TB62801FG

TB62801FG TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic TB62801FG Linear CCD Clock Driver The TB62801FG is a clock distribution driver for CCD linear image sensors. The IC can functionally drive the CCD input capacitance. It also supports inverted outputs, eliminating the need for crosspoint control. The IC contains a 1 to 4 clock distribution driver for the main clock and 4-bit buffers for control signals. The suffix (G) appended to the part number represents a Lead (Pb) -Free product. Features • • High drivability: Guaranteed driving 450 [pF] load capacitance @fclock = 20 [MHz] Operating temperature range: Ta = −25°C to 60°C Weight: 0.5 g (typ.) Pin Connection (top view) 2B_ out 1 2 3 4 16 15 14 13 2B_out CP_out φ φ 2B_in CP_in VCC GND GND VCC CK_in SH_in RS_in 5 6 7 8 12 11 10 9 φ φ SH_out RS_out 1 2006-06-14 TB62801FG Logic Diagram 2B_ out 2B_in CP_in 2B_out CP_out φ φ CK_in φ φ SH_in RS_in SH_out RS_out Pin Description Pin No. 1 2 3 4 Pin Name 2B_ out 2B_in CP_in VCC GND Functions Light-load drive output (inverted) Light-load drive input Light-load drive input Power supply Ground Power supply Heavy-load drive input Light-load drive input Light-load drive input Light-load drive output (not inverted) Light-load drive output (not inverted) Heavy-load drive output (not inverted) Heavy-load drive output (inverted) Ground Heavy-load drive output (inverted) Heavy-load drive output (not inverted) Light-load drive output (not inverted) Light-load drive output (not inverted) Remarks Driver output for CCD last-stage clock Driver input for CCD last-stage clock CCD clamp gate driver input ― ― ― Driver input for CCD transfer clock CCD shift gate driver input CCD reset gate driver input CCD reset gate driver output CCD shift gate driver output Driver output for CCD transfer clock Driver output for CCD transfer clock 5 6 7 8 9 10 11 12 VCC CK_in SH_in RS_in RS_out SH_out φ φ GND ― Driver output for CCD transfer clock Driver output for CCD transfer clock CCD clamp gate driver output Driver output for CCD last-stage clock 13 14 15 16 φ φ CP_out 2B_out 2 2006-06-14 TB62801FG Truth Table Input L 2B_in H L H CP_in L H L CK_in H L H SH_in L H L H 2B_ out Output H L L H L H L H H L L H L H 2B_out CP_out φ φ SH_out RS_in RS_out Absolute Maximum Ratings (Ta = 25°C) Characteristic Power supply voltage Input voltage Output voltage Input clamp diode current (Vi < 0) Output clamp diode current (VO < 0) Symbol VCC VIN VO IIK IOK IOH (O/ O ) Rating −0.5 to 7.0 −1.2 to VCC+0.5 −0.5 to VCC −50 −50 Unit V V V mA mA Output current High level −16.0 16.0 −100 150 −25 to 60 −40 to 100 mA mA mA mA excluding other Low level than φ, φ outputs φ output current IOL (O/ O ) IOH (φ/ φ ) IOL (φ/ φ ) Topr Tstg Tj PD High level Low level Operating temperature Storage temperature Junction temperature Power dissipation ℃ ℃ ℃ W 150 1.5 Note: Output current is specified as follows: VOH = 4.0 V, VOL = 0.5 V. 3 2006-06-14 TB62801FG Recommended Operating Conditions Characteristic Power supply voltage Input voltage Output voltage Output current excluding φ, φ outputs φ output current Symbol VCC VIN VO Min 4.7 0 0 Typ. 5.0 Max 5.5 VCC VCC −8.0 Unit V V V mA mA mA mA °C ns ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 25 2.5 High level Low level High level (Note) Low level IOH (O/ O ) IOL (O/ O ) IOH (φ/ φ ) IOL (φ/ φ ) Topr tri/tfi ⎯ ⎯ ⎯ ⎯ −25 8.0 −20.0 20.0 60 5.0 Operating temperature Input