VS-30EPU12L-N3
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Vishay Semiconductors
Ultrafast Rectifier, 30 A FRED Pt®
FEATURES
Base cathode
• Ultrafast and soft recovery
2
• Optimized forward voltage drop
• 175 °C maximum operating junction temperature
2
• Polyimide passivation
1
3
TO-247AD 2L
• Rugged design
3
Anode
1
Cathode
• Good thermal performance
• Designed and qualified according to JEDEC®-JESD 47
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
DESCRIPTION / APPLICATIONS
IF(AV)
30 A
VR
1200 V
VF at IF at 125 °C
2.05 V
trr
49 ns
TJ max.
175 °C
Package
TO-247AD 2L
Circuit configuration
Single
Ultrafast recovery rectifiers designed with optimized
performance of forward voltage drop, recovery time, and
soft recovery. Polyimide passivated, planar structure, and
the platinum doped life time control guarantee, ruggedness,
reliability characteristics, and solid value proposition for
efficiency and thermal performance.
These devices are intended for use in boost stage in the
AC/DC section of SMPS, high frequency output rectification
of battery charger, inverters for solar inverters, or as
freewheeling diodes in motor drive.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
1200
V
Repetitive peak reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 135 °C, D = 0.50
30
Non-repetitive peak surge current
IFSM
TC = 25 °C, tp = 10 ms, sine wave
300
Repetitive peak forward current
Operating junction and storage temperature
A
IFRM
60
TJ, TStg
-55 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
IR = 500 μA
IF = 30 A
MIN.
TYP.
MAX.
1200
-
-
-
2.15
2.68
IF = 30 A, TJ = 125 °C
-
2.05
2.45
VR = VR rated
-
-
145
TJ = 125 °C, VR = VR rated
-
-
320
UNITS
V
μA
Reverse leakage current
IR
Junction capacitance
CT
VR = 200 V
-
29
-
pF
Series inductance
LS
Measured to lead 5 mm from package body
-
8
-
nH
Revision: 19-Feb-2019
Document Number: 95927
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
trr
Peak recovery current
IRRM
Reverse recovery charge
Qrr
MIN.
TYP.
MAX.
IF = 1.0 A, dIF/dt = 100 A/μs, VR = 30 V
TEST CONDITIONS
-
49
-
TJ = 25 °C
-
220
-
TJ = 125 °C
-
356
-
-
8.2
-
-
13.3
-
IF = 30 A
dIF/dt = 100 A/μs
VR = 390 V
TJ = 25 °C
TJ = 125 °C
UNITS
ns
A
TJ = 25 °C
-
900
-
TJ = 125 °C
-
2388
-
MIN.
TYP.
MAX.
-
0.35
0.42
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Thermal resistance, junction to case
TEST CONDITIONS
RthJC
UNITS
Thermal resistance, junction to ambient
RthJA
Typical socket mount
-
30
33
Thermal resistance, case to heat sink
RthCS
Mounting surface, flat, smooth, and greased
-
0.25
0.4
-
0.2
-
g
-
0.07
-
oz.
