VOW3120
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Vishay Semiconductors
Widebody 2.5 A IGBT and MOSFET Driver
FEATURES
• 2.5 A minimum peak output current
• 10 mm minimum external creepage distance
NC
1
8
VCC
A
2
7
VO
• ICC = 2.5 mA maximum supply current
C
3
6
NC
• Under voltage lock-out (UVLO) with hysteresis
NC
4
5
VEE
• 50 kV/μs (typ.) common mode rejection
• Wide operating VCC range: 15 V to 32 V
Shield
• Industrial temperature range: -40 °C to +100 °C
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
V
D E
APPLICATIONS
22660
• Industrial welding equipment
DESCRIPTION
• Motor drives
The VOW3120 consists of an infrared light emitting diode
optically coupled to an integrated circuit with a power
output stage. This optocoupler is ideally suited for driving
power IGBTs and MOSFETs used in motor control and
inverter applications. The high operating voltage range of
the output stage provides the drive voltages required by
gate controlled devices. The voltage and current supplied by
this optocoupler makes it ideally suited for directly driving
IGBTs with ratings up to 1200 V/100 A. For IGBTs with
higher ratings, the VOW3120 can be used to drive a discrete
power stage which drives the IGBT gate.
• Industrial inverters
• Commercial and residential solar inverters
• Wind generator inverters
• EV and plug-in HEV chargers
AGENCY APPROVALS
All parts are certified under base model VOW3120. This
model number should be used when consulting safety
agency documents.
• UL1577
The VOW3120 provides higher isolation for applications
operating at higher working voltages, and or higher pollution
degree criteria. Higher VIORM, VIOTM, creepage and
clearance distances, make the VOW3120 ideal for many
industrial control and power conversion applications.
• cUL
• CQC
• DIN EN 60747-5-5 (VDE 0884-5)
ORDERING INFORMATION
V
O
W
3
1
PART NUMBER
PACKAGE
DIP-8, widebody, 400 mil
SMD-8, widebody, 400 mil (option 7)
Rev. 1.2, 26-Sep-16
2
0
-
X
0
#
PACKAGE OPTION
UL, cUL, CQC
#
T
TAPE
AND
REEL
SMD-8
DIP-8
10.16 mm typ.
10.16 mm typ.
0.75 mm
UL, cUL, CQC, VDE
VOW3120
VOW3120-X001
-
VOW3120-X017T
Document Number: 82442
1
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ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
IF
25
mA
< 1 μs pulse width, 300 pps
IF(TRAN)
1
A
VR
5
V
Pdiss
40
mW
Tj
125
°C
High peak output current (1)
IOH(PEAK)
2.5
A
Low peak output current (1)
IOL(PEAK)
2.5
A
INPUT
Input forward current
Peak transient input current
Reverse input voltage
Input power dissipation
LED junction temperature
OUTPUT
Supply voltage
(VCC - VEE)
0 to +35
V
Output voltage
VO(PEAK)
0 to +VCC
V
Pdiss
220
mW
Tj
125
°C
Storage temperature range
Tstg
-55 to +150
°C
Ambient operating temperature range
Tamb
-40 to +100
°C
Total power dissipation
Ptot
260
mW
Tsld
260
°C
Output power dissipation
Output junction temperature
OPTOCOUPLER
Lead solder temperature
For 10 s, 1.6 mm below seating plane
Notes
• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(1) Maximum pulse width = 10 μs, maximum duty cycle = 0.2 %. This value is intended to allow for component tolerances for designs with
IO peak minimum = 2.5 A. See applications section for additional details on limiting IOH peak.
RECOMMENDED OPERATING CONDITION
PARAMETER
SYMBOL
MIN.
MAX.
Power supply voltage
VCC - VEE
15
32
V
Input LED current (on)
IF
10
-
mA
Input voltage (off)
Ptot - Maximum Power Dissipation (mW)
Operating temperature
UNIT
VF(OFF)
-3
0.8
V
Tamb
-40
+100
°C
250
Output Driver
225
200
175
150
125
100
75
IR- LED
50
25
0
-40
-20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 1 - Dissipated Operating Power vs. Operating Temperature
Rev. 1.2, 26-Sep-16
Document Number: 82442
2
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THERMAL CHARACTERISTICS
PARAMETER
SYMBOL
VALUE
UNIT
LED power dissipation
PLED
40
mW
Output power dissipation
POUT
220
mW
Total power dissipation
PTOT
260
mW
Maximum LED junction temperature
Tj max.
