SUM18N25-165
Vishay Siliconix
N-Channel 250-V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
rDS(on) (Ω)
ID (A)
250
0.165 at VGS = 10 V
18
• TrenchFET® Power MOSFET
• 175 °C Junction Temperature
• Low Thermal Resistance Package
RoHS
COMPLIANT
D
TO-263
G
G
D S
Top View
S
Ordering Information: SUM18N25-165-E3 (Lead (Pb)-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
250
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 125 °C
Pulsed Drain Current
Single Pulse Avalanche Current
a
Single Pulse Avalanche Energy
Maximum Power Dissipationa
L = 0.1 mH
TC = 25 °C
TA = 25 °Cc
Operating Junction and Storage Temperature Range
ID
20
IAS
5
PD
V
18
10.4
IDM
EAS
Unit
1.25
150b
3.75
A
mJ
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
RthJA
40
RthJC
1.0
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mount (TO-263)c
°C/W
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When Mounted on 1" square PCB (FR-4 material).
Document Number: 72849
S-80272-Rev. B, 11-Feb-08
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1
SUM18N25-165
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
V(BR)DSS
VDS = 0 V, ID = 250 µA
250
VGS(th)
VDS = VGS, ID = 250 µA
2.5
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
Forward Transconductancea
± 100
VDS = 250 V, VGS = 0 V
1
VDS = 250 V, VGS = 0 V, TJ = 125 °C
50
VDS = 250 V, VGS = 0 V, TJ = 175 °C
250
VDS ≥ 15 V, VGS = 10 V
ID(on)
VGS = 10 V, ID = 14 A
Drain-Source On-State Resistancea
4
rDS(on)
gfs
20
nA
µA
A
0.130
0.165
VGS = 10 V, ID = 14 A, TJ = 125 °C
0.347
VGS = 10 V, ID = 14 A, TJ = 175 °C
0.462
VDS = 15 V, ID = 18 A
V
36
Ω
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
1950
VGS = 0 V, VDS = 25 V, f = 1 MHz
pF
160
70
30
VDS = 125 V, VGS = 10 V, ID = 18 A
45
nC
10
Gate-Drain Charge
Qgd
10
Gate Resistance
Rg
1.6
c
td(on)
15
25
130
195
c
td(off)
30
45
100
150
Turn-On Delay Time
Rise Timec
Turn-Off Delay Time
tr
Fall Timec
VDD = 125 V, RL = 7.0 Ω
ID ≅ 18 A, VGEN = 10 V, Rg = 2.5 Ω
tf
Ω
ns
Source-Drain Diode Ratings and Characteristics TC = 25 °Cb
IS
18
Pulsed Current
ISM
20
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Charge
Reverse Recovery Charge
IF = 18 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 18 A, di/dt = 100 A/µs
A
1.0
1.5
V
115
175
ns
10
15
A
0.58
1.3
µC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72849
S-80272-Rev. B, 11-Feb-08
SUM18N25-165
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
20
VGS = 10 thru 6 V
16
16
I D - Drain Current (A)
I D - Drain Current (A)
5V
12
8
4
12
8
TC = 125 °C
4
25 °C
4V
- 55 °C
0
0
0
4
8
12
16
20
0
1
2
VDS - Drain-to-Source Voltage (V)
4
5
6
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
60
0.32
TC = - 55 °C
0.28
r DS(on) - On-Resistance (Ω)
50
g fs - Transconductance (S)
3
25 °C
40
125 °C
30
20
0.24
0.20
0.16
VGS = 10 V
0.12
0.08
10
0.04
0
0.00
0
4
8
12
16
20
0
8
12
16
20
ID - Drain Current (A)
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
20
2100
VGS - Gate-to-Source Voltage (V)
2800
C - Capacitance (pF)
4
Ciss
1400
700
Crss
VDS = 125 V
ID = 17 A
16
12
8
4
Coss
0
0
0
40
80
120
160
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 72849
S-80272-Rev. B, 11-Feb-08
200
0
8
16
24
32
40
48
56
Qg - Total Gate Charge (nC)
Gate Charge
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SUM18N25-165
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.8
100
VGS = 10 V
ID = 18 A
I S - Source Current (A)
rDS(on) - On-Resistance
(Normalized)
2.4
2.0
1.6
1.2
TJ = 150 °C
10
TJ = 25 °C
0.8
0.4
- 50
1
- 25
0
25
50
75
100
125
150
175
0.3
0
TJ - Junction Temperature (°C)
0.9
1.2
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Junction Temperature
100
325
310
V(BR)DSS (V)
10
I Dav (A)
0.6
IAV (A) at TA = 25 °C
1
ID = 10 mA
295
280
0.1
265
IAV (A) at TA = 150 °C
0.01
0.000001
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0.00001
0.0001
0.001
0.01
0.1
250
- 50
- 25
0
25
50
75
100
125
tin (s)
TJ - Junction Temperature (°C)
Avalanche Current vs. Time
Drain Source Breakdown vs.
Junction Temperature
150
175
Document Number: 72849
S-80272-Rev. B, 11-Feb-08
SUM18N25-165
Vishay Siliconix
THERMAL RATINGS
20
100
Limited by rDS(on)*
10 µs
I D - Drain Current (A)
I D - Drain Current (A)
16
12
8
10
100 µs
1 ms
1
10 ms
TC = 25 °C
Single Pulse
4
0
100 ms, DC
0.1
0
25
50
75
100
125
150
175
0.1
1
TC - Case Temperature (°C)
* VGS
Maximum Drain Current vs. Case Temperature
10
100
1000
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?72849.
Document Number: 72849
S-80272-Rev. B, 11-Feb-08
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Revision: 01-Jan-2022
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Document Number: 91000