Si7958DP
New Product
Vishay Siliconix
Dual N-Channel 40-V (D-S) MOSFET
FEATURES PRODUCT SUMMARY
VDS (V)
40
rDS(on) (W)
0.0165 @ VGS = 10 V 0.020 @ VGS = 4.5 V
ID (A)
11.3 10.3
D TrenchFETr Power MOSFET D New Low Thermal Resistance PowerPAKr D Dual MOSFET for Space Savings
Package
APPLICATIONS
D Automotive* − 12-V Boardnet − Motor Drives − High-Side Switch
*Contact factory for automotive qualification
PowerPAK SO-8
D1
D2
6.15 mm
S1
1 2
G1 S2
5.15 mm
3 4
G2
D1
8 7
G1
D1 D2
G2
6 5
D2
Bottom View Ordering Information: Si7958DP-T1—E3 (Lead Free)
S1 N-Channel MOSFET
S2 N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Source Current (Diode Single Avalanche Current Single Avalanche Energy Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C Conduction)a L = 0.1 mH TA = 25_C TA = 70_C
Symbol
VDS VGS ID IDM IS IAS EAS PD TJ, Tstg
10 secs
40 "20 11.3 9.0 40 2.9 35 61 3.5 2.2
Steady State
Unit
V
7.2 5.8 A 1.2
mJ 1.4 0.9 W _C
−55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Mi ti t A bi t Maximum J Junction-to-Ambienta Maximum Junction-to-Case (Drain) Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 72661 S-32677—Rev. A, 29-Dec-03 www.vishay.com t v 10 sec Steady State Steady State
Symbol
RthJA RthJC
Typical
26 60 2.2
Maximum
35 85 2.7
Unit
_C/W
1
Si7958DP
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain Source Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 40 V, VGS = 0 V VDS = 40 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 11.3 A VGS = 4.5 V, ID = 10.3 A VDS = 15 V, ID = 11.3 A IS = 2.9 A, VGS = 0 V 30 0.013 0.016 30 0.8 1.2 0.0165 0.020 1 3 "100 1 5 V nA mA A W S V
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resostamce Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = 2.9 A, di/dt = 100 A/ms VDD = 20 V, RL = 20 W V, ID ^ 1 A, VGEN = 10 V, Rg = 6 W f = 1 MHz VDS = 20 V, VGS = 10 V, ID = 11.3 A 50 8.8 10.4 1.9 17 17 66 17 31 30 30 100 30 60 ns W 75 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
40 VGS = 10 thru 4 V 32 I D − Drain Current (A) I D − Drain Current (A) 30 40
Transfer Characteristics
24
20
16
8 3V 0 0 1 2 3 4 5 VDS − Drain-to-Source Voltage (V)
10
TC = 125_C 25_C
0 0.0
−55_C 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
VGS − Gate-to-Source Voltage (V) Document Number: 72661 S-32677—Rev. A, 29-Dec-03
www.vishay.com
2
Si7958DP
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
0.030 r DS(on) − On-Resistance ( W ) 0.025 C − Capacitance (pF) 0.020 VGS = 4.5 V 0.015 0.010 0.005 0.000 0.0 VGS = 10 V
Vishay Siliconix
On-Resistance vs. Drain Current
4000 3500 3000 2500 2000 1500 1000 500 0 Coss
Capacitance
Ciss
Crss
8.0
16.0
24.0
32.0
40.0
0
8
16
24
32
40
ID − Drain Current (A)
VDS − Drain-to-Source Voltage (V)
Gate Charge
10 V GS − Gate-to-Source Voltage (V) VDS = 20 V ID = 11.3 A 1.8 1.6 1.4 1.2 1.0 0.8 0.6 −50
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 11.3 A
8
6
4
2
0 0 10 20 30 40 50 Qg − Total Gate Charge (nC)
r DS(on) − On-Resistance (W) (Normalized)
−25
0
25
50
75
100
125
150
TJ − Junction Temperature (_C)
Source-Drain Diode Forward Voltage
40 0.05
On-Resistance vs. Gate-to-Source Voltage
TJ = 150_C 10
r DS(on) − On-Resistance ( W )
0.04 ID = 11.3 A 0.03
I S − Source Current (A)
0.02
TJ = 25_C
0.01
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 VSD − Source-to-Drain Voltage (V) VGS − Gate-to-Source Voltage (V)
Document Number: 72661 S-32677—Rev. A, 29-Dec-03
www.vishay.com
3
Si7958DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.4 0.2 80 −0.0 V GS(th) Variance (V) −0.2 −0.4 −0.6 −0.8 20 −1.0 −1.2 −50 0 0.001 ID = 250 mA Power (W) 60 100
Single Pulse Power
40
−25
0
25
50
75
100
125
150
0.01
0.1
1 Time (sec)
10
100
600
TJ − Temperature (_C)
100
Safe Operating Area, Junction-To-Ambient
rDS(on) Limited IDM Limited P(t) = 0.0001 P(t) = 0.001
10 I D − Drain Current (A)
1
ID(on) Limited
P(t) = 0.01 P(t) = 0.1
0.1
TA = 25_C Single Pulse BVDSS Limited 1 10
P(t) = 1 P(t) = 10 dc
0.01 0.1
100
VDS − Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10−4 10−3 10−2 1 Square Wave Pulse Duration (sec) 10−1
Notes: PDM t1
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 60_C/W 3. TJM − TA = PDMZthJA(t) 4. Surface Mounted
t1 t2
10
100
600
www.vishay.com
4
Document Number: 72661 S-32677—Rev. A, 29-Dec-03
Si7958DP
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
2 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse
Vishay Siliconix
Normalized Effective Transient Thermal Impedance
0.01
10−4
10−3
10−2 Square Wave Pulse Duration (sec)
10−1
1
Document Number: 72661 S-32677—Rev. A, 29-Dec-03
www.vishay.com
5
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