125
°C
Maximum output die junction temperature
Tj max.
125
°C
Thermal resistance, LED to output
θED
315
°C/W
Thermal resistance, LED to board
θEB
300
°C/W
Thermal resistance, output to board
θDB
80
°C/W
Thermal resistance, board to ambient
θBA
50
°C/W
θED
TJE
TJD
θEB
θDB
TJB
θBA
Tamb
Note
• The thermal characteristics table above were measured at 25 °C and the thermal model is represented in the thermal network below. Each
resistance value given in this model can be used to calculate the temperatures at each node for a given operating condition. The thermal
resistance from board to ambient will be dependent on the type of PCB, layout and thickness of copper traces. For a detailed explanation
of the thermal model, please reference Vishay’s Thermal Characteristics of Optocouplers application note.
ELECTRICAL CHARACTERISTICS
PARAMETER
High level output current
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
VO = (VCC - 4 V)
IOH
0.5
-
-
A
VO = (VCC - 15 V)
IOH
2.5
-
-
A
VO = (VEE + 2.5 V)
IOL
0.5
-
-
A
VO = (VEE + 15 V)
IOL
2.5
-
-
A
High level output voltage
IO = -100 mA
VOH
VCC - 4
-
-
V
Low level output voltage
IO = 100 mA
VOL
-
0.2
0.5
V
High level supply current
Output open, IF = 10 mA to 16 mA
ICCH
-
-
2.5
mA
Low level supply current
Output open, VF = -3 V to +0.8 V
ICCL
-
-
2.5
mA
IO = 0 mA, VO > 5 V
IFLH
-
3.4
8
mA
V
Low level output current
Threshold input current low to high
Threshold input voltage high to low
VFHL
0.8
-
-
Input forward voltage
IF = 10 mA
VF
1
1.36
1.6
V
Temperature coefficient of forward voltage
IF = 10 mA
ΔVF/ΔTamb
-
-1.4
-
mV/°C
IR = 10 μA
V(BR)
5
-
-
V
Input capacitance
Input reverse breakdown voltage
f = 1 MHz, VF = 0 V
CIN
-
45
-
pF
UVLO threshold
VO ≥ 5 V, IF = 10 mA
VUVLO +
11
-
13.5
V
VUVLO -
9.5
-
12
V
UVLOHYS
-
1.6
-
V
CIO
-
0.9
-
pF
UVLO hysteresis
Capacitance (input to output)
f = 1 MHz, VF = 0 V
Note
• Minimum and maximum values were tested over recommended operating conditions (Tamb = -40 °C to +100 °C, IF(ON) = 10 mA to 16 mA,
VF(OFF) = -3 V to 0.8 V, VCC = 15 V to 32 V, VEE = ground) unless otherwise specified. Typical values are characteristics of the device and are
the result of engineering evaluations. Typical values are for information only and are not part of the testing requirements. All typical values
were measured at Tamb = 25 °C and with VCC - VEE = 32 V.
Rev. 1.2, 26-Sep-16
Document Number: 82442
3
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SWITCHING CHARACTERISTICS
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
tPHL
0.1
0.25
0.5
μs
Propagation delay time to logic high output Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, duty cycle = 50 %
tPLH
0.1
0.25
0.5
μs
Pulse width distortion
Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, duty cycle = 50 %
PWD
-
-
0.3
μs
Rise time
Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, duty cycle = 50 %
tr
-
0.1
-
μs
Fall time
Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, duty cycle = 50 %
tf
-
0.1
-
μs
UVLO turn on delay
VO > 5 V, IF = 10 mA
TUVLO-ON
-
0.8
-
μs
UVLO turn off delay
VO < 5 V, IF = 10 mA
TUVLO-OFF
-
0.6
-
μs
Propagation delay time to logic low output Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, duty cycle = 50 %
Note
• Minimum and maximum values were tested over recommended operating conditions (Tamb = -40 °C to +100 °C, IF(ON) = 10 mA to 16 mA,
VF(OFF) = -3 V to 0.8 V, VCC = 15 V to 32 V, VEE = ground) unless otherwise specified. Typical values are characteristics of the device and are
the result of engineering evaluations. Typical values are for information only and are not part of the testing requirements. All typical values
were measured at Tamb = 25 °C and with VCC - VEE = 32 V.
