VNP14N04-E

VNP14N04 "OMNIFET": FULLY AUTOPROTECTED POWER MOSFET TYPE VNP14N04 ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ V clamp R DS(on) I lim 42 V 0.07 Ω 14 A LINEAR CURRENT LIMITATION THERMAL SHUT DOWN SHORT CIRCUIT PROTECTION INTEGRATED CLAMP LOW CURRENT DRAWN FROM INPUT PIN DIAGNOSTIC FEEDBACK THROUGH INPUT PIN ESD PROTECTION DIRECT ACCESS TO THE GATE OF THE POWER MOSFET (ANALOG DRIVING) COMPATIBLE WITH STANDARD POWER MOSFET STANDARD TO-220 PACKAGE DESCRIPTION The VNP14N04 is a monolithic device made using SGS-THOMSON Vertical Intelligent Power M0 Technology, intended for replacement of standard power MOSFETS in DC to 50 KHz applications. Built-in thermal shut-down, linear 3 1 2 TO-220 current limitation and overvoltage clamp protect the chip in harsh enviroments. Fault feedback can be detected by monitoring the voltage at the input pin. BLOCK DIAGRAM April 1996 1/11 VNP14N04 ABSOLUTE MAXIMUM RATING Symbol Parameter Value Unit Internally Clamped V Input Voltage 18 V ID Drain Current Internally Limited A IR Reverse DC Output Current -14 A 2000 V V DS Drain-source Voltage (V in = 0) V in V esd Ptot Tj Tc T stg Electrostatic Discharge (C= 100 pF, R=1.5 KΩ) o Total Dissipation at T c = 25 C 50 Operating Junction Temperature Case Operating Temperature W Internally Limited o C Internally Limited o C -55 to 150 o C Storage Temperature THERMAL DATA R thj-case R thj-amb Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max Max o 2.5 62.5 o C/W C/W ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) OFF Symbol Parameter Test Conditions V CLAMP Drain-source Clamp Voltage I D = 200 mA V CLTH Drain-source Clamp Threshold Voltage I D = 2 mA V INCL Input-Source Reverse Clamp Voltage I in = -1 mA I DSS Zero Input Voltage Drain Current (V in = 0) V DS = 13 V V DS = 25 V II SS Supply Current from Input Pin V DS = 0 V V in = 0 V in = 0 Min. Typ. Max. Unit 36 42 48 V 35 V -1 -0.3 V 50 200 µA µA 250 500 µA Typ. Max. Unit 3 V 0.07 0.1 Ω Ω Max. Unit V in = 0 V in = 0 V in = 10 V ON (∗) Symbol Parameter Test Conditions Min. I D + Ii n = 1 mA 0.8 V IN(th) Input Threshold Voltage V DS = Vin R DS(on) Static Drain-source On Resistance V in = 10 V I D = 7 A V in = 5 V ID = 7 A DYNAMIC Symbol g fs (∗) C oss 2/11 Parameter Test Conditions Forward Transconductance V DS = 13 V ID = 7 A Output Capacitance V DS = 13 V f = 1 MHz V in = 0 Min. Typ. 8 10 400 S 500 pF VNP14N04 ELECTRICAL CHARACTERISTICS (continued) SWITCHING (∗∗) Symbol Parameter Test Conditions Min. Typ. Max. Unit t d(on) tr t d(off) tf Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time V DD = 15 V V gen = 10 V (see figure 3) Id = 7 A R gen = 10 Ω 60 160 250 100 120 300 400 200 ns ns ns ns t d(on) tr t d(off) tf Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time V DD = 15 V V gen = 10 V (see figure 3) Id = 7 A R gen = 1000 Ω 300 1.5 5.5 1.8 500 2.2 7.5 2.5 ns µs µs µs Turn-on Current Slope V DD = 15 V V in = 10 V Total Input Charge V DD = 12 V (di/dt) on Qi ID = 7 A R gen = 10 Ω ID = 7 A Vin = 10 V 120 A/µs 30 nC SOURCE DRAIN DIODE Symbol Parameter Test Conditions V SD (∗) Forward On Voltage I SD = 7 A t rr (∗∗) Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current I SD = 7 A di/dt = 100 A/µs V DD = 30 V T j = 25 o C (see test circuit, figure 5) Q rr (∗∗) I RRM (∗∗) Min. Typ. V in = 0 Max. Unit 1.6 V 110 ns 0.34 µC 6.1 A PROTECTION Symbol Parameter Test Conditions Min. Typ. Max. Unit V DS = 13 V V DS = 13 V 10 10 14 14 20 20 A A 30 80 60 150 µs µs Drain Current Limit V in = 10 V V in = 5 V t dlim (∗∗) Step Response Current Limit V in = 10 V V in = 5 V T jsh (∗∗) Overtemperature Shutdown 150 o C T jrs (∗∗) Overtemperature Reset 