BYG20D M2G

BYG20D – BYG20J Taiwan Semiconductor 1.5A, 200V - 600V High Efficient Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Fast switching for high efficiency High surge current capability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS ● ● ● ● ● PARAMETER VALUE UNIT IF 1.5 A VRRM 200 - 600 V IFSM 30 A TJ MAX 150 °C Package DO-214AC (SMA) Configuration Single die DC to DC converter Switching mode converters and inverters Lighting application Snubber Freewheeling application MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AC (SMA) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.064g (approximately) DO-214AC (SMA) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device BYG20D BYG20G BYG20J BYG20D BYG20G BYG20J UNIT Repetitive peak reverse voltage VRRM 200 400 600 V Reverse voltage, total rms value VR(RMS) 140 280 420 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Pulse energy in avalanche mode, non-repetitive (Inductive load switch off ), L = 120mH Junction temperature Storage temperature IF 1.5 A IFSM 30 A ERSM 20 mJ TJ - 55 to +150 °C TSTG - 55 to +150 °C 1 Version: F2102 BYG20D – BYG20J Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 25 °C/W Junction-to-ambient thermal resistance RӨJA 100 °C/W Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS IF = 1.0A, TJ = 25°C (1) Reverse current @ rated VR IF = 1.5A, TJ = 25°C (2) Reverse recovery time TJ = 25°C TJ = 100°C IF = 0.5A, IR = 1.0A, Irr = 0.25A SYMBOL VF IR trr TYP MAX UNIT - 1.3 V - 1.4 V - 1 µA - 10 µA - 75 ns Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING BYG20x DO-214AC (SMA) 7,500 / Tape & Reel Notes: 1. “x” defines voltage from 200V(BYG20D) to 600V(BYG20J) 2 Version: F2102 BYG20D – BYG20J Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 175 150 1.5 CAPACITANCE (pF) 1 0.5 125 100 75 50 25 0 f=1.0MHz Vsig=50mVp-p 0 25 50 75 100 125 150 0.1 1 LEAD TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) TJ=125°C 0.1 0.01 TJ=25°C 0.001 20 30 40 50 60 70 80 90 100 10 10 UF1DLW 1 TJ=125°C TJ=25°C 1 0.1 0.01 Pulse width 300μs 1% duty cycle Pulse width 0.1 0.001 0.8 0.9 1.0 1.1 1.2 1.3 1.4 0.3 0.4 0.5 0.6 0.7 0.8 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 1.5 0.9 1.6 1 1.1 FORWARD VOLTAGE (V) Fig.5 Maximum Non-Repetitive Forward Surge Current 40 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.4 Typical Forward Characteristics 10 10 100 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 1 10 (A) AVERAGE FORWARD CURRENT (A) 2 8.3ms single half sine wave 30 20 10 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: F2102 1.2 BYG20D – BYG20J Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: F2102 BYG20D – BYG20J Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AC (SMA) SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: F2102 BYG20D – BYG20J Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: F2102