rise/fall time ⎯ Note: Output current is specified as follows: VCC = 4.7 V, VOH = 4.5 V, VOL = 0.2 V. Input rise/fall time is specified as 10 % to 90 % of waveform amplitude. Electrical Characteristics DC Characteristics (unless otherwise specified, VCC = 4.7 to 5.5 V, Ta = −25 to 60°C) Characteristic Input voltage High Low Symbol VIH VIL VIK VOH (φ/ φ ) Test Circuit 1, 2 3 Test Condition ⎯ ⎯ VCC 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 5.5 5.5 Min 2.0 0 ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Max VCC 0.8 1.0 VCC VCC VCC 0.2 0.5 2.5 VCC VCC 0.2 0.5 1.0 15.0 Unit V V Input clamp voltage IIK = −30 mA IOH = −10 mA IOH = −50 mA IOH = −300 mA IOL = 100 µA 4.5 4.0 2.5 0 0 0 4.5 4.0 0 0 ⎯ ⎯ 4, 5 φ output voltage V VOL (φ/ φ ) 6, 7 IOL = 50 mA IOL = 300 mA IOH (O / O ) = −4 mA IOH (O / O ) = −16 mA IOL (O / O ) = 4 mA IOL (O / O ) = 16 mA VIN = VCC or GND φ outputs: High or Low φ outputs: Low or High Other outputs are High VOH (O/ O ) Output voltage excluding φ, φ outputs VOL (O/ O ) Input voltage Total IIN ICC ∆ICC 4, 5 V 6, 7 8 9 µA Static current consumption mA ⎯ ⎯ ⎯ ⎯ ⎯ Each bit Output off mode supply voltage 10 ⎯ One input: VIN = 0.5 V Other inputs: VCC or GND See description on next page. 1.5 ⎯ VPOR 3.0 V 4 2006-06-14 TB62801FG Output Low-Level Fixed Mode at Power-On • • • To avoid malfunction at power on, this IC incorporates the following functions: All outputs are fixed to low level until VCC reaches more than 3 V. When VCC reaches 3 V (typ.), internal logic depends on input signals. VCC must be more than 4.7 V for normal operation. Supply voltage Power VCC 3V Output signal waveform GND Additional circuit (P.O.R) test circuit VCC Pulse generator DUT Output signal waveform Low-level state Time AC Characteristics (input transition rise or fall time: tr/tf = 2.5 ns) Normal Temperature/ VCC = 5.0 V Min tpLH (φ/ φ ) tpHL (φ/ φ ) Propagation delay time tpLH (O/ O ) tpHL (O/ O ) Output skew excluding φ, φ outputs Characteristic Symbol Test Condition All Temperatures/ VCC = 4.7 to 5.5 V Min 7.0 6.0 7.0 6.0 2.5 1.5 2.5 1.5 ⎯ Unit Reference Measurement Diagram Typ. 10.0 9.0 10.0 9.0 5.0 4.0 5.0 4.0 ⎯ ⎯ Max 14.0 13.0 14.0 13.0 7.0 6.0 7.0 6.0 2.0 ⎯ Max 16.0 15.0 16.0 15.0 8.0 7.0 8.0 7.0 2.0 ⎯ CL = 450 pF CL = 350 pF CL = 450 pF CL = 350 pF CL = 30 pF CL = 15 pF CL = 30 pF CL = 15 pF CL = 30 pF CL = 300 to 450 pF 7.0 6.0 7.0 6.0 3.0 2.0 3.0 2.0 0 ⎯ ns Measurement diagram 1 ns Measurement diagram 2 to (skw) VT (crs) ns V Measurement diagram 3 Measurement diagram 4 Output crosspoints (φ1/φ2) 1.5 5 2006-06-14 TB62801FG Waveform Measuring Point Propagation Delay Time Setting Input signal • 2B_in • CK_in • SH_in • RS_in • CP_in tri 90% 1.5 V 10% VCC − 0.5 V 90% 1.5 V 10% GND VCC tpHL (O) GND + 0.5 V VCC − 0.5 V tpLH ( O ) GND VCC tfi 3.0 V Measurement Diagram 1 Output signal •φ Output signal •φ tpLH (O) tpHL ( O ) GND + 0.5 V VCC − 0.5 V tpLH (φ1) Measurement Diagram 2 Output signal • 2B_out • CP_out • SH_out • RS_out Output signal • 2B_out GND VCC tpHL (φ1) GND + 0.5 V VCC − 0.5 V tpLH (φ2) GND VCC tpHL (φ2) GND + 0.5 V GND VCC Measurement Diagram 3 Output signal • 2B _ out • 2B_out • CP_out • SH_out • RS_out GND to (skw) to (skw) Output Waveform Crosspoint/Level Setting Measurement Diagram 4 •φ VT (CRS) VOL GND VOH •φ 6 2006-06-14 TB62801FG Reference Data (typ. value) 12 tpLH (φ), tpHL (φ) – CL (characteristics of 1-output, other outputs: no load) 120 Load capacitance