TSML1000_11

TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors High Power Infrared Emitting Diode, RoHS Compliant, 940 nm, GaAlAs/GaAs FEATURES TSML1000 TSML1020 • Package type: surface mount • Package form: GW, RGW, yoke, axial • Dimensions (L x W x H in mm): 2.5 x 2 x 2.7 • Peak wavelength: p = 940 nm • High radiant power • High radiant intensity • Angle of half intensity:  = ± 12° • Low forward voltage • Suitable for high pulse current operation • Good spectral matching with Si photodetectors 16852 TSML1030 TSML1040 • Versatile terminal configurations • Package matches with detector TEMT1000 • Floor life: 168 h, MSL 3, acc. J-STD-020 • Compliant to RoHS Directive 2002/95/EC and in accordance with WEEE 2002/96/EC DESCRIPTION TSML1000 is an infrared, 940 nm emitting diode in GaAlAs/GaAs with high radiant power molded in a clear, untinted plastic package (with lens) for surface mounting (SMD). APPLICATIONS • For remote control • Punched tape readers • Encoder • Photointerrupters PRODUCT SUMMARY COMPONENT TSML1000 TSML1020 TSML1030 TSML1040 Ie (mW/sr) 7 7 7 7  (deg) ± 12 ± 12 ± 12 ± 12 P (nm) 940 940 940 940 tr (ns) 800 800 800 800 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE TSML1000 TSML1020 TSML1030 TSML1040 Note • MOQ: minimum order quantity PACKAGING Tape and reel Tape and reel Tape and reel Bulk REMARKS MOQ: 1000 pcs, 1000 pcs/reel MOQ: 1000 pcs, 1000 pcs/reel MOQ: 1000 pcs, 1000 pcs/reel MOQ: 1000 pcs, 1000 pcs/bulk PACKAGE FORM Reverse gullwing Gullwing Yoke Axial leads Rev. 2.0, 30-Jun-11 1 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81033 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors TEST CONDITION SYMBOL VR IF tp/T = 0.5, tp  100 μs tp = 100 μs IFM IFSM PV Tj Tamb Tstg t5s Soldered on PCB, pad dimensions: 4 mm x 4 mm Tsd RthJA VALUE 5 100 200 1.0 190 100 - 40 to + 85 - 40 to + 100 < 260 400 UNIT V mA mA A mW °C °C °C °C °C ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER Reverse voltage Forward current Peak forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient 200 PV - Power Dissipation (mW) 180 160 140 120 100 80 60 40 20 0 0 16187 120 100 IF - Forward Current (mA) 10 20 30 40 50 60 70 80 90 100 T amb - Ambient Temperature (°C) 16188 80 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of e Angle of half intensity Peak wavelength Spectral bandwidth Temperature coefficient of p Rise time Fall time Virtual source diameter IF = 100 mA IF = 100 mA IF = 100 mA IF = 100 mA IF = 100 mA TEST CONDITION IF = 20 mA, tp = 20 ms IF = 1 A, tp = 100 μs I F = 1 mA VR = 5 V VR = 0 V, f = 1 MHz, E = 0 IF = 20 mA, tp = 20 ms IF = 100 mA, tp = 20 ms IF = 20 mA SYMBOL VF VF TKVF IR Cj Ie e TKe  p  TKp tr tf d 3 25 7 35 - 0.6 ± 12 940 50 0.2 800 800 1.2 15 MIN. TYP. 1.2 2.6 - 1.8 10 MAX. 1.5 UNIT V V mV/K μA pF mW/sr mW %/K deg nm nm nm/K ns ns mm Rev. 2.0, 30-Jun-11 2 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81033 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Vishay Semiconductors 10 000 I F - Forward Current (mA) 0.1 1000 0.2 100 0.5 1.0 1000 0.02 Φ e - Radiant Power (mW) 0.05 tp / T = 0.01 100 10 1 10 0.01 14335 0.10 1.00 10.00 100.00 13602 0.1 10 0 t p - Pulse Duration (ms) 10 1 10 2 10 3 I F - Forward Current (mA) 10 4 Fig. 3 - Pulse Forward Current vs. Pulse Duration Fig. 6 - Radiant Power vs. Forward Current 104 IF - Forward Current (mA) 1.6 103 Ie rel; Φe rel 1.2 IF = 20 mA 0.8 102 tP = 100 µs tP/T = 0.001 101 0.4 100 0 13600 1 2 3 4 0 - 10 0 10 94 7993 50 100 140 VF - Forward Voltage (V) T amb - Ambient Temperature (°C) Fig. 4 - Forward Current vs. Forward Voltage Fig. 7 - Relative Radiant Intensity/Power vs. Ambient Temperature 1000 1.25 Φ rel - Relative Radiant Power e Ie - Radiant Intensity (mW/sr) 100 1.0 0.75 10 0.5 1 0.25 IF = 100 