135 o C I gf (∗∗) Fault Sink Current V in = 10 V V in = 5 V E as (∗∗) Single Pulse Avalanche Energy starting T j = 25 o C V DD = 20 V V in = 10 V R gen = 1 KΩ L = 10 mH I lim V DS = 13 V V DS = 13 V 50 20 0.65 mA mA J (∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (∗∗) Parameters guaranteed by design/characterization 3/11 VNP14N04 PROTECTION FEATURES During normal operation, the Input pin is electrically connected to the gate of the internal power MOSFET. The device then behaves like a standard power MOSFET and can be used as a switch from DC to 50 KHz. The only difference from the user’s standpoint is that a small DC current (Iiss) flows into the Input pin in order to supply the internal circuitry. The device integrates: - OVERVOLTAGE CLAMP PROTECTION: internally set at 42V, along with the rugged avalanche characteristics of the Power MOSFET stage give this device unrivalled ruggedness and energy handling capability. This feature is mainly important when driving inductive loads. - LINEAR CURRENT LIMITER CIRCUIT: limits the drain current Id to Ilim whatever the Input pin voltage. When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the overtemperature threshold Tjsh. 4/11 - OVERTEMPERATURE AND SHORT CIRCUIT PROTECTION: these are based on sensing the chip temperature and are not dependent on the input voltage. The location of the sensing element on the chip in the power stage area ensures fast, accurate detection of the junction temperature. Overtemperature cutout occurs at minimum 150oC. The device is automatically restarted when the chip temperature falls below 135oC. - STATUS FEEDBACK: In the case of an overtemperature fault condition, a Status Feedback is provided through the Input pin. The internal protection circuit disconnects the input from the gate and connects it instead to ground via an equivalent resistance of 100 Ω. The failure can be detected by monitoring the voltage at the Input pin, which will be close to ground potential. Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL Logic circuit (with a small increase in RDS(on)). VNP14N04 Thermal Impedance Derating Curve Output Characteristics Transconductance Static Drain-Source On Resistance vs Input Voltage Static Drain-Source On Resistance 5/11 VNP14N04 Static Drain-Source On Resistance Input Charge vs Input Voltage Capacitance Variations Normalized Input Threshold Voltage vs Temperature Normalized On Resistance vs Temperature Normalized On Resistance vs Temperature 6/11 VNP14N04 Turn-on Current Slope Turn-on Current Slope Turn-off Drain-Source Voltage Slope Turn-off Drain-Source Voltage Slope Switching Time Resistive Load Switching Time Resistive Load 7/11 VNP14N04 Switching Time Resistive Load Current Limit vs Junction Temperature Step Response Current Limit Source Drain Diode Forward Characteristics 8/11 VNP14N04 Fig. 1: Unclamped Inductive Load Test Circuits Fig. 2: Unclamped Inductive Waveforms Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 4: Input Charge Test Circuit Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times Fig. 6: Waveforms 9/11 VNP14N04 TO-220 MECHANICAL DATA mm DIM. MIN. inch MAX. MIN. A 4.40 TYP. 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 D1 TYP. MAX. 0.107 1.27 0.050 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067 G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 L2 0.409 16.4 0.645 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154 DIA. 3.75 3.85 0.147 0.151 D1 C D A E L4 H2 G G1 F1 L2 F2 F Dia. L5 L9 L7 L6 10/11 L4 P011C VNP14N04 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. © 1996 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A . 11/11