versus maximum operating frequency (all bits in operation) VCC = 5.0 V, Ta = 25°C, tri/tfi = 2.5 ns Note: Propagation delay time is in accordance with 11 attached sheet. VCC = 5.0 V, Ta = 25°C, 10 tri/tfi = 2.5 ns (ns) 100 Frequency (MHz) Propagation delay time 9 8 7 6 5 4 50 80 60 40 Note: Maximum operating frequency: Under specified load conditions, the frequency when the pulse width of the output signal matches that of the input signal; or 20 the frequency at which the specified amplitude is obtained. Note that light-load bits are fixed to a capacitance of 30 pF. 0 50 100 150 200 250 300 350 400 450 150 250 350 450 550 650 Capacitance (pF) Capacitance (pF) Frequency versus power dissipation, temperature (@all outputs: maximum load capacitance) 1.4 Power dissipation 1.2 Rise in temperature 1.4 80 100 1.6 PD – Ta Mounted on test board IC only (°C) (W) 1.0 0.8 0.6 0.4 0.2 0.0 0.0E + 0 60 1.2 1.0 Rise in temperature Power dissipation (W) PD 0.8 0.6 0.4 0.2 0.0 0 Note: CL (φ/ φ ) = 450 pF, CL = (O/ O ) = 30 pF Output amplitude = 4.5 V Supply voltage = 5.5 V Mounted on a 50 mm × 50 mm glass-epoxy board 5.0E + 6 1.0E + 7 1.5E + 7 40 20 Note: Test board: 50 mm × 50 mm glass-epoxy board. 25 50 75 100 125 150 0 2.0E + 7 Frequency (Hz) Ta (°C) φ/ φ output IOL – VOL 1.0 Ta = 25°C 0.0 Ta = 25°C VCC = 4.7 V φ/ φ output IOH – VOH (A) (A) High-level output current IOH VCC = 4.7 V 0.8 Low-level output current IOL −0.2 (*) Subtract amplitude voltage with VCC as reference. −0.4 0.6 0.4 −0.6 0.2 −0.8 0.0 0.0 1.0 2.0 3.0 4.0 5.0 −1.0 −5.0 −4.0 −3.0 −2.0 −1.0 0.0 Low-level output voltage VOL (V) High-level output voltage VOH (V) 7 2006-06-14 TB62801FG Test Circuit DC Parameters Pins marked with an asterisk (*) are test pins. Ground the input pins that are not being used as test pins so that their logic is determined. Unless otherwise specified, bits of the same type are measured in the same way. • VIH/VIL (1) Light-load drive bit 1 4.7 V 0 to VCC 16 15 14 13 30 pF E.g., oscilloscope ♦2 ♦3 4 5 6 12 11 10 9 ♦7 ♦8 (2) Heavy-load drive bit 1 4.7 V 2 3 4 16 15 14 13 450 pF E.g., oscilloscope 5 12 11 10 9 ♦6 7 0 to VCC 8 8 2006-06-14 TB62801FG • VIK 1 4.7 V 16 15 14 13 ♦2 ♦3 4 5 12 11 10 9 ♦6 ♦7 ♦8 −30 mA V Note 1: When measuring input pins, connect the input pins that are not being measured to GND. • VOH (O/φ) 1 4.7 V 2 3 4 16 ♦ 15 ♦ 14 ♦ 13 5 6 7 8 12 11 ♦ 10 ♦ 9♦ V O output: −4/−16 mA φ output: −10/−50/−300 mA 9 2006-06-14 TB62801FG • VOH ( O / φ ) ♦1 4.7 V 2 3 4 16 15 14 13 ♦ 5 6 7 8 12 ♦ 11 10 9 V O output: −4/−16 mA φ output: −10/−50/−300 mA • VOL (O/φ) 1 4.7 V 2 3 4 16 ♦ 15 ♦ 14 ♦ 13 4.7 V 5 6 7 8 12 11 ♦ 10 ♦ 9♦ V O output: 4/16 mA φ output: 100 µA/50/300 mA 10 2006-06-14 TB62801FG • VOL ( O / φ ) 4.7 V ♦1 4.7 V 2 3 4 16 15 14 13 ♦ V O output: 4/16 mA φ output: 100 µA/50/300 mA 5 6 7 8 12 ♦ 11 10 9 • IIN 1 5.5 V 16 15 14 13 ♦2 ♦3 4 5.5 V 5 A 12 11 10 9 ♦6 ♦7 ♦8 A Note: When measuring input pins, connect the input pins that are not being measured to GND. 11 2006-06-14 TB62801FG • ICC 5.5 V 3V 1 A 2 3 16 15 14 13 ♦4 ♦5 6 7 8 12 11 10 9 Note 1: The input logic of the heavy-load drive clock input pin (pin 6) is the same for High or Low. • ∆ICC VCC 1 A 2 3 16 15 14 13 ♦4 ♦5 6 0.5 V 7 8 12 11 10 9 Note 2: When measuring input pins, connect the input pins that are not being measured to GND or power. 