USBULC6-2P6

USBULC6-2P6 Ultra large bandwidth ESD protection Datasheet - production data Complies with the following standards • IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) SOT-666 USBULC6-2P6 Applications • USB 2.0 ports including high speed USB ports • Up to 480 Mb/s as well as full and low speed USB ports Figure 1. Functional diagram • Ethernet port: 10/100/1000 Mb/s • Video line protection I/O1 1 1 6 I/O1 GND 2 5 VBUS I/O2 3 4 I/O2 • Portable electronics Description The USBULC6-2P6 is a monolithic application specific device dedicated to ESD protection of high speed interfaces. Features • 2 data line 15 kV ESD protection (air and contact discharge) • Protects 5 V VBUS when applicable The ultra low line capacitance provides high bandwidth and secures a high level of signal integrity without compromising the protection of downstream sensitive chips against the most stringently characterized ESD strikes. • Ultra low capacitance • Very low leakage current: 0.5 µA max. • Fast response time compared with varistors • SOT-666 package • RoHS compliant Benefits • ESD protection of VBUS when applicable • High bandwidth to minimize impact on data signal quality • Low PCB space occupation • Low leakage current for longer operation of battery powered devices • High reliability offered by monolithic integration March 2014 This is information on a product in full production. DocID026154 Rev 1 1/8 www.st.com Characteristics 1 USBULC6-2P6 Characteristics Table 1. Absolute ratings Symbol Parameter IEC 61000-4-2 air discharge IEC 61000-4-2 contact discharge MIL STD883G-Method 3015-7 VPP Peak pulse voltage Tstg Storage temperature range Value Unit ±15 ±15 ±25 kV -55 to +150 °C Tj Maximum junction temperature +125 °C TL Lead solder temperature (10 seconds duration) 260 °C Table 2. Electrical characteristics (Tamb = 25 °C) Value Symbol Parameter Test conditions Unit Min. IRM Leakage current VBR Breakdown voltage between VBUS IR = 1 mA and GND VCL Ci/o-GND Typ. VRM = 5 V Max. 0.5 6 µA V IPP = 1 A, 8/20 µs Any I/O pin to GND 12 V IPP = 5 A, 8/20 µs Any I/O pin to GND 17 V Clamping voltage Capacitance between I/O and GND VR = 0 V, F = 1 MHz Any I/O pin to ground 1.0 1.2 VR = 0 V, F = 240 MHz Any I/O pin to ground 0.7 0.85 pF Capacitance variation between I/O VR = 0 V, F = 1 MHz ΔCi/o-GND and GND Any I/O pin to ground Ci/o-i/o 2/8 0.02 VR = 0 V, F = 1 MHz Ground not connected 0.47 0.55 VR = 0 V, F = 240 MHz Ground not connected 0.45 0.55 Capacitance between I/O DocID026154 Rev 1 USBULC6-2P6 Characteristics Figure 2. Relative variation of leakage current versus junction temperature (typical values) Figure 3. Typical frequency response IRM[Tj] / IRM[Tj=25°C] 0.00 S21(db) 5 Fc=5.3GHz 4 -4.00 3 -8.00 2 -12.00 F(Hz) Tj(°C) 1 25 50 75 100 125 Figure 4. Crosstalk measurement -16.00 300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G Figure 5. Line capacitance versus frequency (typical values) dB 0.00 C(pF) 1.0 Vosc=30mVrms Tj = 25 °C VI-O/GND = 0V VBUS OPEN 0.9 -30.00 0.8 0.7 C I/O - GND 0.6 -60.00 0.5 0.4 0.3 -90.00 C I/O – I/O 0.2 0.1 1 - 120.00 300.0k F(MHz) 0.0 F (Hz) 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 10 100 1000 10000 3.0G Figure 6. Remaining voltage on I/O1 after USBULC-2P6 during positive ESD surge (+15 kV air discharge) Figure 7. Remaining voltage on I/O2 after USBULC-2P6 during negative ESD surge (-15 kV air discharge) 10 V/div 10 V/div 100 ns/div DocID026154 Rev 1 100 ns/div 3/8 8 Characteristics USBULC6-2P6 Figure 8. Remaining voltage on VBUS after USBULC-2P6 during positive ESD surge (+15 kV air discharge) Figure 9. Remaining voltage on VBUS after USBULC-2P6 during negative ESD surge (-15 kV air discharge) 10 V/div 10 V/div 100 ns/div 100 ns/div Figure 10. Eye diagram PCB only, 400 mV amplitude, F = 480 Mbps Figure 11. Eye diagram PCB + USBULC6-2P6, 400 mV amplitude, F = 480 Mbps Horiz. 350 ps/div Vert. 200 mV/div Horiz. 350 ps/div Vert. 200 mV/div Figure 12. Eye diagram PCB + USBULC6-2P6, +5 V on VBUS, decoupling capacitor 100 nF, 400 mV amplitude, F = 480 Mbps Horiz. 350 ps/div Vert. 200 mV/div 4/8 DocID026154 Rev 1 USBULC6-2P6 2 Ordering information scheme Ordering information scheme Figure 13. Ordering information scheme USB ULC 6 - 2 P6 Product designation Ultra low capacitance Breakdown voltage 6 = 6 Volts Number of lines protected 2 = 2 lines Package P6 = SOT-666 DocID026154 Rev 1 5/8 8 Package information 3 USBULC6-2P6 Package information • Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 3. SOT-666 dimensions Dimensions b1 L1 Ref. Millimeters Min. D A3 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 0.27 0.34 0.007 0.011 0.013 e 0.50 0.020 L1 0.19 0.007 L3 Figure 14. SOT-666 footprint 0.10 0.30 0.004 0.10 2.60 0.99 0.30 6/8 DocID026154 Rev 1 0.012 0.004 Figure 15. SOT-666 marking 0.50 0.62 Max. 0.024 L2 e Typ. 0.60 0.018 A L2 Min. 0.45 E1 E Max. A L3 b Typ. Inches R USBULC6-2P6 4 Ordering information Ordering information Table 4. Ordering information 5 Ordering code Marking Package Weight Base qty Delivery mode USBULC6-2P6 R SOT-666 2.9 mg 3000 Tape and reel Revision history Table 5. Document revision history Date Revision 31-Mar-2014 1 Description of changes First issue. 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