LZP-04MD00-0000

www.osram.us/ledengin LuxiGen Multi-Color Emitter Series LZP RGBW Flat Lens LED Emitter LZP-04MD00 Key Features — Highest flux density surface mount ceramic package RGBW LED with integrated flat glass lens — 6.2mmx6.2mm Light Emitting Area with 80W power dissipation — Ideal for narrow beam applications of less than 10o and light guide coupling — Industry lowest thermal resistance per package footprint (0.5°C/W) — Individually addressable Red, Green, Blue and Daylight White channels — In-source mixing based on smart die positioning for optimum color uniformity — Electrically neutral thermal path — JEDEC Level 1 for Moisture Sensitivity Level — Lead (Pb) free and RoHS compliant — Emitter available on 4-channel MCPCB (optional) Typical Applications — Stage and Studio lighting — Fountain lighting — Accent lighting — Effect lighting COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 1/19 LZP-04MD00 Part number options Base part number Part number Description LZP-04MD00-xxxx LZP RGBW flat lens emitter LZP-L4MD00-xxxx LZP RGBW flat lens emitter on 4 channel Star MCPCB Bin kit option codes MD, Red-Green-Blue-White (6500K) Kit number suffix Min flus bin Color bin range Description 0000 20R R01 Red, full distribution flux; full distribution wavelength 22G G2 – G3 Green, full distribution flux; full distribution wavelength 23B B03 Blue, full distribution flux; full distribution wavelength 10W W65 White full distribution flux and CCT COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 2/19 LZP-04MD00 Daylight White Chromaticity Groups 0.40 0.39 0.38 0.37 0.36 CIEy 0.35 0.34 0.33 W65 0.32 0.31 0.30 Planckian Locus 0.29 0.28 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 CIEx Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram. Coordinates are listed below Daylight White Bin Coordinates Bin Code W65 CIEx CIEy 0.3227 0.329 0.315 0.3427 0.306 0.3258 0.3147 0.3123 0.3227 0.329 COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 3/19 LZP-04MD00 Luminous Flux Bins Table 1: Bin Code 6 Red 360 20R Minimum Maximum Luminous Flux (ΦV) Luminous Flux (ΦV) @ IF = 700mA [1] @ IF = 700mA [1] (lm) (lm) 6 Green 22G 6 Blue 7 White 6 Red 625 6 Green 600 23B 6 Blue 7 White 1000 130 10W 210 1120 1785 Notes for Table 1: 1. Luminous flux performance is measured at 10ms pulse, T c = 25°C; with all LED dice with the same color connected in series. LED Engin maintains a tolerance of ±10% on flux measurements. Dominant Wavelength Bins Table 2: Bin Code Minimum Maximum Dominant Wavelength (λD) @ IF = 700mA [1] Dominant Wavelength (λD) @ IF = 700mA [1] (nm) (nm) Red R01 Green Blue 617 Red Green Blue 630 G2 520 G3 525 B03 525 530 453 460 Notes for Table 2: 1. Dominant wavelength is measured at 10ms pulse, T C = 25°C. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements . Forward Voltage Bins Table 3: Bin Code 0 Minimum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 6 Red 6 Green 6 Blue 7 White 12.6 19.2 16.8 19.6 Maximum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 6 Red 6 Green 6 Blue 7 White 17.4 25.2 22.8 26.6 Notes for Table 3: 1. Forward voltage is measured at 10ms pulse, TC = 25°C with all LED dice with the same color connected in series. 2. LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements for 6 LEDs and ± 0.28V for 7 LEDs. COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 4/19 LZP-04MD00 Absolute Maximum Ratings Table 4: Parameter DC Forward Current Symbol Value Unit [1] IF 1000 mA IFP 1500 mA Reverse Voltage VR See Note 3 V Storage Temperature Tstg -40 ~ +150 °C Junction Temperature [Blue, Green, White] TJ 150 °C Junction Temperature [Red] TJ 125 °C Soldering Temperature [4] Tsol 260 °C Peak Pulsed Forward Current [2] Notes for Table 4: 1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating. 2. Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-04MD00 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Parameter Symbol Luminous Flux (@ IF = 700mA) Luminous Flux (@ IF = 1000mA) ΦV ΦV Dominant Wavelength Correlated Color Temperature Color Rendering Index (CRI) λD CCT Ra [2] Viewing Angle Total Included Angle [3] Typical 6 Red 460 640 6 Green 820 1060 6 Blue [1] 190 250 623 523 457 7 White 1470 1900 6500 75 2Θ½ Θ0.9 120 160 Unit lm lm nm K Degrees Degrees Notes for Table 5: 1. When operating the Blue LED, observe IEC 62471 Risk Group 2 rating. Do not stare into the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total luminous flux. COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 5/19 LZP-04MD00 Electrical Characteristics @ TC = 25°C Table 6: Parameter Typical Symbol 6 Green 6 Blue 7 White VF 15.0 21.6 19.2 22.4 V VF 16.2 22.4 19.9 23.3 V ΔVF/ΔTJ -13.3 -17.4 -12.0 -12.0 mV/°C [1] Forward Voltage (@ IF = 700mA) Forward Voltage (@ IF = 1000mA) [1] Temperature Coefficient of Forward Voltage Unit 6 Red Thermal Resistance RΘJ-C (Junction to Case) 0.5 °C/W Notes for Table 6: 1. Forward Voltage typical value is for all LED dice from the same color dice connected in series. IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20 MSL Classification : Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 60% RH 168 85°C/ 60% RH n/a n/a +5/-0 Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term HTOL testing, LED Engin projects that the LZP Series will deliver, on average, above 70% Lumen Maintenance at 20,000 hours of operation at a forward current of 700mA. This projection is based on constant current operation with junction temperature maintained at or below 120°C for LZP product. COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 6/19 LZP-04MD00 Mechanical Dimensions (mm) Pin Out Ch. Pad Die Color Function 18 B Red Anode I Red na K Red na R Red na T Red na 2 U Red Cathode 17 E Green Anode F Green na H Green na O Green na Q Green na 3 X Green Cathode 15 A Blue Anode C Blue na J Blue na L Blue na S Blue na 5 V Blue Cathode 14 D CW Anode G CW na M CW na N CW na P CW na W CW na Y CW Cathode 1 2 Figure 1: Package outline drawing 3 Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal slug is electrically isolated. 3. Ts is a thermal reference point. 4 6 DNC pins: 1,4,7,8,9,10,11,12,13,16,19,20,21,22,23,24. Note: DNC = Do Not Connect (Electrically Non Isolated) COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 7/19 LZP-04MD00 Recommended Solder Pad Layout (mm) Figure 2a: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad Notes for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. LED Engin recommends the use of copper core MCPCB’s which allow for the emitter thermal slug to be soldered directly to the copper core (so called pedestal design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress.. Recommended Solder Mask Layout (mm) Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 8/19 LZP-04MD00 Recommended 8 mil Stencil Apertures Layout (mm) Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 9/19 LZP-04MD00 Typical Radiation Pattern 100% 90% 80% Relative Intensity 70% 60% 50% 40% 30% 20% 10% 0% -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 Angular Displacement (Degrees) 40 50 60 70 80 90 Figure 4: Typical representative spatial radiation pattern Typical Relative Spectral Power Distribution 1.00 0.90 Relative Spectral Power 0.80 0.70 Red 0.60 Green 0.50 Blue 0.40 White 0.30 0.20 0.10 0.00 400 450 500 550 600 650 Wavelength (nm) 700 750 800 Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 10/19 LZP-04MD00 Typical Forward Current Characteristics 1200 1000 IF - Forward Current (mA) Red Green 800 Blue White 600 400 200 0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 Vf (V) Figure 6: Typical forward current vs. forward voltage @ TC = 25°C Typical Relative Light Output over Current 160% 140% Relative Light Output 120% 100% 80% Red 60% Green 40% Blue/White 20% 0% 0 200 400 600 800 1000 1200 IF - Forward Current (mA) Figure 7: Typical relative light output vs. forward current @ TC = 25°C COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 11/19 LZP-04MD00 Typical Relative Light Output over Temperature 140% 120% Relative Light Output 100% 80% 60% 40% Red Green 20% Blue White 0% 0 20 40 60 Case Temperature (oC) 80 100 120 Figure 8: Typical relative light output vs. case temperature Typical Dominant Wavelength/Chromaticity Coordinate Shift over Current 8.00 Dominant Wavelength Shift (nm) 6.00 Red Green 4.00 Blue 2.00 0.00 -2.00 -4.00 0 200 400 600 800 1000 1200 IF - Forward Current (mA) Figure 9a: Typical dominant wavelength shift vs. forward current @ TC = 25°C COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 12/19 LZP-04MD00 0.0100 0.0080 Delta_Cx, Delta_Cy 0.0060 0.0040 White - Delta_Cx White - Delta_Cy 0.0020 0.0000 -0.0020 -0.0040 -0.0060 -0.0080 -0.0100 0 200 400 600 800 IF - Forward Current (mA) 1000 1200 Figure 9b: Typical chromaticity coordinate shift vs. forward current @ TC = 25°C Typical Dominant Wavelength/Chromaticity Coordinate Shift over Temperature 6.00 