2SC4617

TAK CHEONG ® SEM IC O N DU C TO R 150mW SOT-523 SURFACE MOUNT 2SC4617 Green Product Plastic Package NPN Silicon General Purpose Transistor 3 Absolute Maximum Ratings Symbol TA = 25°C unless otherwise noted Parameter 2 Value Units PC Collector Power Dissipation 150 mW TSTG Storage Temperature Range -55 to +150 °C +150 °C TJ Operating Junction Temperature VCBO Collector-Base Voltage 50 V VCEO Collector-Emitter Voltage 50 V VEBO Emitter-Base Voltage 5 V 100 mA IC Collector Current - Continuous 1 SOT-523 These ratings are limiting values above which the serviceability of the diode may be impaired. pecification Features: ƒ ƒ ƒ ƒ ƒ ƒ Electrical Symbol: Low Cob = 2.0pF (Typical) Low Vce(sat) < 0.4V RoHS Compliant Green EMC Matte Tin(Sn) Lead Finish Weight: approx. 0.002g TA = 25°C unless otherwise noted Electrical Characteristics Parameter Symbol Test Condition Limits Min Typ Max Unit V(BR)CBO Collector-Base Breakdown Voltage IC=50uA, IE=0A 50 Volts V(BR)CEO Collector-Emitter Breakdown Voltage IC=1mA, IB=0A 50 Volts V(BR)EBO Emitter-Base Breakdown Voltage IE=50uA, IC=0A 5 Volts ICBO Collector Cut-off Current VCB=50V, IE=0A 0.1 µA IEBO Emitter Cut-off Current VEB=5V, IC=0A 0.1 µA hFE DC Current Gain VCE=6V, IC=1mA 560 --- Collector-Emitter Saturation Voltage IC=50mA, IB=5mA 0.4 Volts Transition Frequency VCE =5V, IC=10mA f=30MHz 280 MHz Collector Output Capacitance VCB =12V, IE =0A, f=1MHz 2.0 pF VCE(sat) fT COB 120 DB Number: DB-245 April 2015, Revision A Page 1 TAK CHEONG ® SEM IC O N DU C TO R Classification of hFE Rank Range Marking Q R S 120 - 270 180 - 390 270 - 560 BQ BR BS SOT-523 Package Outline DIM Typical Soldering Pattern: MILLIMETERS INCHES MIN MAX MIN MAX A 0.70 0.90 0.028 0.035 A1 0.00 0.10 0.000 0.004 A2 0.70 0.80 0.028 0.031 b1 0.15 0.25 0.006 0.010 b2 0.25 0.35 0.010 0.014 c 0.10 0.20 0.004 0.008 D 1.50 1.70 0.059 0.067 E 0.70 0.90 0.028 0.035 E1 1.45 1.75 0.057 0.069 e e1 0.50 TYP. 0.90 L L1 θ 0.020 TYP. 1.10 0.035 0.40 REF. 0.10 0 O 0.043 0.016 REF. 0.30 8 O 0.004 0 O 0.012 8 O NOTES: 1. Above package outline conforms to JEITA EAIJ ED-7500A SC-75A. 2. Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions. DB Number: DB-245 April 2015, Revision A Page 2 TAK CHEONG ® DISC LA I MER NOTIC E NOTICE The information presented in this document is for reference only. Tak Cheong reserves the right to make changes without notice for the specification of the products displayed herein. The product listed herein is designed to be used with ordinary electronic equipment or devices, and not designed to be used with equipment or devices which require high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such improper use of sale. This publication supersedes & replaces all information reviously supplied. For additional information, please visit our website http://www.takcheong.com, or consult your nearest Tak Cheong’s sales office for further assistance. Number: DB-100 April 14, 2008 / A