8
1
0.1 µF
IF = 10 mA to 16 mA
500 Ω
+
2
7
3
6
4
5
IF
+
VO
VCC = 15 V
to 32 V
tf
tr
90 %
10 kHz
50 % Duty
Cycle
10 Ω
50 %
10 nF
10 %
OUT
t PHL
t PLH
20979-3
Fig. 2 - tPLH, tPHL, tr and tf Test Circuit and Waveforms
COMMON MODE TRANSIENT IMMUNITY
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
Common mode transient immunity at
logic high output
Tamb = 25 °C, IF = 10 mA to 16 mA,
VCM = 1500 V, VCC = 32 V
|CMH|
25
50
-
kV/μs
Common mode transient immunity at
logic low output
Tamb = 25 °C, VCM = 1500 V,
VCC = 32 V, VF = 0 V
|CML|
25
45
-
kV/μs
Note
• Minimum and maximum values were tested over recommended operating conditions (Tamb = -40 °C to +100 °C, IF(ON) = 10 mA to 16 mA,
VF(OFF) = -3 V to 0.8 V, VCC = 15 V to 32 V, VEE = ground) unless otherwise specified. Typical values are characteristics of the device and are
the result of engineering evaluations. Typical values are for information only and are not part of the testing requirements. All typical values
were measured at Tamb = 25 °C and with VCC - VEE = 32 V.
V CM
5V
dt
0.1 μF
A
R
dV
8
1
IF
7
2
3
6
4
5
V CM
Δt
0V
VO
Δt
+
+
=
V CC = 32 V
VO
V OH
Switch at A: IF = 10 mA
VO
V OL
+
Switch at B: IF = 0 mA
20980-3
V CM = 1500 V
Fig. 3 - CMR Test Circuit and Waveforms
Rev. 1.2, 26-Sep-16
Document Number: 82442
4
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SAFETY AND INSULATION RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Climatic classification
According to IEC 68 part 1
Pollution degree
According to DIN VDE 0109
Comparative tracking index
SYMBOL
VALUE
UNIT
40 / 100 / 21
2
Insulation group IIIa
CTI
250
Maximum rated withstanding isolation voltage
According to UL1577, t = 1 min
VISO
5300
VRMS
Maximum transient isolation voltage
According to DIN EN 60747-5-5
VIOTM
8000
Vpeak
Maximum repetitive peak isolation voltage
According to DIN EN 60747-5-5
VIORM
1414
Vpeak
Tamb = 25 °C, VIO = 500 V
RIO
≥ 1012
Ω
Tamb = 100 °C, VIO = 500 V
RIO
≥ 1011
Ω
PSO
800
mW
Input safety current
ISI
350
mA
Input safety temperature
TS
175
°C
≥ 10
mm
Isolation resistance
Output safety power
Creepage distance
DIP-8, widebody, 400 mil
Clearance distance
Creepage distance
SMD-8, widebody, 400 mil (option 7)
≥ 10
mm
≥ 10
mm
≥ 10
mm
DTI
≥ 0.4
mm
Input to output test voltage, method B
VIORM x 1.875 = VPR, 100 % production test
with tM = 1 s, partial discharge < 5 pC
VPR
2651
Vpeak
Input to output test voltage, method A
VIORM x 1.6 = VPR, 100 % sample test
with tM = 10 s, partial discharge < 5 pC
VPR
2262
Vpeak
Clearance distance
Insulation thickness
900
400
800
350
Safety Input Current (mA)
Safety Power Output (mW)
Note
• According to DIN EN60747-5-5 (see figure 4). This optocoupler is suitable for safe electrical isolation only within the safety ratings.
Compliance with the safety ratings shall be ensured by means of suitable protective circuits.
