 1200 V 2 IF(RMS) IF(AV) TO-220AC / D PAK / TO-220FPAC 30 TO-220AC Ins 20 A RMS forward current Average forward current, δ = 0.5 TO-220AC / D2PAK Tc = 140° C TO-220FPAC Tc = 75° C TO-220AC Ins Tc = 115° C 8 A IFRM Repetitive peak forward current tp = 5 µs, F = 5 kHz square 100 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 80 A Tstg Storage temperature range -65 to + 175 °C 175 °C Tj Table 2. Maximum operating junction temperature Thermal parameters Symbol Parameter Value 2PAK Rth(j-c) Table 3. Symbol IR(1) Junction to case TO-220AC / D 1.9 TO-220FPAC 5.4 TO-220AC Ins 3.1 VF Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Min. Typ Forward voltage drop Tj = 125° C Max. Unit 8 VR = VRRM µA 5 50 2.2 IF = 8 A Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.5 x IF(AV) + 0.05 IF2(RMS) 2/11 °C/W Static electrical characteristics Tj = 25° C (2) Unit 1.30 2.0 1.25 1.9 V STTH812 Characteristics Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Min. Typ IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C Reverse recovery time Max. Unit 100 ns IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C 50 70 Reverse recovery current IF = 8 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C 14 21 A S Softness factor IF = 8 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C 2 tfr Forward recovery time dIF/dt = 50 A/µs IF = 8 A VFR = 1.5 x VFmax, Tj = 25° C 400 ns Forward recovery voltage IF = 8 A, dIF/dt = 50 A/µs, Tj = 25° C IRM VFP Figure 1. Conduction losses versus average current Figure 2. P(W) 7 V Forward voltage drop versus forward current IFM(A) 20 δ = 0.05 18 δ = 0.1 80 δ = 0.2 δ = 0.5 70 Tj=150°C (typical values) 16 60 δ=1 14 50 12 10 40 8 Tj=25°C (maximum values) 30 Tj=150°C (maximum values) 6 20 T 4 10 2 IF(AV)(A) δ=tp/T VFM(V) tp 0 0 0 1 Figure 3. 2 3 4 5 6 7 8 9 10 Relative variation of thermal impedance junction to case versus pulse duration 0.0 Figure 4. 0.8 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.5 Single pulse TO-220AC D2PAK TO-220Ins 0.9 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 tp(s) 0.0 1.E-03 Single pulse TO-220FPAC tp(s) 0.0 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 3/11 Characteristics Figure 5. STTH812 Peak reverse recovery current versus dIF/dt (typical values) Figure 6. trr(ns) IRM(A) 500 35 VR=600V Tj=125°C 30 Reverse recovery time versus dIF/dt (typical values) 450 VR=600V Tj=125°C IF=2 x IF(AV) IF=2 x IF(AV) 400 25 350 IF=IF(AV) IF=0.5 x IF(AV) 20 IF=IF(AV) IF=0.5 x IF(AV) 300 250 15 200 10 150 100 5 50 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0 0 50 Figure 7. 100 150 200 250 300 350 400 450 500 Reverse recovery charges versus dIF/dt (typical values) 0 50 Figure 8. 100 150 200 250 300 350 400 450 500 Softness factor versus dIF/dt (typical values) S factor Qrr(µC) 4.0 3.0 IF ≤ 2xIF(AV) VR=600V Tj=125°C VR=600V Tj=125°C 3.5 2.5 IF=2 x IF(AV) 3.0 2.0 2.5 IF=IF(AV) 1.5 IF=0.5 x IF(AV) 2.0 1.0 1.5 0.5 1.0 dIF/dt(A/µs) dIF/dt(A/µs) 0.5 0.0 0 50 Figure 9. 100 150 200 250 300 350 400 450 0 500 Relative variations of dynamic parameters versus junction temperature 50 100 150 200 250 300 350 400 450 500 Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 2.25 45 IF=IF(AV) VR=600V Reference: Tj=125°C 2.00 1.75 IF=IF(AV) Tj=125°C 40 35 S factor 1.50 30 1.25 25 1.00 20 trr 0.75 IRM 15 0.50 10 QRR 0.25 Tj(°C) 5 dIF/dt(A/µs) 0.00 25 50 75 100 125 0 0 4/11 100 200 300 400 500 STTH812 Characteristics Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus (typical values) reverse voltage applied (typical values) C(pF) tfr(ns) 1000 700 F=1MHz VOSC=30mVRMS Tj=25°C IF=IF(AV) VFR=1.5 x VF max. Tj=125°C 600 100 500 400 10 300 dIF/dt(A/µs) VR(V) 1 200 0 100 200 300 400 500 1 10 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 µm) Rth(j-a)(°C/W) 80 70 60 50 40 30 20 10 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 5/11 Package mechanical data 2 STTH812 Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Maximum torque value: 0.7 Nm (TO-220AC) Table 5. T0-220AC dimensions DIMENSIONS REF. A H2 ØI C Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L5 L7 L6 L2 F1 D L9 L2 L4 F M E G 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 6/11 16.40 typ. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STTH812 Package mechanical data Table 6. T0-220Ins dimensions DIMENSIONS REF A b2 L F A I4 c2 a1 l2 Inches Min. Max. Min. Max. 15.20 15.90 0.598 0.625 a1 C B ØI Millimeters 3.75 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 a2 M b1 e c1 M 2.60 0.102 7/11 Package mechanical data Table 7. STTH812 T0-220FPAC dimensions DIMENSIONS REF A B H Dia L6 L2 L7 L3 L5 F1 D F E Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 L4 Millimeters 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 G1 G 8/11 STTH812 Package mechanical data D2PAK dimensions Table 8. DIMENSIONS REF. Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 0.016 typ. 8° 0° 8° Figure 14. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information 3 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH812D STTH812D TO-220AC 1.86 g 50 Tube STTH812DI STTH812DI TO-220Ins 1.86 g 50 Tube STTH812FP STTH812FP TO-220FPAC 2.2 g 50 Tube STTH812G STTH812G-TR 4 10/11 STTH812 STTH812G D2 PAK 1.48 g 50 Tube STTH812G D2 PAK 1.48 g 1000 Tape & reel Revision history Date Revision 02-Mar-2006 1 Description of Changes First issue. STTH812 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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