Dominant Wavelength Shift (nm) 5.00 4.00 3.00 2.00 1.00 Red 0.00 Green Blue -1.00 -2.00 -3.00 0 20 40 60 80 100 120 Case Temperature (oC) Figure 10a: Typical dominant wavelength shift vs. case temperature COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 13/19 LZP-04MD00 0.0020 0.0000 White - Delta_Cx Delta_Cx, Delta_Cy -0.0020 White - Delta_Cy -0.0040 -0.0060 -0.0080 -0.0100 -0.0120 0 20 40 60 Case Temperature (oC) 80 100 120 Figure 10b: Typical chromaticity coordinate shift vs. case temperature Current De-rating 1200 IF - Forward Current (mA) 1000 800 600 RΘ JA = 0.8°C/W RΘ JA = 1.0°C/W 400 RΘ JA = 1.2°C/W 200 0 0 25 50 75 100 125 TA - Ambient Temperature (°C) Figure 11: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C Notes for Figure 11: 1. Maximum current assumes that all 25 LED dies are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for LZP-04MD00 is typically 0.5°C/W . 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘ J-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 14/19 LZP-04MD00 LZP MCPCB Option Part number Type of MCPCB Dimension Emitter + MCPCB Typical VF Typical IF (mm) Thermal Resistance (V) (mA) 15.0-22.4 4 x 700 (°C/W) LZP-Lxxxxx 4-channel 28.3 COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. 0.5 + 0.1 = 0.6 LZP-04MD00 (Rev 3.0 – 2/20/2020) p 15/19 LZP-04MD00 LZP-Lxxxxx 4-Channel MCPCB Mechanical Dimensions (mm) Notes: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Slots in MCPCB are for M3 or #4-40 mounting screws. 3. The thermal resistance of the MCPCB is: RΘC-B 0.1°C/W. Components used MCPCB: MHE-301 copper (Rayben) ESD chips: BZX884-B39 (NXP, for 6-7 LED dies in series) NTC: NCP15XH103F03RC (Murata) Ch. 1 (Red) 2 (Green) 3 (Blue) 4 (White) NTC Pad layout MCPCB String/die Pad 8 1/ BIKRTU 1 7 2 6 3 5 4 1-RT 2-RT 2/ EFHOQX 3/ ACJLSV 4/ DGMNPWY 10kohm NTC Function Anode + Cathode Anode + Cathode Anode + Cathode Anode + Cathode NTCA NTCB COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 16/19 LZP-04MD00 Application Guidelines MCPCB Assembly Recommendations A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances, increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low. When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For applications where the heat sink temperature can be above 50°C, it is recommended to use high temperature and rigid plastic washers, such as polycarbonate or glass-filled nylon. LED Engin recommends the use of the following thermal interface materials: — Bergquist’s Gap Pad 5000S35, 0.020in thick — Part Number: Gap Pad® 5000S35 0.020in/0.508mm — Thickness: 0.020in/0.508mm — Thermal conductivity: 5 W/m-K — Continuous use max temperature: 200°C — Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) — 3M’s Acrylic Interface Pad 5590H — Part number: 5590H @ 0.5mm — Thickness: 0.020in/0.508mm — Thermal conductivity: 3 W/m-K — Continuous use max temperature: 100°C — Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 17/19 LZP-04MD00 Mechanical Mounting Considerations The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies. LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB: — Inspect MCPCB and heat sink for flatness and smoothness. — Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting method (thermal interface materials, screws, and washer). — Always use three M3 or #4-40 screws with #4 washers. — When fastening the three screws, it is recommended to tighten the screws in multiple small steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a single step. — Always use plastic washers in combinations with the three screws. This avoids high point contact stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular. — In designs with non-tapped holes using self-tapping screws, it is common practice to follow a method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the appropriate torque is reached. Wire Soldering — To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150°C. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. — It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 18/19 LZP-04MD00 About LED Engin LED Engin, an OSRAM brand based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented compact TM ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. LED Engin office: 651 River Oaks Parkway San Jose, CA 95134 USA 408 922-7200 LEDE-Sales@osram.com www.osram.us/ledengin COPYRIGHT © 2020 LED ENGIN. ALL RIGHTS RESERVED. LZP-04MD00 (Rev 3.0 – 2/20/2020) p 19/19