USBULC6-2M6

USBULC6-2M6 Ultra large bandwidth ESD protection Features ■ 2 data line 15 kV ESD protection ■ Protects 5 V VBUS when applicable ■ Ultra low capacitance: 0.65 pF at F = 240 MHz ■ Very low leakage current: 0.5 µA max. ■ Fast response time compared with varistors ■ µQFN 6 lead package ■ RoHS compliant Benefits µQFN (pin view) Figure 1. Functional diagram (top view) ■ ESD protection of VBUS (when applicable) ■ High bandwidth to minimize impact on data signal quality ■ Low PCB space occupation Low leakage current profides longer operation of battery powered devices ■ Higher reliability offered by monolithic integration ■ Complies with these standards: ■ IEC 61000-4-2 level 4 – 15 kV air discharge – 8 kV contact discharge Applications ■ USB 2.0 ports including Hi-Speed USB ports up to 480 Mb/s as well as full and low speed USB ports ■ Ethernet port: 10/100/1000 Mb/s ■ Video line protection ■ Portable electronics November 2007 Description The USBULC6-2M6 is a monolithic, application specific discrete device dedicated to ESD protection of high speed interfaces. Its ultra low line capacitance provides high bandwidth and secures a high level of signal integrity without compromizing the protection of downstream sensitive chips against the most stringent characterized ESD strikes. Rev 1 1/10 www.st.com Characteristics 1 USBULC6-2M6 Characteristics Table 1. Absolute ratings Symbol Parameter VPP Peak pulse voltage Tstg Storage temperature range Value Unit ±15 ±15 ±25 kV -55 to +150 °C IEC 61000-4-2 air discharge IEC 61000-4-2 contact discharge MIL STD883G-Method 3015-7 Tj Maximum junction temperature 150 °C TL Lead solder temperature (10 seconds duration) 260 °C Table 2. Electrical characteristics (Tamb = 25 °C) Value Symbol Parameter Test conditions Unit Min. IRM Leakage current VRM = 5 V VBR Breakdown voltage between VBUS and GND IR = 1 mA VCL Ci/o-GND ΔCi/o-GND Ci/o-i/o 2/10 Typ. Max 0.5 6 µA V IPP = 1 A, tp = 8/20 µs Any I/O pin to GND 12 V IPP = 5 A, tp = 8/20 µs Any I/O pin to GND 17 V Clamping voltage VR = 0 V, F = 1 MHz Any I/O pin to ground 0.95 1.1 VR = 0 V, F = 240 MHz Any I/O pin to ground 0.65 0.85 VR = 0 V, F = 1 MHz Any I/O pin to ground 0.020 VR = 0 V, F = 1 MHz Ground not connected 0.5 0.55 VR = 0 V, F = 240 MHz Ground not connected 0.35 0.4 Capacitance between I/O and GND Capacitance variation between I/O and GND pF Capacitance between I/O USBULC6-2M6 Figure 2. Characteristics Line capacitance versus frequency Figure 3. (typical values) C(fF) Relative variation of leakage current versus junction temperature (typical values) IRM[Tj] / IRM[Tj=25°C] 1000.0 5 900.0 4 800.0 700.0 3 I/O - GND 600.0 500.0 400.0 2 I/O – I/O 300.0 200.0 100.0 F(GHz) Tj(°C) 0.0 0 1 Figure 4. 2 3 Attenuation measurement 1 25 50 Figure 5. 75 100 125 Crosstalk measurements dB S21(db) 0.00 0.00 - 4.00 - 30.00 - 8.00 - 60.00 - 12.00 - 90.00 F(Hz) F (Hz) - 16.00 - 120.00 300.0k Figure 6. 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G Remaing voltage on I/O1 after the USBULC6-2M6 during positive ESD surge (15 kV Air) 300.0k Figure 7. 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G Remaing voltage on I/O2 after the USBULC6-2M6 during negative ESD surge (15 kV Air) 10V/Div 10V/Div 100ns/Div 100ns/Div 3/10 Characteristics Figure 8. USBULC6-2M6 Remaing voltage on VBUS after the USBULC6-2M6 during positive ESD surge (15 kV Air) 10V/Div Figure 9. Remaing voltage on VBUS after the USBULC6-2M6 during negative ESD surge (15 kV Air) 10V/Div 100ns/Div 100ns/Div Figure 10. Eye diagram PCB only 400 mV amplitude, F = 480 Mbps Figure 11. Eye diagram PCB + USBULC6-2M6 400 mV amplitude, F = 480 Mbps Horiz: 350 ps/div Vert: 100 mV/div Horiz: 350 ps/div Vert: 100 mV/div Figure 12. Eye diagram PCB + USBULC6-2M6, +5 V on VBUS decoupling capacitor 100 nF, 400 mV amplitude, F = 480 Mbps Horiz: 350 ps/div Vert: 100 mV/div 4/10 USBULC6-2M6 2 Application example Application example Figure 13. One differential line D+ I/O1 To GND plane I/O2 1 6 2 5 3 4 I/O1 100 nF I/O2 D- 3 Ordering information scheme Figure 14. Ordering information scheme USB ULC 6 - 2 M6 Product Designation Ultra low capacitance Breakdown Voltage 6 = 6 Volts Number of lines protected 2 = 2 lines Package µQFN - 6 leads 5/10 Package information 4 USBULC6-2M6 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are Lead-free. The category of second level Interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 3. Micro QFN 1.45x1.00 6L dimensions Dimensions D Ref. N E 1 2 A A1 1 Millimeters Inches Min. Typ. Max. Min. Typ. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 D(1) 1.45 0.057 L E(1) 1.00 0.039 k (2) 0.50 0.020 2 e b e K 0.20 L 0.30 Max. 0.008 0.35 0.40 0.012 0.014 0.016 1. ± 0.1 mm 2. ± 0.05 mm Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 15. Footprint dimensions in mm [inches] 0.50 [0.020] 0.25 [0.010] 0.65 [0.026] 0.30 1.60 [0.012] [0.063] 6/10 USBULC6-2M6 Recommendation on PCB assembly 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness) Figure 16. Stencil opening dimensions. L T b) W General Design Rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. 5.2 Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. 7/10 Recommendation on PCB assembly 5.3 5.4 5.5 USBULC6-2M6 Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 17. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 8/10 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. USBULC6-2M6 6 Ordering information Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode USBULC6-2M6 T(1) µQFN 2.2 mg 3000 Tape and reel 1. The marking can be rotated by 90° to diferentiate assembly location 7 Revision history Table 5. Document revision history Date Revision 29-Nov-2007 1 Description of changes First issue 9/10 USBULC6-2M6 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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