12 2006-06-14 TB62801FG AC Parameters Pins marked with an asterisk (*) are test pins. Ground the input pins that are not being used as test pins so that their logic is determined. Unless otherwise specified, bits of the same type are measured in the same way. • Propagation Delay Time (1) Light-load drive bit ♦1 2 VCC 0 to 3 V 3 4 16 ♦ 15 ♦ 14 13 15/30 pF E.g., oscilloscope 5 6 7 8 12 11 10 ♦ 9♦ (2) Heavy-load drive bit 1 2 VCC 3 4 16 15 14 ♦ 13 ♦ E.g., oscilloscope 350/450 pF 5 6 0 to 3 V 7 8 12 ♦ 11 ♦ 10 9 13 2006-06-14 TB62801FG • Light-Load Drive Output Skew 30 pF ♦1 2 VCC 0 to 3 V 3 4 16 ♦ 15 ♦ 14 13 30 pF 30 pF E.g., oscilloscope 5 6 7 8 12 11 10 ♦ 9♦ 30 pF 30 pF • Heavy-Load Drive Output Crosspoints 1 2 VCC 3 4 16 15 14 ♦ 13 ♦ CL CL E.g., oscilloscope 5 6 0 to 3 V 7 8 12 ♦ 11 ♦ 10 9 CL CL CL = 300 to 450 pF 14 2006-06-14 TB62801FG Example of an Application Circuit (1) Connection to the TCD1503C Signal output 1 Signal output 2 12 V OS1 SS OD RS φ2B 1 2 3 4 1 22 21 20 19 OS2 SS RS SH φ2B CP NC NC φ20 φ10 6 7 8 9 10 11 TCD1503C 5 18 17 16 15 14 13 CP NC SS φ2E φ1E NC 5000 12 NC 2B_ out Last transfer clock signal input Clamp gate signal input 5V 2B_in CP_in VCC 1 2 3 4 16 15 14 13 2B_out CP_out φ φ GND GND VCC Transfer clock signal input Shift gate signal input Reset gate signal input CK_in SH_in RS_in 5 6 7 8 12 11 10 9 φ φ SH_out RS_out Note: Driving the CCD requires a lot of power. Toshiba recommends using a bypass capacitor connected to the 5 V power supply to stabilize voltage. Precautions on Use This IC does not include built-in protection circuits for excess current or overvoltage. If the IC is subjected to excess current or overvoltage, it may be destroyed. Therefore systems incorporating the IC should be designed with the utmost care. Particular care is necessary in the design of the output, VCC and GND lines since the IC may be destroyed by short circuits between outputs, air contamination faults, or faults due to improper grounding. 15 2006-06-14 TB62801FG (2) Connection to the TCD1703C Signal output 1 Signal output 2 12 V OS1 OD CP RS φ2B φ102 φ202 SS φ201 φ101 NC 1 2 3 4 1 22 21 20 19 OS2 SS CP RS φ2B φ1E2 φ2E2 SS φ2E1 φ1E2 SH 6 7 8 9 10 11 TCD1703C 5 18 17 16 15 14 13 7500 12 2B_ out 1 2 3 4 16 15 14 13 2B_out CP_out φ φ Last transfer clock signal input Clamp gate signal input 5V 2B_in CP_in VCC GND GND VCC Transfer clock signal input Shift gate signal input Reset gate signal input CK_in SH_in RS_in 5 6 7 8 12 11 10 9 φ φ SH_out RS_out 2B_ out 1 2 3 4 16 15 14 13 2B_out CP_out φ φ 2B_in 5V CP_in VCC GND GND VCC CK_in SH_in RS_in 5 6 7 8 12 11 10 9 φ φ SH_out RS_out Note: Driving the CCD requires a lot of power. Toshiba recommends the use of a bypass capacitor connected to the 5 V power supply to stabilize voltage. Two TB62801FGS devices are used in this application: one is used to drive all the control bits and the four transfer clock bits, the other to drive the remaining four transfer clock bits. 16 2006-06-14 TB62801FG Package Dimensions HSOP16-P-300-1.00 Unit: mm W eight: 0.5 g (typ.) 17 2006-06-14 TB62801FG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (2) (3) (4) 18 2006-06-14 TB62801FG (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 19 2006-06-14 TB62801FG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. (2) 20 2006-06-14 TB62801FG About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 021023_D 060116EBA • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C • The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E 21 2006-06-14