700
600
500
400
300
200
100
0
300
250
200
150
100
50
0
-55 -25
5
35
65
95 125 155 185
Ambient Temperature (°C)
Fig. 4 - Safety Power Dissipation vs. Ambient Temperature
Rev. 1.2, 26-Sep-16
-55 -25
5
35
65
95 125 155 185
Ambient Temperature (°C)
Fig. 5 - Safety Input Current vs. Ambient Temperature
Document Number: 82442
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0.0
3.0
VCC = 15 V to 32 V
IF = 7 mA to 16 mA
IOUT = -100 mA
VEE = 0 V
-0.5
-1.0
IOL - Output Low Current (A)
(VOH-VCC) - High Output Voltage Drop (V)
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
-1.5
-2.0
-2.5
-3.0
2.5
2.0
1.5
1.0
-40
-20
0
20
40
60
80
100
-40
Tamb - Ambient Temperature (°C)
0
20
40
60
80
100
Fig. 9 - Output Low Current vs. Ambient Temperature
3.0
4.0
2.5
VOL - Output Low Voltage (V)
VCC = 15 V to 32 V
VOUT = VCC - 4 V
IF = 16 mA
2.0
1.5
1.0
-40
-20
0
20
40
60
80
3.5
3.0
VF(OFF) = -3.0 V to 0.8 V 100 °C
VCC = 15 V to 32 V
VEE = 0 V
25 °C
2.5
-40 °C
2.0
1.5
1.0
0.5
0.0
100
0.0
0.5
VCC = 15 V to 32 V
IOL = 100 mA
VF(OFF) = -3.0 V to 0.8 V
VEE = 0 V
0.4
0.3
0.2
0.1
-40
-20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 8 - Low Level Output Voltage vs. Ambient Temperature
Rev. 1.2, 26-Sep-16
1.0
1.5
2.0
2.5
Fig. 10 - Output Low Voltage vs. Output Low Current
VOH - VCC - Output High Voltage (V)
Fig. 7 - Output High Current vs. Ambient Temperature
0.5
IOL - Output Low Current (A)
Tamb - Ambient Temperature (°C)
VOL - Low Level Output Voltage (V)
-20
Tamb - Ambient Temperature (°C)
Fig. 6 - High Output Voltage Drop vs. Ambient Temperature
IOH - Output High Current (A)
VCC = 15 V to 32 V
VOUT = 2.5 V
VF(OFF) = -3 V to 0.8 V
-1
100 °C
25 °C
-2
-3
-40 °C
-4
VCC = 15 V to 32 V
IF = 7 mA to 16 mA
VEE = 0 V
-5
-6
0.0
0.5
1.0
1.5
2.0
2.5
IOH - Output High Current (A)
Fig. 11 - Output High Voltage vs. Output High Current
Document Number: 82442
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2.0
30
ICC - Supply Current (mA)
1.6
1.4
VO - Output Voltage (V)
VCC = 32 V
IF = 10 mA for ICCH
IF = 0 mA for ICCL
1.8
ICCH
1.2
1.0
ICCL
0.8
25
20
15
10
5
0
0.6
-40
-20
0
20
40
60
80
0
100
1
Fig. 12 - Supply Current vs. Ambient Temperature
4
5
500
Tamb = 25 °C
IF = 10 mA for ICCH
IF = 0 mA for ICCL
2.0
tp - Propagation Delay (ns)
ICC - Supply Current (mA)
3
Fig. 15 - Output Voltage vs. Forward Current
2.5
ICCH
1.5
1.0
ICCL
IF = 10 mA, Tamb = 25 °C,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50 %
400
300
tPHL
200
tPLH
0.5
100
15
20
25
30
15
Fig. 13 - Supply Current vs. Supply Voltage
5
20
25
30
VCC - Supply Voltage (V)
VCC - Supply Voltage (V)
Fig. 16 - Propagation Delay vs. Supply Voltage
500
VCC = 15 V to 32 V
tp - Propagation Delay (ns)
IFHL/FLH - Threshold Current (mA)
2
IF - Forward Current (mA)
Tamb - Ambient Temperature (°C)
4
IFLH
3
IFHL
2
1
VCC = 32 V, IF = 10 mA ,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50 %
400
tpHL
300
200
tpLH
100
0
-40
-20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 14 - threshold Current vs. Ambient Temperature
Rev. 1.2, 26-Sep-16
-40
-20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 17 - Propagation Delay vs. Ambient Temperature
Document Number: 82442
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500
VCC = 32 V, Tamb = 25 °C,
Rg = 10 Ω, Cg = 10 nF
f = 10 kHz, Duty cycle = 50 %
400
tp - Propagation Delay (ns)
tp - Propagation Delay (ns)
500
300
tPHL
200
IF = 9 mA, VCC = 32 V,
Tamb = 25 °C, Rg = 10 Ω,
f = 10 kHz, duty cycle = 50 %
400
300
tPHL
200
tPLH
tPLH
100
100
5.0
7.5
10.0
12.5
0
15.0
IF - Forward Current (mA)
Fig. 18 - Propagation Delay vs. Forward Current
40
60
80
100
Fig. 20 - Propagation Delay vs. Series Load Capacitance
100
500
IF = 9 mA, VCC = 32 V,
Tamb = 25 °C, Cg = 10 nF
f = 10 kHz, Duty cycle = 50 %
400
Tamb = 25 °C
IF - Forward Current (mA)
tp - Propagation Delay (ns)
20
Cg - Series Load Capacitance (nF)
tPHL
300
200
10
tPLH
1
100
0
10
20
30
40
50
Rg - Series Load Resistance (Ω)
Fig. 19 - Propagation Delay vs. Series Load Resistance
Rev. 1.2, 26-Sep-16
1.0
1.2
1.4
1.6
1.8
VF - Forward Voltage (V)
Fig. 21 - Forward Current vs. Forward Voltage
Document Number: 82442
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PACKAGE DIMENSIONS (in millimeters)
3.50 ± 0.40
0.51 min.