mA 0 890 940 990 0.1 100 16189 101 102 103 104 14291 IF - Forward Current (mA) λ - Wavelength (nm) Fig. 5 - Radiant Intensity vs. Forward Current Fig. 8 - Relative Radiant Power vs. Wavelength Rev. 2.0, 30-Jun-11 3 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81033 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors REFLOW SOLDER PROFILE 10° 20° 30° 260 240 0° Ie rel - Relative Intensity 40° 220 Temperature (°C) 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.2 0.4 0.6 200 180 160 140 120 100 80 60 0 + 5 °C/s - 5 °C/s 60 s to 120 s 5s 18234 20 40 60 80 100 120 140 160 180 200 220 Fig. 9 - Relative Radiant Intensity vs. Angular Displacement 17172 Time (s) PRECAUTIONS FOR USE 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (burn out will happen). 2. Storage 2.1 Storage temperature and rel. humidity conditions are: 5 °C to 35 °C, R.H. 60 %. 2.2 Floor life must not exceed 168 h, acc. to JEDEC level 3, J-STD-020. Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with desiccant. Considering tape life, we suggest to use products within one year from production date. 2.3 If opened more than one week in an atmosphere 5 °C to 35 °C, R.H. 60 %, devices should be treated at 60 °C ± 5 °C for 15 h. 2.4 If humidity indicator in the package shows pink color (normal blue), then devices should be treated with the same conditions as 2.3. Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile 1 °C/s to 5 °C/s Pre-heating 180 °C to 200 °C 260 °C max. 10 s max. 60 s max. above 220 °C 120 s max. 1 °C/s to 5 °C/s 22566 Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020 Rev. 2.0, 30-Jun-11 4 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81033 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com PACKAGE DIMENSIONS in millimeters: TSML1000 Vishay Semiconductors 16159 PACKAGE DIMENSIONS in millimeters: TSML1020 3.8 ± 0.2 Ø 1.9 ± 0.2 0.85 0.15 ± 0.05 0.3 2.5 ± 0.2 2 ± 0.2 1 ± 0.1 1.1 0.5 0.4 4.5 ± 0.1 2.3 ± 0.1 0.75 1.4 2.7 ± 0.2 C A 16160 Rev. 2.0, 30-Jun-11 5 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81033 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com PACKAGE DIMENSIONS in millimeters: TSML1030 Vishay Semiconductors 16228 PACKAGE DIMENSIONS in millimeters: TSML1040 16760 Rev. 2.0, 30-Jun-11 6 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81033 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com REEL DIMENSIONS in millimeters ±0.5 Vishay Semiconductors Unreel direction X .5 16 ±0.2 60.2 2. 5 ±0 178 ±1 Tape position coming out from reel 0. 5 13.2 ±1.5 13 ± X Label posted here Leader and trailer tape: Parts mounted Empty leader (400 mm, min.) Direction of pulling out Empty trailer (200 mm, min.) Drawing-No.: 9.800-5080.01-4 Issue: 3; 11.06.08 18033 TAPING DIMENSIONS in millimeters: TSML1000 3.05 ± 0.1 0.3 Ø 1.55 ± 0.05 4 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 12 ± 0.3 2 ± 0.05 Top tape Anode Push pin through hole Feed direction 4 ± 0.1 Quantity per reel: 1000 pcs or 5000 pcs 18030 Rev. 2.0, 30-Jun-11 7 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81033 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com TAPING DIMENSIONS in millimeters: TSML1020 Vishay Semiconductors 3.05 ± 0.1 0.3 Ø 1.55 ± 0.05 4 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Feed direction 2 ± 0.05 4 ± 0.1 Top tape Anode Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs 18031 TAPING DIMENSIONS in millimeters: TSML1030 3.05 ± 0.1 0.3 Ø 1.55 ± 0.05 4 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Feed direction 2 ± 0.05 4 ± 0.1 18032 Top tape Anode Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs Rev. 2.0, 30-Jun-11 12 ± 0.3 12 ± 0.3 8 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81033 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1