T835T-8G
Datasheet
8 A 800 V D2PAK Snubberless™ Triac
Features
A2
G
•
•
•
•
•
High static dV/dt
High dynamic turn-off commutation (dl/dt)c
150 °C maximum junction temperature
Three quadrants
Surge capability VDSM, VRSM = 900 V
D²PAK
•
Benefits:
–
High immunity to false turn-on thanks to high static dV/dt
–
Better turn-off in high temperature environments thanks to (dI/dt)c
–
Increase of thermal margin due to extended working Tj up to 150 °C
A2
A1
A2
A2: Anode2
–
A1: Anode1
G: Gate
G
A1
Good thermal resistance due to non-insulated tab.
Applications
•
•
•
•
•
•
•
General purpose AC line load switching
Motor control circuits
Home appliances
Heating
Lighting
Inrush current limiting circuits
Overvoltage crowbar protection
Product status link
Description
T835T-8G
IT(RMS)
8A
VDRM/VRRM
800 V
Available in SMD, the T835T-8G Triac can be used for the on/off or phase angle
control function in general purpose AC switching where high commutation capability
is required. The T835T-8G can be used without a snubber RC circuit when the limits
defined are respected.
VDSM/VRSM
900 V
D2PAK package is UL-94,V0 flammability resin compliance.
IGT
35 mA
Package environmentally friendly Ecopack®2 graded (RoHS and Halogen Free
compliance).
Product summary
Snubberless™ is a trademark of STMicroelectronics.
DS12531 - Rev 3 - July 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
T835T-8G
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings (limiting values)
Symbol
IT(RMS)
ITSM
I2t
dl/dt
Parameter
8
Non repetitive surge peak on-state current (full cycle, Tj initial
= 25 °C
t = 16.7 ms
63
t = 20 ms
60
I2t value for fusing
tp = 10 ms
24
A2s
Critical rate of rise of on-state current, IG = 2 x IGT, tr ≤ 100 ns
Tj initial = 150 °C, f = 100 Hz
100
A/µs
Tj = 125 °C
800
V
Tj = 150 °C
600
V
tp = 10 ms, Tj = 25 °C
900
V
4
A
5
V
1
W
Storage junction temperature range
-40 to +150
°C
Operating junction temperature range
-40 to +150
°C
IGM
Peak gate current
VGM
Peak Gate Voltage
Tj
A
Tc = 128 °C
VDSM/VRSM Non Repetitive peak off-state voltage
Tstg
Unit
RMS on-state current (full sine wave)
VDRM/VRRM Repetitive peak off-state voltage (50-60 Hz)
PG(AV)
Value
tp = 20 µs, Tj = 150 °C
Tj = 150 °C
Average gate power dissipation
A
Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)
Symbol
Quadrants; Tj
Test conditions
Value
Unit
VD = 12 V, RL = 30 Ω
I - II - III
Min.
1.75
mA
VD = 12 V, RL = 30 Ω
I - II - III
Max.
35
mA
VGT
VD = 12 V, RL = 33 Ω
I - II - III
Max.
1.3
V
VGD
VD = 600 V, RL = 3.3 kΩ
I - II - III
Min.
0.2
V
IG = 1.2 x IGT
I - III
Max.
60
mA
IG = 1.2 x IGT
II
Max.
70
mA
Max.
40
mA
IGT
IL
IH
(1)
dV/dt (1)
(dl/dt)c (1)
Tj = 150 °C
IT = 500 mA, gate open
VD = 536 V, gate open
Tj = 125 °C
Min.
2000
V/µs
VD = 402 V, gate open
Tj = 150 °C
Min.
1000
V/µs
Tj = 125 °C
Min.
8
A/ms
Tj = 150 °C
Min.
4
A/ms
Without snubber, (dV/dt)c > 20 V/µs
1. For both polarities of A2 referenced to A1.
DS12531 - Rev 3
page 2/11
T835T-8G
Characteristics
Table 3. Static characteristics
Symbol
(1)
Tj
Test conditions
Value
Unit
IT = 11.3 A, tp = 380 µs
25 °C
Max.
1.6
V
VTO(1)
Threshold on-state voltage
150 °C
Max.
0.87
V
RD(1)
Dynamic resistance
150 °C
Max.
80
mΩ
5
µA
1.0
mA
2.5
mA
VTM
IDRM/IRRM
25 °C
VDRM = VRRM = 800 V
Max.
125°C
VDRM = VRRM = 600 V
150 °C
Max.
1. For both polarities of A2 referenced to A1.
Table 4. Thermal resistance
Symbol
Rth(j-c)
DS12531 - Rev 3
Parameter
Junction to case (AC)
D²PAK
Max.