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
-55
-
175
°C
Weight
Mounting torque
Maximum junction and storage
temperature range
TJ, TStg
Case style: TO-247AD 2L
30EPU12L
1000
100
TJ = 175 °C
10
IR - Reverse Current (μA)
IF - Instantaneous Forward Current (A)
Marking device
°C/W
TJ = 175 °C
TJ = 125 °C
TJ = 25 °C
1
TJ = 150 °C
100
10
TJ = 125 °C
TJ = 25 °C
1
0.1
0.01
0.1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VF - Forward Voltage Drop (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
0
200
400
600
800
1000
1200
VR - Reverse Voltage (V)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Revision: 19-Feb-2019
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CT - Junction Capacitance (pF)
1000
100
10
0
200
400
600
800
1000
1200
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
0.01
DC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
180
140
170
120
Average Power Loss (W)
Allowable Solder Pad Temperature (°C)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
160
DC
150
140
Square wave (D = 0.50)
80 % rated VR applied
130
120
RMS limit
100
80
D = 0.01
D = 0.05
D = 0.10
D = 0.20
D = 0.50
60
40
20
DC
0
0
5
10
15
20
25
30
35
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
0
10
20
30
40
50
IF(AV) - Average Forward Current (A)
Fig. 6 - Forward Power Loss Characteristics
Revision: 19-Feb-2019
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300
4000
TJ = 125 °C
TJ = 25 °C
250
3500
50 A
200
Qrr (nC)
trr (ns)
30 A
50 A
150
3000
30 A
2500
15 A
100
2000
50
15 A
1500
0
100
200
300
400
500
0
100
dIF/dt (A/μs)
300
400
500
dIF/dt (A/μs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 10 - Typical Stored Charge vs. dIF/dt
450
25
TJ = 25 °C
TJ = 125 °C
400
350
20
30 A
15
50 A
30 A
300
Irec (A)
trr (ns)
200
50 A
250
15 A
200
15 A
10
150
5
100
0
100
200
300
400
500
0
100
300
400
500
dIF/dt (A/μs)
dIF/dt (A/μs)
Fig. 8 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 11 - Typical Reverse Current vs. dIF/dt
35
1800
TJ = 25 °C
TJ = 125 °C
1600
30
1400
30 A
50 A
Irec (A)
Qrr (nC)
200
1200
30 A
25
50 A
20
1000
15 A
15
15 A
800
10
600
0
100
200
300
400
500
dIF/dt (A/μs)
Fig. 9 - Typical Stored Charge vs. dIF/dt
0
100
200
300
400
500
dIF/dt (A/μs)
Fig. 12 - Typical Reverse Current vs. dIF/dt
Revision: 19-Feb-2019
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(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(4) Qrr - area under curve defined by trr
and IRRM
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
Qrr =
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 13 - Reverse Recovery Waveform and Definitions
ORDERING INFORMATION TABLE
Device code
VS-
30
E
P
U
12
L
-N3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Current rating (30 = 30 A)
3
-
Circuit configuration: E = single diode
4
-
P = TO-247 package
5
-
6
-
Process type:
U = ultrafast recovery
Voltage rating (12 = 1200 V)
7
-
L = long leads
8
-
Environmental digit:
-N3 = halogen-free, RoHS-compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER TUBE
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-30EPU12L-N3
25
500
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95536
Part marking information
www.vishay.com/doc?95648
Revision: 19-Feb-2019
Document Number: 95927
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Outline Dimensions
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Vishay Semiconductors
TO-247AD 2L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) F P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M D BM
F P1
A
D2
Q
2xR
(2)
D1 (4)
D
1, 2
4
D
3
Thermal pad
(5) L1
C
L
See view B
(4)
E1
A
0.01 M D B M
View A - A
C
2 x b2
2xb
2x e
A1
0.10 M C A M
(b1, b3)
Plating
Base metal
D D
(c)
c1
C
C
(b, b2)
(4)
Section C - C, D - D
SYMBOL
MILLIMETERS
View B
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.65
5.31
0.183
0.209
A1
2.21
2.59
0.087
0.102
NOTES
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
E
15.29
15.87
0.602
0.625
E1
13.46
-
0.53
-
A2
1.50
2.49
0.059
0.098
e
5.46 BSC
b
0.99
1.40
0.039
0.055
ØK
0.254
b1
0.99
1.35
0.039
0.053
L
19.81
20.32
0.780
0.800
b2
1.65
2.39
0.065
0.094
L1
3.71
4.29
0.146
0.169
b3
1.65
2.34
0.065
0.092
ØP
3.56
3.66
0.14
0.144
c
0.38
0.89
0.015
0.035
Ø P1
-
6.98
-
0.275
NOTES
3
0.215 BSC
0.010
c1
0.38
0.84
0.015
0.033
Q
5.31
5.69
0.209
0.224
D
19.71
20.70
0.776
0.815
3
R
4.52
5.49
0.178
0.216
D1
13.08
-
0.515
-
4
S
D2
0.51
1.35
0.020
0.053
5.51 BSC
0.217 BSC
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 28-May-2018
Document Number: 95536
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Revision: 01-Jan-2019
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Document Number: 91000