11.30 max.
10.90 ± 0.15
1.32 ± 0.05
3.90 ± 0.10
DIP-8, Widebody, 400 mil
11.00 max.
9.00 ± 0.15
10.16 typ.
2.54 nom.
0.50 ± 0.05
1.75 ± 0.15
8
7
6
5
1
2
3
4
7
0.25 ± 0.05 .0° nom.
Pin 1 I.D.
0.25 ± 0.05
10.16 min.
1 ± 0.15
1.75 ± 0.15
7
6
5
1
2
3
4
Recommended Footprint
5
.2
R0
2.54
8
Lead coplanarity
0.10 max.
1.78
2.54 nom.
12.30 ± 0.30
11.00 max.
9.00 ± 0.15
0.75 ± 0.25
11.30 max.
10.90 ± 0.15
1.32 ± 0.05
3.90 ± 0.10
SMD-8, Widebody, 400 mil (option 7)
Pin 1 I.D.
2.00
Rev. 1.2, 26-Sep-16
14.00
Document Number: 82442
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PACKAGE MARKING
VOW3120
V YWW 68
Fig. 22 - Example of VOW3120-X017T
Notes
• The VDE logo is only marked on option 1 parts.
• Tape and reel (T) and package option (option 7) is not part of the package markings.
PACKING INFORMATION (in millimeters)
Tubes
DEVICE PER TUBE
TYPE
DIP-8, widebody, 400 mil
UNITS/TUBE
TUBE/BOX
UNITS/BOX
40
30
1200
DIP-8, Widebody, 400 mil
Fig. 23 - Tape and Reel Shipping Medium
Tape and Reel
ESD sticker
Tape slot
in core
Top cover tape
330
(13")
Regular, special
or bar code label
Embossed carrier
Embossment
17999
17998
Fig. 24 - Tape and Reel Shipping Medium
Rev. 1.2, 26-Sep-16
Fig. 25 - Tape and Reel Shipping Medium
Document Number: 82442
10
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VOW3120
www.vishay.com
Vishay Semiconductors
SMD-8, Widebody, 400 mil (option 7)
Fig. 26 - Tape and Reel Packing (750 parts per reel)
SOLDER PROFILES
300
300
5s
Lead temperature
ca. 2 K/s
2 K/s
50
full line: typical
dotted line:
process limits
second
wave
Temperature (°C)
Temperature (°C)
235 °C to
260 °C
first wave
200
wave
ca. 200 K/s
150
100 °C to
130 °C
100
200
max. 30 s
150
max. ramp down 6 °C/s
50
0
50
94 8626
100
max. 100 s
max. 120 s
100
ca. 5 K/s
forced cooling
0
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
250
max. ramp up 3 °C/s
0
150
200
250
Time (s)
Fig. 27 - Wave Soldering Double Wave Profile According to
J-STD-020 for DIP Devices
0
19841
50
100
150
200
250
300
Time (s)
Fig. 28 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for SMD Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: Tamb < 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
Rev. 1.2, 26-Sep-16
Document Number: 82442
11
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
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Disclaimer
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Revision: 01-Jan-2022
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Document Number: 91000