Value
Unit
1.9
°C/W
page 3/11
T835T-8G
Characteristics (curves)
1.2
Characteristics (curves)
Figure 1. Maximum power dissipation versus on-state
RMS current
Figure 2. On-state RMS current versus case temperature
IT(RMS)(A)
P(W)
9
12
8
α = 180°
α = 180°
7
10
6
8
5
4
6
3
2
4
0
IT(RMS)(A)
0
0
0
1
2
3
4
Tc(°C)
1
180°
2
5
6
7
25
50
75
100
125
150
8
Figure 3. On-state RMS current versus ambient
temperature (free air convection)
Figure 4. Relative variation of thermal impedance versus
pulse duration
IT(RMS)(A)
K = [Zth/Rth]
1.0E+00
3.5
α = 180°
Zth(j-c)
3.0
2.5
2.0
1.5
1.0
0.5
Ta(°C)
tp(s)
0.0
0
25
50
75
100
125
150
1.0E-01
1.0E-03
Figure 5. Relative variation of gate trigger voltage and
current versus junction temperature (typical values)
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Figure 6. Relative variation of holding current and
latching current versus junction temperature (typical
values)
IGT,VGT[Tj] / IGT,VGT[Tj = 25 °C]
IH,IL [Tj] / IH,IL [Tj = 25 °C]
3.0
2.0
2.5
IGT Q3
1.5
2.0
IGT Q1-Q2
1.5
1.0
1.0
IL
VGT Q1-Q2-Q3
0.5
0.5
Tj (°C)
-50
-25
0
25
50
75
100
125
150
0.0
-50
DS12531 - Rev 3
IH
Tj (°C)
0.0
-25
0
25
50
75
100
125
150
page 4/11
T835T-8G
Characteristics (curves)
Figure 7. Surge peak on-state current versus number of
cycles
Figure 8. Non repetitive surge peak on-state current for a
sinusoidal pulse with width tp < 10 ms
ITSM(A)
ITSM(A)
1000
70
Tj initial=25°C
60
t=20ms
50
dI/dt limitation:
100A/µs
One cy cle
Non repetitive
Tj initial = 25 °C
40
ITSM
100
30
Repetitive
Tc = 128°C
20
10
t p (ms)
Number of cycles
0
1
10
10
100
1000
Figure 9. On-state characteristics (maximum values)
0.01
0.10
1.00
10.00
Figure 10. Relative variation of critical rate of decrease of
main current versus junction temperature
ITM(A)
100
(dl/dt)c [Tj] / (dl/dt)c [Tj = 150 °C]
Tj max.
Vto = 0.87 V
Rd = 80 mΩ
Tj = 25 °C
10
Tj = 150 °C
VTM(V)
1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Tj(°C)
25
Figure 11. Relative variation of static dV/dt immunity
versus junction temperature
dV/dt [Tj] / dV/dt [Tj = 150 °C]
50
75
100
125
150
Figure 12. Relative variation of leakage current versus
junction temperature for different values of blocking
voltage
IDRM/IRRM [Tj, VDRM/VRRM] / IDRM/IRRM [Tj max.,VDRM/VRRM]*
6
1.0E+00
VD = VR = 402 V
5
4
1.0E-01
*[Tj max = 125 °C; VDRM, VRRM = 800 V]
[Tj max = 150 °C; VDRM, VRRM = 600 V]
VDRM = VRRM = 800 V
3
VDRM = VRRM = 600 V
2
1.0E-02
1
Tj(°C)
0
25
DS12531 - Rev 3
50
75
100
125
150
1.0E-03
25
Tj(°C)
50
75
100
125
150
page 5/11
T835T-8G
Ordering information
2
Ordering information
Figure 13. Ordering information scheme
T
8
35
T -
8
G
TR
SnubberlessTM TRIAC
T = Triac
Current (RMS) / Type
8=8A
Gate Current
35 = 35 mA
Specific application
T = increased (dl/dt) and dV/dt producing reduced ITSM
Voltage
8 = 800 V
Package
G = D²PAK
Packing
Blank = Tube
TR = Tape and reel
Table 5. Ordering information
Order code
T835T-8G-TR
T835T-8G
DS12531 - Rev 3
Marking
Package
Weight
T835T-8G
D²PAK
1.38 g
Base qty.
Delivery mode
1000
Tape and reel
50
Tube
page 6/11
T835T-8G
Package information
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
3.1
D²PAK package information
•
•
•
ECOPACK2® compliant
Lead-free package leads finishing
Molding compound resin is halogen-free and meets UL standard level V0
Figure 14. D²PAK package outline
A
E
E1
E2
H
D
D1
L2
c2
2
3
D2
L3
1
b2
b
e
Max resin gate protrusion: 0.5 mm (1)
G
A1
A2
A3
L
R
Gauge Plane
V2
c
(1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.
DS12531 - Rev 3
page 7/11
T835T-8G
D²PAK package information
Table 6. D²PAK package mechanical data
Dimensions
Ref.
Inches(1)
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.30
4.60
0.1693
0.1811
A1
2.49
2.69
0.0980
0.1059
A2
0.03
0.23
0.0012
A3
0.25
0.0091
0.0098
b
0.70
0.93
0.0276
0.0366
b2
1.25
1.7
0.0492
0.0669
c
0.45
0.60
0.0177
0.0236
c2
1.21
1.36
0.0476
0.0535
D
8.95
9.35
0.3524
0.3681
D1
7.50
8.00
0.2953
0.3150
D2
1.30
1.70
0.0512
0.0669
e
2.54
0.1
E
10.00
10.28
0.3937
0.4047
E1
8.30
8.70
0.3268
0.3425
E2
6.85
7.25
0.2697
0.2854
G
4.88
5.28
0.1921
0.2079
H
15
15.85
0.5906
0.6240
L
1.78
2.28
0.0701
0.0898
L2
1.27
1.40
0.0500
0.0551
L3
1.40
1.75
0.0551
0.0689
R
V2(2)
0.40
0°
0.0157
8°
0°
8°
1. Dimensions in inches are given for reference only
2. Degrees
DS12531 - Rev 3
page 8/11
T835T-8G
D²PAK package information
Figure 15. D²PAK recommended footprint (dimensions are in mm)
16.90
10.30
5.08
1.30
8.90
3.70
Figure 16. D²PAK stencil definitions(dimensions are in mm)
DS12531 - Rev 3
page 9/11
T835T-8G
Revision history
Table 7. Document revision history
DS12531 - Rev 3
Date
Version
Changes
30-Mar-2018
1
Initial release.
6-Jun-2018
2
Updated cover page description.
17-Jul-2018
3
Updated Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise
specified).
page 10/11
T835T-8G
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS12531 - Rev 3
page 11/11
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