1N4148WT
SOD-523 Plastic-Encapsulate Diodes
FEATURES
SOD-523
Small Package
Low Reverse Current
Fast Switching Speed
Surface Mount Package Ideally Suited for Automatic Insertion
T4
Symbol
Parameter
Non-Repetitive Peak Reverse Voltage
VR
Reverse Voltage
Peak Repetitive Reverse Voltage
VRWM
Working Peak Reverse Voltage
S
RMS Reverse Voltage
em
VRRM
ic
VRM
VR(RMS)
on
MAXIMUM RATINGS ( Ta=25℃ unless otherwise noted )
du
The marking bar indicates the cathode
Solid dot = Green molding compound device,if none,the normal device.
ct
or
MARKING:T4
Value
Unit
100
V
75
V
53
V
Average Rectified Output Current
150
mA
IFM
Forward Continuous Current
300
mA
IFSM
Non-repetitive Peak Forward Surge Current@t= 8.3ms
2
A
Power Dissipation
150
mW
Thermal Resistance from Junction to Ambient
833
℃/W
Tj
Junction Temperature
150
℃
Tstg
Storage Temperature
-55~+150
℃
PD
JS
MI
RΘJA
CR
O
IO
ELECTRICAL CHARACTERISTICS(Ta=25℃ unless otherwise specified)
Parameter
Symbol
Reverse voltage
V(BR)
Reverse current
IR
Forward voltage
Total capacitance
Reverse recovery time
Test conditions
IR=1μA
trr
Typ
Max
75
Unit
V
VR=75V
1
µA
VR=20V
25
nA
IF=1mA
0.715
V
IF=10mA
0.855
V
IF=50mA
1
V
IF=150mA
1.25
V
VR=0V,f=1MHz
2
pF
IF= IR =10mA, Irr=0.1*IR,RL=100Ω
4
ns
VF
Ctot
Min
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1N4148WT
SOD-523 Plastic-Encapsulate Diodes
Forward
Characteristics
Reverse
1000
200
Characteristics
100
0.1
0.01
0.0
or
1
100
Ta=25℃
10
ct
REVERSE CURRENT IR
T=
a 2
5℃
FORWARD CURRENT
IF
T=
a 1
00
℃
10
1
0.2
0.4
0.6
VF
1.0
1.2
0
(V)
20
40
REVERSE VOLTAGE
60
VR
80
(V)
Capacitance Characteristics
em
POWER DISSIPATION
S
CR
O
1.0
0.9
JS
MI
CAPACITANCE BETWEEN TERMINALS
CT (pF)
f=1MHz
0.8
0
5
150
100
50
0
10
REVERSE VOLTAGE
(mW)
Ta=25℃
1.1
Power Derating Curve
200
PD
1.2
ic
on
FORWARD VOLTAGE
0.8
du
(nA)
(mA)
Ta=100℃
15
VR
20
(V)
0
25
50
75
AMBIENT TEMPERATURE
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100
Ta
125
150
(℃ )
第2/3页
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SOD-523 Plastic-Encapsulate Diodes
JS
MI
CR
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SOD-523 Suggested Pad Layout
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第3/3页
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